`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`
`UNITED STATES DEPARTMENT OF COMMERCE
`United States Patent and Trademark Office
`Address: COMMISSIONER FOR PATENTS
`P.O. Box 1450
`Alexandria, Virginia 22313-1450
`www.uspto.gov
`
`APPLICATION NO.
`
`
`
`
` FILING DATE
`
`
`FIRST NAMED INVENTOR
`
`ATTORNEY DOCKET NO.
`
`
`
`
`CONFIRMATIONNO.
`
`
`12/407,056
`
`03/19/2009
`
`Yuuichi Takenaka
`
`1497.49788X00
`
`6601
`
`20457
`
`7590
`
`12/11/2012
`
`ANTONELLI, TERRY,STOUT & KRAUS, LLP
`1300 NORTH SEVENTEENTH STREET
`SUITE 1800
`ARLINGTON,VA 22209-3873
`
`NGUYEN,SANG V
`
`2871
`
`MAIL DATE
`
`12/11/2012
`
`DELIVERY MODE
`
`PAPER
`
`Please find below and/or attached an Office communication concerning this application or proceeding.
`
`The time period for reply, if any, is set in the attached communication.
`
`PTOL-90A (Rev. 04/07)
`
`

`

`
`Application No.
`Applicant(s)
`
`Office Action Summary
`
`
` 12/407,056 TAKENAKAET AL.
`Examiner
`Art Unit
`SANG V. NGUYEN
`2871
`
`-- The MAILING DATEof this communication appears on the cover sheet with the correspondence address --
`Period for Reply
`
`A SHORTENED STATUTORY PERIOD FOR REPLYIS SET TO EXPIRE 3 MONTH(S) OR THIRTY(30) DAYS,
`WHICHEVER IS LONGER, FROM THE MAILING DATE OF THIS COMMUNICATION.
`Extensions of time may be available under the provisions of 37 CFR 1.136(a).
`In no event, however, may a reply be timely filed
`after SIX (6) MONTHS from the mailing date of this communication.
`If NO period for reply is specified above, the maximum statutory period will apply and will expire SIX (6) MONTHS from the mailing date of this communication.
`-
`- Failure to reply within the set or extended period for reply will, by statute, cause the application to become ABANDONED (35 U.S.C. § 133).
`Anyreply received by the Office later than three months after the mailing date of this communication, evenif timely filed, may reduce any
`earned patent term adjustment. See 37 CFR 1.704(b).
`
`Status
`
`1)X] Responsive to communication(s)filed on 31 October 2012.
`2a)X] This action is FINAL.
`2b) This action is non-final.
`3)L]
`Anelection was made bythe applicant in responseto a restriction requirementset forth during the interview on
`___; the restriction requirement and election have beenincorporated into this action.
`4)L] Sincethis application is in condition for allowance except for formal matters, prosecution as to the merits is
`closed in accordance with the practice under Ex parte Quayle, 1935 C.D. 11, 453 O.G. 213.
`
`Disposition of Claims
`5)X] Claim(s) 1-5,7-13,15 and 16 is/are pending in the application.
`
`5a) Of the above claim(s)
`is/are withdrawn from consideration.
`6)L] Claim(s) __is/are allowed.
`
`7) Claim(s) 1-5,7-13,15 and 16 is/are rejected.
`8)L] Claim(s) ____ is/are objected to.
`
`9)L] Claim(s)
`are subject to restriction and/or election requirement.
`
`* If any claims have been determined allowable, you may beeligible to benefit from the Patent Prosecution Highway
`program ata participating intellectual property office for the corresponding application. For more information, please see
`http/www.usoto.qov/patents/init events/pph/index isp or send an inquiry to PPHfeedback@uspto.qov.
`
`Application Papers
`
`10)L] The specification is objected to by the Examiner.
`
`11) The drawing(s)filed on
`is/are: a)[_] accepted or b)[_] objected to by the Examiner.
`Applicant may not request that any objection to the drawing(s) be held in abeyance. See 37 CFR 1.85(a).
`
`Replacement drawing sheet(s) including the correction is required if the drawing(s) is objected to. See 37 CFR 1.121(d).
