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Docket No.: 083710-3191
`
`PATENT
`
`IN THE UNITED STATES PATENT AND TRADEMARKOFFICE
`
`In re Application of
`Akihito Konishiet al.
`Application No.: 17/050,429
`Filed: October 23, 2020
`
`:
`:
`.
`.
`
`Customer Number: 53080
`Confirmation Number: 1855
`Group Art Unit: 2835
`Examiner: Robert Joseph Hoffberg
`
`For: ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC
`DEVICE
`
`AMENDMENT
`
`Mail Stop RCE
`Commissioner for Patents
`P.O. Box 1450
`Alexandria, VA 22313-1450
`
`Sir:
`
`In response to the Office Action dated April 7, 2022, wherein a three-month shortened
`
`statutory period for response wasset to expire on July 7, 2022, and a petition for one month
`
`extension of time is being filed concurrently herewith, Applicant respectfully requests
`
`reconsideration of the above-identified application in view of the following amendments and
`
`remarks.
`
`A request for continued examination is being filed concurrently herewith.
`
`DM_US189443710-1.083710.3191
`
`

`

`Application No.: 17/050,429
`
`AMENDMENT TO THE CLAIMS
`
`The following claim listing replaces all prior listings and versions of the claims:
`
`LISTING OF CLAIMS
`
`1. (Currently Amended) An electronic device comprising:
`
`a mount board:
`
`a heat generating componentprovided on the mount board;
`
`a pressing component provided above the heat generating component;
`
`a film provided between the heat generating componentand the pressing component; and
`
`a liquid heat conductive material provided between the heat generating component and
`
`the film and between the pressing componentand the film, wherein:
`
`
`
`
`
`the film contains graphite-based carbonandis-compressedrecetvedfromtheby_pressure
`
`
`
`
`
`
`
`
`
`the heat generating componentis provided between the mount board and the pressing
`
`component,
`
`the heat generating componentand the film are sealed with the mount board and the
`
`pressing component by connecting the mount board and the pressing component, and
`
`the film is compressed by connecting the mount board and the pressing component and
`
`heat generating component.
`
`2. (Currently Amended) The electronic device according to claim 1, wherein:
`
`one or morefirst voids are formedat a first surface of the film facing the heat generating
`
`component, and one or more second voids are formed at a second surface of the film facing the
`
`pressing component,
`
`the one or more first voids and the one or more second voidsare filled with the liquid
`
`heat conductive material,
`
`DM_US189443710-1.083710.3191
`
`

`

`Application No.: 17/050,429
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`whena first porosity is a ratio of a total area of the one or morefirst voids projected onto
`
`
`first surface to an entire area of the first surface, [[a]] the first porosity eHthe-one-or-meorefisst
`
`yeids is less than or equal to 5%, and
`
`when a second porosity is a ratio of a total area of the one or more second voids projected
`
`
`onto second surface to an entire area of the second surface,
`
`[[a]] the second porosity efthe-ene-cr
`
`
`
`more-secondyeidsis less than or equal to 5%.
`
`3. (Currently Amended) The electronic device according to claim 1, wherein a
`
`compressibility of the film is more than or equal to 30% at a pressure of 100 kPa.
`
`4, (Currently Amended) The electronic device according to claim 1, wherein the liquid
`
`heat conductive material has a kinematic viscosity at 25°C ranging from 2 cSt to 15 cSt
`
`inclusive.
`
`5. (Currently Amended) A method for manufacturing an electronic device, the method
`
`comprising:
`
`preparing a mount board, on which a heat generating component is mounted, and a
`
`pressing component;
`
`arranging a film having graphite-based carbon on [[a]] the heat generating component,
`
`wherein
`
`
`pressing-component—and the film is coated with a liquid heat conductive material;
`
`airanging a pressing componentonthe film;
`
`connecting the mount board and the pressing component;
`
`sealing the heat generating componentandthe film with the mount board and the
`
`pressing component; [[and]]
`
`compressing the film by the pressing component suehthatthe-one-or_morefist-yoids-and
`
`
`
`forming one or morefirst voids at a first surface of the film facing the heat generating
`
`component, and forming one or more second voids at a second surface of the film facing the
`
`pressing component; and
`
`DM_US189443710-1.083710.3191
`
`

`

`Application No.: 17/050,429
`
`by emitting an ultrasonic wave from a side of the pressing component and detecting a
`
`reflected wave ofthe ultrasonic wave, examining a first porosity and a second porosity, when the
`
`first porosity is a ratio of a total area of the one or morefirst voids projected onto first surface to
`
`an entire area of the first surface, and the second porosity is a ratio of a total area of the one or
`
`more second voids projected onto second surface to an entire area of the second surface whether
`
`
`
`6. (Currently Amended) The method for manufacturing the electronic device according to
`
`claim 5, wherein
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`whenthefirst porosity is greateran-area-oftheone-ornotlessthan ormorefirst voids is
`
`equal to 5%efenarea-ofthefrstsurface, or the second porosity is greaterandanarea-oftheone
`
`
`
`
`
`
`
`ermoresecondvoidsisnetlessefan-area-secondsurface, thethan or equal to 5% ofthe
`
`
`
`
`
`
`
`electronic device is determined as a defective product.
`
`7. (Currently Amended) The electronic device according to claim [[1]] 2, wherein:
`
`side surfaces of the film are covered with the liquid heat conductive material,_and
`
`the side surfaces are disposed between the first surface and the second surface.
`
`8. (Previously Presented) The electronic device according to claim 1, wherein the liquid
`
`heat conductive material contains perfluoropolyether.
`
`9-14. (Cancelled)
`
`15. (New) Theelectronic device according to claim 1, wherein the pressing componentis
`
`fixed to the mount board by an adhesive.
`
`DM_US189443710-1.083710.3191
`
`

