`Amdt. Dated: January 31, 2019
`Reply to Office action of November 2, 2018
`
`REMARKS/ARGUMENTS
`
`Applicant would like to thank the Examiner for the careful consideration given the
`
`present application. Reconsideration of the subject patent application in view of the present
`
`remarks is respectfully requested.
`
`Claim 1 is amended.
`
`Supports for the added limitation “wherein the solder material
`
`is pressed by a first
`
`pressure and deformed before a viscosity of the adhesive decreases by the heat” are found in
`
`paragraphs [0015], [0017] and [0046] of the original specification.
`
`Supports for the added limitation “wherein the first pressing process further includes a
`
`process wherein a pressure applied to the solder material is decreased from the first pressure to a
`
`second pressure that is lower than the first pressure, before the solder material melts” are found
`
`in paragraphs [0018] and [0046] of the original specification.
`
`Supports for the added limitation “while being heated at a temperature equal to or higher
`
`than a melting temperature of the solder material” are found in paragraph [0015] of the original
`
`specification.
`
`Claim Rejections - 35 USC § 102
`
`Claims 1, 4 and 8-9 are rejected under 35 U.S.C. 102(a)(l) as being anticipated by
`
`Igarashi (US 2012/0255766). Applicant respectfully requests withdrawal of the rejection for at
`
`least the following reasons.
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`Page 5 of 10
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