`
`Priority under 35 U.S.C. § 119
`
`12)] Acknowledgmentis made of a claim for foreign priority under 35 U.S.C. § 119(a)-(d) or (f).
`a)XJ All b)L] Some*c)L] None of:
`
`1.X] Certified copiesof the priority documents have been received.
`2.L] Certified copies of the priority documents have been received in Application No.
`3.L] Copiesof the certified copies of the priority documents have been received in this National Stage
`application from the International Bureau (PCT Rule 17.2(a)).
`* See the attached detailed Office action for a list of the certified copies not received.
`
`
`
`Attachment(s)
`1) x Notice of References Cited (PTO-892)
`
`2) CT] Information Disclosure Statement(s) (PTO/SB/08)
`Paper No(s)/Mail Date
`U.S. Patent and Trademark Office
`PTOL-326 (Rev. 09-12)
`
`3) | Interview Summary (PTO-413)
`Paper No(s)/Mail Date.
`4) Cc] Other:
`
`Office Action Summary
`
`Part of Paper No./Mail Date 20121206
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 2
`
`DETAILED ACTION
`
`Response to Amendment
`
`1.
`
`Receipt is acknowledged of amendmentfiled Oct. 31, 2012. Claim | has been
`
`amended, claims 6 and 14 has been cancelled.
`
`Currently Claims 1-5, 7-13, 15 and 16 are pendingin this application.
`
`This Action is made Final.
`
`Claim Rejections - 35 USC § 103
`
`The following is a quotation of 35 U.S.C. 103(a) which formsthe basis for all
`
`obviousnessrejections set forth in this Office action:
`
`(a) A patent may not be obtained though the inventionis not identically disclosed or described asset
`forth in section 102 ofthistitle, if the differences between the subject matter sought to be patented and
`the prior art are such that the subject matter as a whole would have been obvious at the time the
`invention was madeto a person having ordinary skill in the art to which said subject matter pertains.
`Patentability shall not be negatived by the manner in which the invention was made.
`
`2.
`
`Claims 1-5 , 8, 13 and 15 are rejected under 35 U.S.C. 103(a) as being
`
`unpatentable over Park US 2008/0024714 in views of Kang US 2008/0174731 and
`
`further in view of Tsurufusa US 2006/0187643.
`
`Claim1: Park discloses a liquid crystal display device, comprising:
`
`e
`
`e
`
`(Fig. 1) [0048] a liquid crystal display panel 120;
`
`aplurality of flexible wiring boards 200 (flexible film package) connected to said
`
`liquid crystal display panel 120;
`
`
`
`e (Fig. 1)afirst drive circuit 250 and a second drive circuit 250 (driver IC) [0063]
`
`provided onsaid flexible wiring boards 200 or said liquid crystal display panel
`
`120;
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 3
`
`(Figs. 1, 4) a printed circuit board 124 [0049] having wires 231 [0067] for
`
`transmitting an external signal to said first drive circuit and 250 second drive
`
`circuit 250 and connectedto said flexible wiring boards 200 [0070];
`
`(Fig. 5, 7) said printed circuit board 124 faces an upper frame member110 (Fig. 7
`
`shows PCB 124, driver IC 350 and TFTsubstrate are aligned continuously, and
`
`Fig. 5 shows they are facing top chassis 110)
`
`(Fig. 2) said upper frame member110 (top chassis) being made of a metal
`
`(conductive metal) [0041] which covers an outer periphery portion of said liquid
`
`crystal display panel and said printed circuit board;
`
`(Figs. 1, 7) characterized in that said printed circuit board 124 is a member which
`
`is separate from said flexible wiring boards 200; and
`
`(Fig. 5) at least one heat conducting member 113a, 113b is provided on the
`
`surface of said printed circuit board 370 (flexible printed circuit board) having
`
`said at least one semiconductor device 350 which faces said upper frame member
`
`110 (top chassis) mounted thereon [0085] - Examiner’s note: Park teaches the
`
`heat dissipation techniques applied to a flexible printed circuit board.It is
`
`obvious that Park’s teaching is applicable to many types ofprinted circuit boards
`
`including a hard PCB ora flexible PCB.