`

`Application No.: 17/050,429
`
`Introduction
`
`REMARKS
`
`Claims 1-8 and 15 are pending, of which claims 1 and 5 are independent.
`
`Claims 1-7 have been amendedto correct informalities in the claim language and to more
`
`clearly define the present subject matter. Claims 9-14 have been canceled without prejudice.
`
`Claim 15 has been added. No new matter has been added.
`
`Objection
`
`Claims 3, 4, 6 and 12 were objected to. Applicant submits that the amendments made to
`
`the claims overcome the objection.
`
`Patentability under 35 U.S.C. § 112
`
`Claims 2, 7 and 10-14 were rejected under 35 U.S.C. § 112(b) as being indefinite.
`
`Applicant submits that the amendments madeto the claims overcomethe rejection.
`
`Patentability under 35 U.S.C. § 102/103
`
`Claim 1 was rejected under 35 U.S.C. § 102(a)(1)/(a)(2) as being anticipated by Bunyan
`
`(WO 2017/172703). Claims 2, 5 and 6 were rejected under 35 U.S.C. § 103 as being
`
`unpatentable over Bunyanin view of Fukui (US 2016/0336253). Claim 3 was rejected under 35
`
`U.S.C. § 103 as being unpatentable over Bunyan in view of Tachibana (JP 2014-133669). Claim
`
`4 was rejected under 35 U.S.C. § 103 as being unpatentable over Bunyan in view of Greinke (US
`
`6,746,768). Claims 7 and 10 were rejected under 35 U.S.C. § 103 as being unpatentable over
`
`Bunyan in view of Fisher (US 7,700,162). Claim 8 was rejected under 35 U.S.C. § 103 as being
`
`DM_US189443710-1.083710.3191
`
`

`

`Application No.: 17/050,429
`
`unpatentable over Bunyanin view of Sayir (US 2007/0053168). Claim 9 wasrejected under 35
`
`U.S.C. § 103 as being unpatentable over Bunyan in view of Hirose (US 2009/0301697). Claim
`
`11 was rejected under 35 U.S.C. § 103 as being unpatentable over Bunyan in view of Fisher and
`
`Tachibana. Claim 12 was rejected under 35 U.S.C. § 103 as being unpatentable over Bunyan in
`
`view of Fisher and Greinke. Claim 13 wasrejected under 35 U.S.C. § 103 as being unpatentable
`
`over Bunyan in view of Fisher and Sayir. Claim 14 wasrejected under 35 U.S.C. § 103 as being
`
`unpatentable over Bunyanin view ofFisher and Hirose.
`
`Without conceding any correctness of the rejections, Applicant traverses the rejections
`
`for at least the following reasons.
`
`At a minimum,noneof the cited references disclose “the heat generating componentand
`
`the film are sealed with the mountboard and the pressing component by connecting the mount
`
`board and the pressing component,” as recited by claim 1 and “sealing the heat generating
`
`componentand the film with the mountboard and the pressing component;” as recited by claim
`
`5.
`
`Assuch, claims 1 and 5 and all claims dependent thereon are patentable overthe cited
`
`references.
`
`DM_US189443710-1.083710.3191
`
`

`

`Application No.: 17/050,429
`
`CONCLUSION
`
`Having fully respondedto all matters raised in the Office Action, Applicant submits that
`
`all claims are in condition for allowance, an indication for whichis respectfully solicited. If
`
`there are any outstanding issues that might be resolved by an interview or an Examiner’s
`
`amendment, the Examineris requested to call Applicant’s attorney at the telephone number
`
`shownbelow.
`
`To the extent necessary, a petition for an extension of time under 37 C.F.R. § 1.136 is
`
`hereby made. Please charge any shortage in fees due in connection with the filing of this paper,
`
`including extension of time fees, to Deposit Account 500417 and please credit any excess fees to
`
`such deposit account.
`
`Respectfully submitted,
`
`McDERMOTT WILL & EMERY LLP
`
`/Takashi Saito/
`Takashi Saito
`Registration No. 69,536
`
`Please recognize our Customer No. 53080
`as our correspondenceaddress.
`
`500 North Capitol Street, N.W.
`Washington, DC 20001-1531
`Phone: 202.756.8000 MEF:TS:
`Facsimile: 202.756.8087
`Date: August 4, 2022
`
`DM_US189443710-1.083710.3191
`
`

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