Redlined Substitute Specification
`Application No. 13/605,856
`Attorney Docket No. 730256.401
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`SOLID PREPARATION PACKAGING APPARATUS
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`BACKGROUND OF THE INVENTION
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`1. Field of the Invention
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`[0001]
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`The present invention relates to a solid preparation packaging apparatus which
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`is installed, for example, in hospitals or dispensing pharmacies in order to charge
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`packaging sheets or bottles with solid preparations specified in a prescription (hereinafter,
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`the solid preparation will be referred to all the solidified preparations such as medical
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`tablets, capsules, pills, and troches).
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`2. Description of the Related Art
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`[0002]
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`Conventionally, in hospitals and the like, solid preparation packaging
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`apparatuses are used to separately wrap a dose (the amount to be taken at a time) of
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`multiple types of medical tablets or capsules (which will be referred to as solid
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`preparations) prescribed by the physician for each patient and then provide the dose to the
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`patient (see Patent Literature 1).
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`[0003]
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`This solid preparation packaging apparatus 1 is configured such that a solid
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`preparation accommodating unit 3 with a number of vertically-elongated prism-shaped
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`tablet cases 6 disposed in an array so as to accommodate solid preparations by type is
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`located at an upper portion, and a discharge and count unit which fimctions to discharge
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`and count the accommodated solid preparations is included under each of the tablet cases 6.
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`Below the solid preparation accommodating unit 3, there is disposed a transfer mechanism
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`10 which is made up of a hopper and a conveyor. The transfer mechanism 10 receives the
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`solid preparations discharged from the tablet cases 6 and guides the solid preparations to
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`the charging port formed by the lower hopper member so that the solid preparations are
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`collected to one place. Below the transfer mechanism 10, there is disposed a solid
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`preparation packaging mechanism 14, which separately packs (referred to as separate
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`wrapping) a dose (the amount to be taken at a time) of solid preparations collected to the
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`charging port of the lower hopper member.
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`[0004]
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`In the solid preparation packaging apparatus 1, with various types of solid
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`preparations stored by type in the tablet cases 6, the operator inputs prescription data based
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`on a prescription at an input unit such as a personal computer electrically connected to the
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`solid preparation packaging apparatus 1 and then starts the solid preparation packaging
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`apparatus 1. The controller of the solid preparation packaging apparatus 1 is then operated
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`to actuate the discharge and count unit for a predetermined tablet case 6; a dose (the
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`amount to be taken at a time) of solid preparations is discharged; and the solid preparations
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`collected by the transfer mechanism 10 into the lower hopper member are introduced into
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`the solid preparation packaging mechanism 14. In the solid preparation packaging
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`mechanism 14, a pouch for the amount to be taken at a time is formed by a heat-sealing
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`mechanism from a sequentially transferred packaging sheet 20, and then a dose (the
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`amount to be taken at a time) of solid preparations collected into the lower hopper member
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`is separately wrapped by being accommodated and then sealed in one pouch.
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`[Citation List]
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`[Patent Literature]
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`[0005]
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`[Patent Literature 1] Japanese Patent Application Laid-Open No. Hei. 10-
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`l l 8 15 9
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`[0006]
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`In the solid preparation packaging apparatus 1 which operates in this manner,
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`the printing mechanism prints required information such as the timing of taking the dose
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`and the name of the patient on each pouch. Accordingly, the controller incorporated into
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`the solid preparation packaging apparatus 1 includes various types of electronic circuit
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`boards on which formed are electronic circuits for exchanging information with the input
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`unit as well as for controlling the discharge and count unit of the solid preparation
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`accommodating unit 3, the conveyor of the transfer mechanism 10, the feed mechanism for
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`the packaging sheet 20 in the solid preparation packaging mechanism 14, the heat-sealing
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`mechanism, the printing mechanism and the like. The electronic circuit boards mainly
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`include a central processing unit circuit board (also referred to as the CPU circuit board)
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`for exchanging information with the input unit and for providing collective control to the
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`solid preparation packaging apparatus 1, and a printing circuit board for the printing
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`mechanism. Furthermore, the solid preparation packaging apparatus 1 also includes a
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`power supply for supplying power to these circuit boards, power to the motor of the
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`conveyor of the transfer mechanism 10, power to the motor of the feed mechanism for the
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`packaging sheet 20 in the solid preparation packaging mechanism 14, and power to the
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`driving portion and the heater of the heat-sealing mechanism.