`
`except
`
`at least one semiconductor device including a power supply circuit mounted on a
`
`surface of said printed circuit board which faces an upper frame member
`
`said at least one semiconductor device is a member whichis separate from said
`
`first drive circuit and said second drive circuit;
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 4
`
`oO
`
`oO
`
`said at least one semiconductor device includes a powersupply circuit andis
`
`configured to generate powerforat least one of said first drive circuit and said
`
`seconddrive circuit
`
`said at least one semiconductor device including said power supply circuit has a
`
`heat releasing terminal for conducting heat to said printed circuit board; and
`
`said heat releasing terminal makes contact with said at least one heat conducting
`
`member.
`
`however Kangetal. teach
`
`(Fig. 1) [0048] at least one semiconductor device including a power supply circuit
`
`325 (power supply unit) mounted on a surface of printed circuit board 320 (PCB)
`
`which faces an upper frame member(Park’s top chassis 110)
`
`said at least one semiconductor device 325 is a member which is separate from
`
`said first drive circuit 310 (data driver ICs) and said second drive circuit 410 (gate
`
`driver ICs) [0048];
`
`(Fig. 2) said at least one semiconductor device includes a powersupply circuit
`
`325 (powersupply unit) and is configured to generate powerfor at least one of
`
`said first drive circuit 310 and said second drive circuit 410 (via power supply line
`
`500)
`
`and Tsurufusa teaches
`
`(Fig. 6) [0028] a semiconductor device 32 (LSI semiconductor) including said
`
`powersupply circuit (Kang’s powersupply circuit) has a heat releasing terminal
`
`34/35 (heat sink and shield case) for conducting heat to said printed circuit board
`
`31 (PCB) [0043]; and
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 5
`
`e
`
`the heat releasing terminal 34/35 makes contact with said at least one heat
`
`conducting member 34d/34e [0043].
`
`Park teaches the claimed invention except for a power supply semiconductor
`
`mounted in the PCB, and the heat releasing terminal making contact with the heat
`
`conducting member. Kangetal. teach it is knownin the art to have a power supply
`
`semiconductor mounted in the PCB to supply powerto the driver ICs and other elements;
`
`and Tsurufusa further teaches the feature of a heat releasing terminal makes contact with
`
`a heat conducting memberis knownin the art. It would have been obviousto one skilled
`
`in the art to modify Park’s invention with Kang's power supply IC mounted on the PCB
`
`to supply powerto driver ICs and other elements to run the circuitry, as taught by Kang et
`
`al. [0008]; and with Tsurufusa’s heat releasing structure to gain advantages of providing a
`
`heat dissipating structure plus better EMI shielding to the circuit board, as taught by
`
`Tsurufusa [0028].
`
`Park US 2008/0024714 - Fig. 5
`
`Tide 11de
`
`980 360 370 \ 381
`
`+10
`
`'
`
`borate
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 6
`
`Park US 2008/0024714-Fig. 7
`
`Tsurufusa US 2006/0187643 - Fig. 6
`
`heat conducting member 34d/34e
`
`38
`
`fc Wa
`35i
`su Me
`yf
`(
`st 34g
`heat ohneabledAEL |
`We Ses Py RD
`4
`NG N. Na Nest Nd
`Vy wate
`305EERoc
`y
`Ptereepennrerenpilpamnlynone =
`|
`3B 34
`
`®
`Semiconductordevice 32
`
`31
`printed circuit board 31
`
`
`
`(combinationofheatsinkana
`
`shield case)
`
`Claim 2: Park in views of Kang/Tsurufusa teaches the claimed limitation above
`
`Park further teaches
`
`e
`
`[0040] the liquid crystal display device has a backlight unit (131, 132, 133, 134)
`
`provided on the rear of said liquid crystal display panel, and
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 7
`
`(Fig. 5, 7) said printed circuit board 124 is provided betweena side portion of said
`
`backlight unit (131, 132, 133, 134) and said upper frame member110 (Fig. 7
`
`shows PCB 124, driver IC 350 and TFTsubstrate are aligned continuously on
`
`one side, and Fig. 5 shows they are facing top chassis 110)
`
`Claim 3: Park in views of Kang/Tsurufusa teaches the claimed limitation above
`
`Park further teaches
`
`(Fig. 5) said at least one heat conducting member 113a, 113b hasat least one
`
`opening therein
`
`said at least one opening being delimited by at least one wall of said at least one
`
`heat conductive member 113a, 113b surrounding said at least one opening, a
`
`surface of said printed circuit board (124, 370) at one end of said at least one
`
`opening, and a surface of said upper frame member110 (top chassis) at an
`
`opposite end of said at least one opening,
`
`(Fig. 5) the surface of said printed circuit board (124, 370) is facing upper frame
`
`member 110 (top chassis) and in said at least one opening of said at least one heat
`
`conducting member 113a, 113b
`
`except
`
`said at least one semiconductor device including said power supply circuit is
`
`mounted on the surface of said printed circuit board facing said upper frame
`
`memberandin said at least one opening ofsaid at least one heat conducting
`
`member.
