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`PATENT
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`What is Claimed:
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`1.
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`A light emitting chip comprising:
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`a light emission structure comprising:
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`a p-type semiconductor layer,
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`an n-type semiconductor layer, and
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`an active layer between the p-type semiconductor layer and the n-type
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`semiconductor layer; and
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`at least one light emitting unit comprising:
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`a light emitting diode (LED) portion formed from the light emission
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`structure, and
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`a plurality of light receiving diode (LRD) portions formed from the light
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`emission structure, the plurality of LRD portions serially connected and
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`configured to surround the LED portion, the plurality of LRD portions optically
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`coupled to the LED portion to receive total internal reflection (TIR) light from the
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`LED portion and configured to convert the TIR light to a photocurrent.
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`2.
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`The light emitting chip according to claim 1, wherein the plurality of LRD
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`portions are electrically connected in parallel with the LED portion.
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`3.
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`The light emitting chip according to claim 1, wherein the at least one light
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`emitting unit includes a further LED portion formed from the light emission structure, and
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`the plurality of LRD portions are electrically connected in parallel with the further
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`LED portion.
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`4.
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`The light emitting chip according to claim 1, wherein the at least one light
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`emitting unit including a plurality of light emitting units arranged to form an LED array.
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`5.
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`The light emitting chip according to claim 1, wherein the light emission
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`structure is configured to emit light via the p-type semiconductor layer.
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`MATB-435US
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`PATENT
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`6.
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`The light emitting chip according to claim 1, wherein the light emission
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`structure is configured to emit light via the n-type semiconductor layer.
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`7.
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`The light emitting chip according to claim 1, wherein the active layer
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`includes a single quantum well (SQW) structure or a multi quantum well (MQW) structure.
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`8.
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`The light emitting chip according to claim 1, wherein the at least one light
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`emitting unit includes:
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`an electrode layer formed on one of the p-type semiconductor layer and the n-
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`type semiconductor layer, the electrode layer being substantially transparent to light having
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`a predetermined wavelength,
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`a first electrode coupled to the n-type semiconductor layer, and
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`a second electrode coupled to the p—type semiconductor layer.
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`9.
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`The light emitting chip according to claim 1, wherein the active layer is
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`formed from a semiconductor material including at least one of InmAlnGa1.m-nN (where
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`O<msl, Osnsl, O<m+nsl) or IanamN (where O<m<1).
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`10.
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`The light emitting chip according to claim 1, wherein the p—type
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`semiconductor layer and the n—type semiconductor layer are formed from a semiconductor
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`material including at least one of AlmGa1-mN (where Osmsl), ZnSe, InGaN, GaP, AlGaInP,
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`AlGaP, GaAsP or AlGaAs.
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`11.
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`A light emitting unit cell comprising:
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`a first light emitting diode (LED) electrically connected to a power source;
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`a plurality of light receiving diodes (LRDs) connected in series, the plurality of
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`LRDs optically coupled to the first LED to receive total internal reflection (TIR) light from the
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`first LED and configured to convert the TIR light to a photocurrent; and
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`a second LED electrically connected in parallel with the plurality of LRDs.
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`MATB—435US
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`PATENT
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`12.
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`The light emitting unit cell according to claim 11, wherein the
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`photocurrent is applied to the second LED as a further power source.
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`13.
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`The light emitting unit cell according to claim 11, wherein a cathode of
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`one of the plurality of LRDs is electrically connected to a cathode of the first LED.
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`14.
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`The light emitting unit cell according to claim 11, wherein each of the
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`plurality of LRDs is configured to receive the TIR light without emitting light.
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`15.
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`The light emitting unit cell according to claim 11, further comprising:
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`a further plurality of LRDS optically coupled to the second LED to receive further
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`TIR light from the second LED and to convert the further TIR light to a further photocurrent;
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`and
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`a third LED electrically connected in parallel with the further plurality of LRDs.
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`16.
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`A light emitting unit cell comprising:
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`a light emitting diode (LED) electrically connected to a power source; and
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`a plurality of light receiving diodes (LRDs) connected in series, the plurality of
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`LRDs optically coupled to the LED to receive total internal reflection (TIR) light from the LED
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`and configured to convert the TIR light to a photocurrent,
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`wherein the plurality of LRDs are electrically coupled to the LED to feed back the
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`photocurrent to the LED.
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`17.
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`The light emitting unit cell according to claim 16, wherein each of the
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`plurality of LRDs is configured to receive the TIR light without emitting light.
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`18.
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`The light emitting unit cell according to claim 16, wherein the plurality of
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`LRDs are electrically connected in parallel with the LED.
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`19.
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`A method of forming a light emitting chip, the method comprising:
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`MATB-435US
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`PATENT
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`forming a light emission structure including a p-type semiconductor layer, an n-
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`type semiconductor layer and an active layer between the p-type semiconductor layer and
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`the n-type semiconductor layer; and
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`forming at least one light emitting unit from the light emission structure
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`including:
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`forming a light emitting diode (LED) portion, and
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`forming a plurality of light receiving diode (LRD) portions to surround the
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`LED portion, the plurality of LRD portions being serially connected to each other
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`and optically coupled to the LED portion,
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`wherein the plurality of LRD portions receive total internal reflection (TIR) light
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`from the LED portion and convert the TIR light to a photocurrent.
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`20.
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`The method according to claim 19, the forming of the light emission
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`structure including:
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`forming an electrode layer on one of the p-type semiconductor layer and the n—
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`type semiconductor layer, the electrode layer being substantially transparent to light having
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`a predetermined wavelength,
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`forming a first electrode to be electrically coupled to the n-type semiconductor
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`layer, and
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`layer.
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`forming a second electrode to be electrically coupled to the p-type semiconductor
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`21.
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`The method according to claim 19, wherein the plurality of LRD portions
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`are formed to be electrically connected in parallel with the LED portion.
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`22.
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`The method according to claim 19, the forming of the at least one light
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`emitting unit including:
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`forming a further LED portion, and
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`PATENT
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`forming the plurality of LRD portions to be electrically connected in parallel with
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`the further LED portion.
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`23.
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`The method according to claim 19, wherein the at least one light emitting
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`unit includes a plurality of light emitting units and the light emitting chip is formed to
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`including the plurality of light emitting units arranged as an LED array.
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