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`[0007]
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`Like the solid preparation packaging apparatus 1 disclosed in Patent
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`Document 1, the main body may include the solid preparation accommodating unit 3
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`disposed at an upper portion, the transfer mechanism 10 disposed below the solid
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`preparation accommodating unit 3, and the solid preparation packaging mechanism 14
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`disposed below the transfer mechanism 10. In this case, by taking the ease of loading solid
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`preparations into the tablet cases 6 into account, the solid preparation accommodating unit
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`3 at the upper stage is capable of being pulled out or pushed back in the back-and-forth
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`direction, while by taking inspection and repair into account, the transfer mechanism 10
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`and the solid preparation packaging mechanism 14 at the lower stages are capable of being
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`simultaneously pulled out or pushed back in the back-and-forth direction. In this case, the
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`printing circuit board and the power supply are accommodated near the solid preparation
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`packaging mechanism 14 at a lower stage; however, the central processing unit circuit
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`board is a fairly large flat plate, and thus by taking heat radiation into account, disposed
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`vertically on the outer surface of the rear wall of the solid preparation packaging apparatus
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`1.
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`[0008]
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`It is thus difficult to inspect or repair the solid preparation accommodating
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`unit 3, the transfer mechanism 10, and the solid preparation packaging mechanism 14. In
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`particular, it is cumbersome to incorporate, inspect, repair, or replace the wiring to each
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`circuit board and the wiring to the power supply in the solid preparation packaging
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`apparatus. Furthermore, since the central processing unit circuit board is disposed on the
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`outer surface of the rear wall of the solid preparation packaging apparatus 1, the circuit
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`board has to be covered with a cover in order to prevent the human body from touching the
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`circuit board or dust particles from being adhered thereto. This leads to an increase in
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`costs.
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`SUMMARY OF THE INVENTION
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`[0009]
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`In view of these problems, the present invention provides a solid preparation
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`packaging apparatus which facilitates the inspection and repair of the solid preparation
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`accommodating unit, the transfer mechanism, and the solid preparation packaging
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`mechanism as well as facilitates the incorporation, inspection, repair, and replacement of
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`the wiring to each circuit board and the wiring to the power supply. Accordingly, since the
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`fairly large flat central processing unit circuit board is disposed inside the solid preparation
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`packaging apparatus, the technique of the present invention is configured to provide the
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`solid preparation packaging apparatus at the lowest portion thereof with an electrical
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`component chamber where the central processing unit circuit board and the power supply
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`are accommodated, thereby facilitating the incorporation, inspection, repair, and
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`replacement of the wiring to the central processing unit circuit board and the power supply.
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`Furthermore, the provision of the electrical component chamber at the lowest portion of the
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`solid preparation packaging apparatus makes it possible to provide a lowered center of
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`gravity to the solid preparation packaging apparatus and thereby an improved effect of
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`preventing the solid preparation packaging apparatus from being toppled over when the
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`solid preparation accommodating unit, the transfer mechanism, and the solid preparation
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`packaging mechanism are configured to be capable of being pulled out or pushed back in
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`the back-and-forth direction.
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`[0010]
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`Furthermore, in order that the solid preparation packaging apparatus which is
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`operated with a voltage of 100 volt in Japan can also be used abroad or operated with a
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`voltage higher than 100 volt (for example, at 120 volt), the power supply is additionally
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`provided with a transformer as one component. For example, since the transformer to be
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`employed to step down 120 volt to 100 volt is generally 5 to 6kg in weight, the transformer
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`can be placed at the center of the rear portion in the electrical component chamber. When
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`this weight is used for the solid preparation accommodating unit, the transfer mechanism,
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`and the solid preparation packaging mechanism to be capable of being pulled out or pushed
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`back in the back-and-forth direction, the technique provides an effect of preventing the
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`solid preparation packaging apparatus from being toppled over.