`
`However Kangetal. teach
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 8
`
`e
`
`(Figs. 1, 2) [0048] at least one semiconductor device 325 (power supply unit)
`
`including said power supply circuit is mounted on the surface of said printed
`
`circuit board 320 facing said upper frame member(Park’s top chassis 110) and in
`
`said at least one opening ofsaid at least one heat conducting member (Parks’
`
`opening of heat conducting member 113a, 113b).
`
`It would have been obviousto oneskilled in the art to modify Park’s invention, in
`
`views of Kang/Tsurufusa, with Kang's power supply IC from the PCB to supply power to
`
`driver ICs on a flexible circuit board to keep the circuitry operational, as taught by Kang
`
`et al. [0008].
`
`Claim4: Park in views of Kang/Tsurufusa teaches the claimed limitation above
`
`Park further teaches
`
`e
`
`said at least one heat conducting member113a, 113b is provided proximate to of
`
`said at least one semiconductor device (Kang’s powersupply unit 325) including
`
`said power supply circuit that is mounted on the surface of said printed circuit
`
`board facing said upper frame member110.
`
`All elements are knownin the art at the time of the invention. Park teaches a PCB
`
`facing an upper frame member. Kanget al. teach a power supply unit mounted on a PCB.
`
`It would have been obviousto one skilled in the art to modify Park’s invention, in views
`
`of Kang/Tsurufusa, with Kang's power supply IC from the PCB to supply powerto driver
`
`ICs on a flexible circuit board to keep the circuitry operational, as taught by Kanget al.
`
`[0008].
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 9
`
`Claim5: Park in views of Kang/Tsurufusa teaches the claimed limitation above
`
`Park further teaches
`
`e
`
`(Fig. 5) one or moresaid at least one heat conducting members 113a, 113b are
`
`memberis provided in a number corresponding to the numberandthe locations of
`
`said semiconductor devices (Kang’s powersupply unit 325).
`
`Kanget al. further teaches
`
`e
`
`aplurality number of semiconductor devices including power supply circuits 325
`
`(powersupply unit) are mounted on the surface of said printed circuit board
`
`facing said upper frame member (Park’s top chassis 110).
`
`All elements are knownin the art at the time of the invention. Park teaches a PCB
`
`facing an upper frame member. Kanget al. teach a power supply unit mounted on a PCB.
`
`It would have been obviousto one skilled in the art to modify Park’s invention, in views
`
`of Kang/Tsurufusa, with Kang's power supply IC from the PCB to supply powerto driver
`
`ICs on a flexible circuit board making the circuitry operational, as taught by Kangetal.
`
`[0008].
`
`Claim8: Park in views of Kang/Tsurufusa teaches the claimed limitation above
`
`Park further teaches in views of Kang/Tsurufusa
`
`e
`
`(Fig. 5) said first drive circuit and said second drive circuit 350 (element 250 in
`
`Fig. 1) are integrated circuit parts in chip form (driver ICs), respectively, and
`
`mounted on said flexible wiring boards 370.
`
`Claims 13: Park in views of Kang/Tsurufusa teaches the claimed limitation above
`
`

`

`Application/Control Number: 12/407,056
`
`Page 10
`
`Art Unit: 2871
`
`Park further teach
`
`e
`
`(Fig. 5) said at least one semiconductor device 350 ( or Kang’s powersupply unit
`
`325) is located between oneof at least two portions of said at least one heat
`
`conducting member and twoofsaid at least one heat conducting member (113a,
`
`113b).