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`[001 l]
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`The solid preparation accommodating unit, the transfer mechanism, and the
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`solid preparation packaging mechanism are configured to be capable of being pulled out or
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`pushed back in the back-and-forth direction. In this case, when these components are
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`drawn out or the number of tablet cases in the solid preparation accommodating unit
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`increases, the solid preparation packaging apparatus would tend to be more easily
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`unbalanced, causing concerns to rise over the danger of the apparatus being toppled over
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`with the solid preparation accommodating unit kept drawn out. Accordingly, when the
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`solid preparation packaging apparatus is used in Japan, a dedicated balance weight may be
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`included. In this case, this balance weight leads to increase in costs because the weight is
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`specially made and requires mounting holes to be provided on the mounting flanges. In
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`this context, attention is focused on the fact that the aforementioned transformer for
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`general-purpose use, which is comparatively inexpensive, can be employed at low costs as
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`the balance weight. With a prediction that the solid preparation packaging apparatus
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`should be able to be used in a given higher-voltage region as described above, the
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`aforementioned transformer is incorporated into the solid preparation packaging apparatus
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`being produced. When the solid preparation packaging apparatus is used in Japan, the
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`wiring will detour around the transformer, which acts only as the balance weight, thereby
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`providing, at low costs, the effect of preventing the apparatus from being toppled over. On
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`the other hand, in the case when the solid preparation packaging apparatus is used abroad
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`where a transformer must be used, the solid preparation packaging apparatus into which the
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`transformer is incorporated can be exported. Thus, the technique of the present invention
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`makes it possible to make the solid preparation packaging apparatus available abroad as
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`well as in Japan and implement at low costs the effect of preventing the apparatus from
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`being toppled over.
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`[0012]
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`Furthermore, the solid preparation packaging apparatus is additionally
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`provided at the lowest portion thereof with the electrical component chamber where the
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`central processing unit circuit board and the power supply are accommodated. In this case,
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`the technique of the present invention makes the inventive solid preparation packaging
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`apparatus greater in height than a conventional solid preparation packaging apparatus,
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`thereby facilitating the incorporation, inspection, repair, and replacement of the wiring
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`associated with the central processing unit circuit board and the power supply.
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`Furthermore, the technique also makes it possible to provide the solid preparation
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`packaging apparatus with a lowered center of gravity and thereby an improved effect of
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`preventing the apparatus from being toppled over when the solid preparation
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`accommodating unit, the transfer mechanism, and the solid preparation packaging
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`mechanism are configured to be capable of being pulled out or pushed back in the back-
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`and-forth direction.
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`[0013]
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`Furthermore, the specific solid preparation supply unit may be disposed on the
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`upper surface of the solid preparation packaging apparatus so that specific solid
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`preparations are loaded from above into the buckets of the specific solid preparation supply
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`unit. In this case, the solid preparation packaging apparatus provided by the present
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`invention makes the inventive solid preparation packaging apparatus greater in height than
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`a conventional solid preparation packaging apparatus so as to facilitate the loading of the
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`specific solid preparations from above into the buckets.
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`[0014]
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`Furthermore, treating foreign characters other than Japanese characters and
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`English letters as text data would require high costs for creating and processing the data. In
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`order to solve this problem, the present invention provides a solid preparation packaging
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`apparatus which can treat the text data as image data for printing and which includes a
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`specific character printing circuit board, for providing control to printing, in the electrical
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`component chamber at the lowest portion of the apparatus, thereby facilitating the
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`mounting of the circuit board and the wiring to the circuit board.