`
`Claim 15: Park in views of Kang/Tsurufusa teaches the claimed limitation above
`
`Park further teach
`
`e
`
`(Fig. 5) at least one semiconductor device 350 (or Kang’s power supply unit 325)
`
`is mounted between said two of said at least one heat conducting member 113a,
`
`113b.
`
`3.
`
`Claim 7 is rejected under 35 U.S.C. 103(a) as being unpatentable over Park
`
`US 2008/0024714 in views of Kang US 2008/0174731 and Tsurufusa US
`
`2006/0187643 as applied to Claim 1 above, and further in view of Sagagaet al. US
`
`2008/0062348.
`
`Claim7: Park in views of Kang/Tsurufusa teaches the claimed limitation above
`
`except
`
`said first drive circuit is a drive circuit for sending a video signalto said liquid
`
`crystal display panel, and said semiconductor device includesa transistor of said
`
`powersupply circuit for generating a powerapplied to said first drive circuit.
`
`However, Sagugaet al. teach
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 11
`
`e=[0054, 0057] (Fig. 1) first drive circuit CHI is a drive circuit for sending a video
`
`signal DL to said liquid crystal display panel PNL, and
`
`e
`
`said semiconductor device SUP includesa transistor of said power supply circuit
`
`(Yamazaki’s power supply IC 108, see Fig. | and [0048]) for generating a power
`
`applied to said first drive circuit CHI.
`
`It would have been obviousto oneskilled in the art to modify Park’s invention, in
`
`views of Kang/Tsurufusa, with Saguga's video and powercircuits delivering video
`
`signals to the LCD panelto gain the advantage of providing better contrast particularly in
`
`a color liquid crystal display device, as taught by Sasuga [0005].
`
`4,
`
`Claims 9-12 are rejected under 35 U.S.C. 103(a) as being unpatentable
`
`over Park US 2008/0024714 in views of Kang US 2008/0174731 and Tsurufusa US
`
`2006/0187643 as applied to Claim 1 above, and further in view of Suzuki US
`
`2005/0024573.
`
`Claims 9-12: Park in views of Kang/Tsurufusa teaches the claimed limitation above
`
`except
`
`o
`
`said at least one heat conducting memberis formed ofan elastic body (Claim 9)
`
`othe height of said at least one heat conducting memberfrom the surface of said
`
`printed circuit board having said at least one semiconductor device including said
`
`powersupply circuit mounted therein which faces said upper frame memberis
`
`greater than the height of said at least one semiconductor device from the surface
`
`facing said upper frame member(Claim 10)
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 12
`
`oO
`
`the area of the surface of said at least one heat conducting member which makes
`
`contact with said printed circuit board andthe surface of said at least one heat
`
`conducting member which makescontact with said upper frame memberis
`
`greater than the area of the region occupied by said at least one semiconductor
`
`device including said power supply circuit on said printed circuit board (Claim
`
`11)
`
`the surface of the printed circuit board having said at least one semiconductor
`
`device including said power supply circuit mounted thereon faces an inner surface
`
`of said upper frame member, the outer surface of said upper frame memberfacing
`
`away from said liquid crystal display panel (Claim 12)
`
`however Suzuki teaches
`
`said at least one heat conducting member25 is formed of an elastic body
`
`(conductive plastic) [0051] (Claim 9)
`
`(Fig. 9) the height of said at least one heat conducting member from the surface of
`
`said printed circuit board 15a having said at least one semiconductor device 14
`
`including said power supply circuit (Yamazaki’s power supply IC 108, see Fig. 1
`
`and [0048]) mounted therein which faces said upper frame member2ais greater
`
`than the height of said at least one semiconductor device 14 from the surface 15a
`
`facing said upper frame member2a (Claim 10)
`
`the area of the surface of said at least one heat conducting member 25 which
`
`makes contact with said printed circuit board 15a and the surface of said at least
`
`one heat conducting member 25 which makescontact with said upper frame
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 13
`
`member2ais greater than the area of the region occupiedbysaid at least one
`
`semiconductor device 14 including said power supply circuit (Yamazaki’s power
`
`supply IC 108, see Fig. 1 and [0048]) on said printed circuit board 15a (Fig. 9)
`
`(Claim 11)
`
`e
`
`(Fig. 9) the surface of the printed circuit board 15a havingsaid at least one
`
`semiconductor device 14 including said power supply circuit (Kang ’s power
`
`supply 325) mounted thereon faces an inner surface of said upper frame member
`
`2a, the outer surface of said upper frame member2a facing away from said liquid
`
`crystal display panel 3 (Claim 12)
`
`It would have been obviousto oneskilled in the art to modify Park’s invention, in
`
`views of Kang/Tsurufusa, with Suzuki's heat conducting member(electrically conductive
`
`plastic) to gain the advantage of providing heat dissipation to the liquid crystal display
`
`device.