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`[0015]
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`A first aspect of the present invention relates to a solid preparation packaging
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`apparatus, in a main body of which a solid preparation accommodating unit having a
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`plurality of tablet cases disposed in an array is disposed at an upper portion, each of the
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`tablet cases accommodating solid preparations by type, the solid preparation
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`accommodating unit having a discharge mechanism for discharging the accommodated
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`solid preparations; a transfer mechanism unit for receiving the solid preparations
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`discharged from the tablet cases and collecting the solid preparations into a charging port is
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`disposed below the solid preparation accommodating unit; and a solid preparation
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`packaging mechanism unit for forming a pouch on a strip of packaging sheet and for
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`charging each pouch with the solid preparations collected in the charging port and sealing
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`the pouch is disposed below the transfer mechanism unit. The solid preparation packaging
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`apparatus is configured such that
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`the solid preparation accommodating unit, the transfer mechanism unit, and
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`the solid preparation packaging mechanism unit are each individually accommodated in the
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`main body so as to be capable of being pulled out or pushed back in the back-and-forth
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`direction;
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`the solid preparation packaging mechanism unit includes a printing
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`mechanism unit for printing on the pouch;
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`the main body is provided with an electrical component chamber below the
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`solid preparation packaging mechanism;
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`the electrical component chamber is provided with a central processing unit
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`circuit board (also referred to as a CPU circuit board) for providing collective control to the
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`solid preparation packaging apparatus, and a power supply for supplying power to the solid
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`preparation accommodating unit, the transfer mechanism unit, and the solid preparation
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`packaging mechanism unit; and
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`a flexible wiring cover which is continually curved as the solid preparation
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`packaging mechanism unit is pulled out of or pushed back into the main body is mounted
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`across the electrical component chamber and the solid preparation packaging mechanism
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`unit in order to pass, through the flexible wiring cover, the wiring of the solid preparation
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`packaging mechanism unit to the central processing unit circuit board and the power
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`supply.
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`[0016]
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`A second aspect of the present invention relates to a solid preparation
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`packaging apparatus, in a main body of which a solid preparation accommodating unit
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`having a plurality of tablet cases disposed in an array is disposed at an upper portion, each
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`of the tablet cases accommodating solid preparations by type, the solid preparation
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`accommodating unit having a discharge mechanism for discharging the accommodated
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`solid preparations; a transfer mechanism unit for receiving the solid preparations
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`discharged from the tablet cases and collecting the solid preparations into a charging port is
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`disposed below the solid preparation accommodating unit; and a solid preparation
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`packaging mechanism unit for forming a pouch on a strip of packaging sheet and for
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`charging each pouch with the solid preparations collected in the charging port and sealing
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`the pouch is disposed below the transfer mechanism unit. The solid preparation packaging
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`apparatus is configured such that
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`the solid preparation accommodating unit, the transfer mechanism unit, and
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`the solid preparation packaging mechanism unit are each individually accommodated in the
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`main body so as to be capable of being pulled out or pushed back in the back-and-forth
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`direction;
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`the solid preparation packaging mechanism unit includes a printing
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`mechanism unit for printing on the pouch;
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`the main body is provided with an electrical component chamber below the
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`solid preparation packaging mechanism;
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`the electrical component chamber is provided with a central processing unit
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`circuit board (also referred to as a CPU circuit board) for providing collective control to the
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`solid preparation packaging apparatus, and a power supply for supplying power to the solid
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`preparation accommodating unit, the transfer mechanism unit, and the solid preparation
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`packaging mechanism unit, the electrical component chamber being further provided with
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`an image printing circuit board required for the printing mechanism unit to print based on
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`image data; and
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`a flexible wiring cover which is continually curved as the solid preparation
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`packaging mechanism unit is pulled out of or pushed back into the main body is mounted
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`across the electrical component chamber and the solid preparation packaging mechanism
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`unit in order to pass, through the flexible wiring cover, the wiring of the solid preparation
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`packaging mechanism unit to the central processing unit circuit board, the image printing
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`circuit board, and the power supply.
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`[0017]
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`A third aspect of the present invention relates to the solid preparation
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`packaging apparatus according to the first and second aspects of the invention, wherein the
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`printing circuit board of the printing mechanism unit is disposed at the solid preparation
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`packaging mechanism unit.
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`[0018]
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`A fourth aspect of the present invention relates to the solid preparation
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`packaging apparatus according to any one of the first to third aspects of the invention,
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`wherein a step-down transformer is provided as a component of the power supply, and the
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`transformer is mounted at a weight balance position at the center of a rear portion in the
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`electrical component chamber.
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`[0019]
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`A fifth aspect of the present invention relates to the solid preparation
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`packaging apparatus according to any one of the first to fourth aspects of the invention,
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`wherein
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`the main body is provided at a top front portion thereof with a specific solid
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`preparation supply unit for supplying, to the transfer mechanism unit, specif1c solid
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`preparations accommodated in a plurality of buckets each having an upper opening,
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`on a top surface region of the main body behind the specific solid preparation
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`supply unit, a flat surface is formed to place thereon an input unit such as a personal
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`computer for transmitting and receiving information to/from the central processing unit
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`circuit board; and
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`a flat-shaped lid to cover the buckets can be removably placed on the specific
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`solid preparation supply unit.
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`Advantageous Effects of the Invention
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`[0020]
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`According to the first aspect of the present invention, the solid preparation
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`accommodating unit, the transfer mechanism, and the solid preparation packaging
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`mechanism can be each individually configured to be pulled out or pushed back in the
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`back-and-forth direction, and can be thus inspected and repaired with ease. Furthermore,
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`the solid preparation accommodating unit, the transfer mechanism, and the solid
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`preparation packaging mechanism are each individually capable of being pulled out or
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`pushed back in the back-and-forth direction. Additionally, the main body of the solid
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`preparation packaging apparatus is provided at the lowest portion thereof with the electrical
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`component chamber, where the central processing unit circuit board and the power supply
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`are accommodated. Accordingly, when compared with a conventional solid preparation
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`packaging apparatus which has the central processing unit circuit board disposed on the
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`10
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`outer surface of the rear wall thereof, the central processing unit circuit board provided
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`inside the main body of the solid preparation packaging apparatus eliminates the need for
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`covering the same with a special cover in order to prevent the circuit board from being
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`touched by the human body or prevent dust particles from being adhered to the circuit
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`board. This makes it possible to cut costs as compared with the aforementioned
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`conventional one.
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`[0021]
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`Furthermore, the main body is provided at the lowest portion thereof with the
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`electrical component chamber, where the central processing unit circuit board and the
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`power supply are accommodated. When compared with the conventional one, this
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`structure facilitates the incorporation, inspection, repair, and replacement of the wiring to
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`the central processing unit circuit board and the power supply. Furthermore, the provision
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`of the electrical component chamber at the lowest portion of the solid preparation
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`packaging apparatus makes it possible to provide a lowered center of gravity to the solid
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`preparation packaging apparatus. This structure can provide an improved effect of
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`preventing the solid preparation packaging apparatus from being toppled over when the
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`solid preparation accommodating unit, the transfer mechanism, and the solid preparation
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`packaging mechanism are configured to be capable of being pulled out or pushed back in
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`the back-and-forth direction.
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`[0022]
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`Furthermore, the flexible wiring cover which is continually curved as the solid
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`preparation packaging mechanism unit is pulled out or pushed back is mounted across the
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`electrical component chamber and the solid preparation packaging mechanism unit. This
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`structure allows, as a matter of course, the solid preparation packaging mechanism unit to
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`be smoothly pulled out or pushed back while the wiring is protected. Additionally, in this
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`structure, the electrical wiring from the electrical component chamber at the lowest portion
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`to the solid preparation packaging mechanism unit disposed above the same can be
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`inspected and repaired with ease because the flexible wiring cover portion can be visually
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`checked with the solid preparation packaging mechanism unit kept drawn out.