`
`5.
`
`Claim 16 is_rejected under 35 U.S.C. 103(a) as being unpatentable over Park
`
`US 2008/0024714 in views of Kang US 2008/0174731 and Tsurufusa US
`
`2006/0187643 as applied to Claim 1 above, and further in view of Fukusanoet al. US
`
`2007/0188692.
`
`Claim 16: Park in views of Kang/Tsurufusa teaches the claimed limitation above
`
`except
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 14
`
`at least one heat conducting memberhavingsaid at least one opening therein in
`
`which said at least one semiconductor device is mounted hasportions thereof
`
`surrounding said at least one semiconductor device
`
`however Fukusanoet al. teach
`
`e
`
`(Fig. 2) heat conducting member 4 havingsaid at least one opening 10 therein in
`
`whichsaid at least one semiconductor device 3 (Fig. 1) is mounted has portions
`
`thereof surrounding said at least one semiconductor device 3 [0031]
`
`It would have been obviousto oneskilled in the art to modify Park’s invention, in
`
`views of Kang/Tsurufusa, with Fukusano's heat conducting member surrounding the
`
`semiconductive device to gain the advantage of providing a driver module structure that
`
`improvesthe shielding effect while maintaining the heat radiation effect, as taught by
`
`Fukusano etal. [0018].
`
`Response to Arguments
`
`7.
`
`Applicant's arguments with respect to Claim 1 have been fully considered but are
`
`mootin view of the new ground(s)of rejection.
`
`Conclusion
`
`Applicant's amendment necessitated the new ground(s) of rejection presented in
`
`this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP
`
`§ 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37
`
`CFR 1.136(a).
`
`

`

`Application/Control Number: 12/407,056
`
`Art Unit: 2871
`
`Page 15
`
`A shortenedstatutory period for reply to this final action is set to expire THREE
`
`MONTHSfrom the mailing date of this action. In the eventafirst reply is filed within
`
`TWO MONTHSof the mailing date of this final action and the advisory action is not
`
`mailed until after the end of the THREE-MONTHshortenedstatutory period, then the
`
`shortened statutory period will expire on the date the advisory action is mailed, and any
`
`extension fee pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the
`
`advisory action. In no event, however, will the statutory period for reply expire later than
`
`SIX MONTHSfrom the date of this final action.
`
`Any inquiry concerning this communication or earlier communications from the
`
`examiner should be directed to SANG NGUYENwhosetelephone numberis (571)270-
`
`3421. The examiner can normally be reached on 7:00AM - 4:30PM.
`
`If attempts to reach the examiner by telephone are unsuccessful, the examiner’s
`
`supervisor, Ed Glick can be reached on (571) 272-2490. The fax phone numberfor the
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`organization where this application or proceeding is assigned is 571-273-8300.
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`Information regarding the status of an application may be obtained from the
`Patent Application Information Retrieval (PAIR) system. Status information for
`published applications may be obtained from either Private PAIR or Public PAIR. Status
`information for unpublished applications is available through Private PAIR only. For
`more information about the PAIR system,see http://pair-direct.uspto.gov. Should you
`have questions on access to the Private PAIR system, contact the Electronic Business
`Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO
`Customer Service Representative or access to the automated information system,call
`800-786-9199 (IN USA OR CANADA)or 571-272-1000.
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`/Nguyen, Sang V/
`Examiner, Art Unit 2871
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`/Edward J Glick/
`Supervisory Patent Examiner, Art Unit 2871
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