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`[0023]
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`According to the second aspect of the present invention, the electrical
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`component chamber is provided, in addition to the central processing unit circuit board and
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`the power supply, with the image printing circuit board required for the printing
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`mechanism unit to print based on image data. The flexible wiring cover mounted across
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`the electrical component chamber and the solid preparation packaging mechanism unit is
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`configured such that the wiring of the solid preparation accommodating unit, the transfer
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`mechanism unit, and the solid preparation packaging mechanism unit is passed through the
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`flexible wiring cover to the central processing unit circuit board, the image printing circuit
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`board, and the power supply. This structure, including the wiring from the electrical
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`component chamber to the image printing circuit board, can provide the same effects as
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`those of the aforementioned first aspect of the invention.
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`[0024]
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`According to the third aspect of the present invention, the printing mechanism
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`unit and the printing circuit board are provided in conjunction with the solid preparation
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`packaging mechanism unit, whereby the wiring for connecting between the printing
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`mechanism unit and the printing circuit board can be reduced in length. Furthermore, the
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`printing circuit board and the central processing unit circuit board can be laid through the
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`flexible wiring cover, whereby the same effects as those of the aforementioned first aspect
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`of the invention can be provided.
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`[0025]
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`According to the fourth aspect of the present invention, in order that the solid
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`preparation packaging apparatus which is operated with a voltage of 100 volt in Japan can
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`also be used abroad or operated with a voltage higher than 100 volt (for example, at 120
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`volt), the power supply is additionally provided with a transformer as one component. In
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`this case, for example, a transformer for general-purpose use which is to step down 120
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`volt to 100 volt is typically 5 to 6 kg in weight. Accordingly, the transformer can be
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`incorporated into the solid preparation packaging apparatus in advance so that the user can
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`choose whether to use the apparatus in Japan or abroad. It is thus possible to preferably
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`prevent the solid preparation packaging apparatus from being toppled over, without a
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`costly special balance weight.
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`[0026]
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`Concerning the fifth aspect of the present invention, while the main body is
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`provided on the top front portion thereof with the specific solid preparation supply unit for
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`accommodating specific solid preparations in the buckets and supplying the specific solid
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`preparations to the transfer mechanism unit, information including information on the
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`specific solid preparations accommodated in the buckets may be transmitted/received using
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`an input unit such as a personal computer to/from the central processing unit circuit board.
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`In this case, manipulating this input unit placed on a desk or the like installed near the solid
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`preparation packaging apparatus would require the place for the desk and is inconvenient.
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`Accordingly, to allow the input unit to be used on the solid preparation packaging
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`apparatus, a flat area for placement of the input unit is formed on the top surface region of
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`the main body behind the specific solid preparation supply unit. On the other hand, the
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`buckets of the specific solid preparation supply unit have to be covered with a lid for
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`hygienic reasons. Conventionally, since this lid was of an open/close type, the input unit
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`placed behind the lid could not be operated with the lid open. The fifth aspect of the
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`invention provides a solid preparation packaging apparatus which solves these problems at
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`one stroke by placing the flat-shaped lid, for covering the buckets, so as to be removably
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`placed on the specific solid preparation supply unit, whereby the input unit can be
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`manipulated with ease.
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`BRIEF DESCRIPTION OF THE DRAWINGS
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`[0027]
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`Fig. l is a front perspective view illustrating a solid preparation packaging
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`apparatus according to the present invention;
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`Fig. 2 is an explanatory side view illustrating the arrangement of each stage of
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`the solid preparation packaging apparatus according to the present invention with each
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`stage drawn out;
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`Fig. 3 is a front perspective view illustrating the solid preparation packaging
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`apparatus according to the present invention with tablet cases drawn out;
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`Fig. 4 is an explanatory side view illustrating the solid preparation packaging
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`apparatus according to the present invention with the tablet cases drawn out and a specific
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`solid preparation supply unit mounted on the apparatus;
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`Fig. 5 is a top plan view illustrating the unit structure of the tablet cases of the
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`solid preparation packaging apparatus according to the present invention;
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`Fig. 6 is an explanatory front view illustrating the slide rail portion of the
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`tablet cases of the solid preparation packaging apparatus according to the present invention
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`and the mounting portion of the specific solid preparation supply unit;
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`Fig. 7 is an exploded perspective view illustrating the configuration of the
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`specific solid preparation supply unit of the solid preparation packaging apparatus
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`according to the present invention;
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`Fig. 8 is an exploded perspective view illustrating the configuration of a
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`bucket portion of the specific solid preparation supply unit of the solid preparation
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`packaging apparatus according to the present invention and the driving unit therefor;
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`Fig. 9 is an exploded view illustrating the configuration of the bucket portion
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`of the specific solid preparation supply unit of the solid preparation packaging apparatus
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`according to the present invention and the driving unit therefor;
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`Fig. 10 is an explanatory view illustrating the passageway structure through
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`which specific solid preparations are delivered from the specific solid preparation supply
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`unit of the solid preparation packaging apparatus according to the present invention;
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`Fig. 11 is a cross-sectional view illustrating the configuration of a transfer
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`mechanism unit of the solid preparation packaging apparatus according to the present
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`invention;
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`Fig. 12 is an explanatory view illustrating a solid preparation packaging
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`mechanism unit of the solid preparation packaging apparatus according to the present
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`invention;
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`Fig. 13 is an explanatory perspective view illustrating the form of a packaging
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`sheet in the solid preparation packaging apparatus according to the present invention and
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`how the opening of a pouch is formed;
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`Fig. 14 is a cross-sectional view illustrating a shutter unit for charging a solid
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`preparation into a pouch of the packaging sheet in the solid preparation packaging
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`apparatus according to the present invention;
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`10
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`Fig. 15 is an explanatory perspective view illustrating the use of the specific
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`solid preparation supply unit and an input unit of the solid preparation packaging apparatus
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`according to the present invention;
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`Fig. 16 is a top plan view illustrating the arrangement of a solid preparation
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`packaging mechanism unit including a printing mechanism unit of the solid preparation
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`15
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`packaging apparatus according to the present invention;
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`Fig. 17 is a top plan view illustrating the positional relation of a flexible
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`wiring cover in an electrical component chamber of the solid preparation packaging
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`apparatus according to the present invention;
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`Fig. 18 is a side view illustrating the flexible wiring cover when the solid
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`20
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`preparation packaging mechanism unit has been pushed back in the solid preparation
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`packaging apparatus according to the present invention; and
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`Fig. 19 is a side view illustrating the flexible wiring cover when the solid
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`preparation packaging mechanism unit is pulled out of the solid preparation packaging
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`apparatus according to the present invention.
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`25
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`DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
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`[0028]
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`The present invention provides a solid preparation packaging apparatus, in the
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`main body of which a solid preparation accommodating unit having a plurality of tablet
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`cases disposed in an array is disposed at an upper portion, each of the tablet cases
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`14
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`

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`accommodating solid preparations by type, the solid preparation accommodating unit
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`having a discharge mechanism for discharging the accommodated solid preparations; a
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`transfer mechanism unit for receiving the solid preparations discharged from the tablet
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`cases and collecting the solid preparations into a charging port is disposed below the solid
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`preparation accommodating unit; and a solid preparation packaging mechanism unit for
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`forming a pouch on a strip of packaging sheet and for charging each pouch with the solid
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`preparations collected in the charging port and sealing the pouch is disposed below the
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`transfer mechanism unit. The solid preparation packaging apparatus is configured such
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`that
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`the solid preparation accommodating unit, the transfer mechanism unit, and
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`the solid preparation packaging mechanism unit are each individually accommodated in the
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`main body so as to be capable of being pulled out or pushed back in the back-and-forth
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`direction;
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`the solid preparation packaging mechanism unit includes a printing
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`mechanism unit for printing on the pouch and a printing circuit board for the