`<12)Patent Application
`Yu
`
`Publication
`
`(10)Pub.No.:US 2006/0209545A1
`.
`.
`.
`(43)Pub Date'
`Sep 21, 2006
`
`US 20060209545.»-\1
`
`(54)
`
`(76)
`
`LIGI-l'l' l<lMl'l"l‘lNGMODULE AND RELATED
`LIGHT SOURCE DEVICE
`
`Inventor:
`
`'l'al-Cheng Yu. Shenzhen (CN)
`
`Correspondence Address:
`NORTH AMERICA INTELLECTUAL
`PROPERTY CORPORATION
`P.O. BOX 506
`MERRIFIELI). VA 22116 (US)
`
`(21)
`
`Appl. No.1
`
`ll/306.591
`
`(32)
`
`Filed:
`
`Jan. 4, 2006
`
`(30)
`
`Foreign Application Priority Data
`
`Mar. 13. 2005
`
`((‘N)n.i...i
`
`2005100337355
`
`Publication Classification
`
`(st)
`
`Int.Cl.
`F21!’
`(52) u.s.c|.
`
`29/00
`
`(2006.01)
`
`(57)
`
`ABSTRACT
`
`........so2/294
`
`A light emitting module (10) includes a metal circuit board
`(ll ). a number of light emitting units (12) arranged on a first
`surface of the metal circuit board. and atcooling system (13)
`mounted on an opposite second surface ofthe metal circuit
`board. A light source device (1) using the light emitting
`module further includes a housing (30) and a transparent
`light cover
`(20). The housing has at base with the light
`emitting module being mounted thereon. The transparent
`light cover covers the housing. The present light emitting
`module zu1dlight source device can improve the brightness
`of the lighti and increase the utilimtion efliciency of light.
`
`10\
`
`13
`
`./3;
`
`_
`
`132
`
`133
`
`t
`
`t
`
`t
`
`t
`
`t
`
`131
`
`134
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`
`
`Patent Application Publication Sep. 21, 2006 Sheet l 0f 5
`
`US 2006/0209545 Al
`
`*
`it
`
`1
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`1
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`1
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`_1__
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`'
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`*
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`'
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`10X
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`'1
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`13
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`/‘I 12
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`11
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`31131
`132
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`133
`
`134
`
`FIG.
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`1
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`
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`\
`
`10
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`Patent Application Publication Sep. 21, 2006 Sheet 2 of 5
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`18
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`US 2006/0209545 Al
`
`/11/
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`7' l
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`2-13
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`__.
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`I M
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`FIG. 2
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`Patent Appllcafion Publication Sep. 21, 2006 Sheet 3 of 5
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`US 2006/0209545 A1
`
`123
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`122
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`123 121
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`@r1Rrr1\@W"”
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`
`
`Patent Application Publication Sep. 21, 2006 Sheet 4 of 5
`
`US 2006/0209545 A1
`
`;;;;;;;;::§;
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`4. §,,.... - -._....... _-.....-- >43;’;
`
`1 3 1
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`/*3
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`132
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`13 3
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`132
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`F I G . 4
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`
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`Patent Application Public
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`ation Sep. 21,2006 Sheet
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`5 of 5
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`US 2006/0209545 Al
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`I
`I
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`so
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`1
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`31
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`11
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`10
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`13
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`I
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`20"—1——-/A
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`\\
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`20
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`FIG. 5
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`US 2006/0209545 A 1
`
`Sep. 21, 2006
`
`LIGHT EMITTING lVIOI)UI.EAND RELATED
`LIGHT SOURCE DEVICE
`
`FIELD OF THE INVENTION
`
`invention relates to ligl1t emitting
`[0001] The present
`modules, and more particularly, to a white light emitting
`module and a light source device using the same.
`DESCRIPTION OF RELATED ART
`
`In order to provide a proper contrast for items in an
`[0002]
`individual‘s viewing environment, it is desirable to have a
`white ligl1t output from a ligl1t source device. Incandescent
`bulbs and fluorescent lamps are capable of' eflectively pro
`viding such a white light or near white light output. How
`ever, there are significant drawbacks for the use of these
`types of light source devices for illumination, such as
`fragility of the lights themselves and their relatively short
`lifespan.
`
`[0003] Because of the drawbacks in the use of incandes
`cent bulbs and fluorescent lamps, the use of light emitting
`diodes (LEDs) for illumination l1as become increasingly
`popular. I.EDs are diodes that have the “side effect” of
`producing light while electric current is flowing through
`them. In the simplest terms, an LED is made with two
`diflerent kinds of semiconductor material: one type that has
`an excess of free electrons roaming around inside the
`material, and another that has a net positive charge and lacks
`electrons. Vvlhen an electron from the flrst material.
`the
`donor, [lows as a current across a thin barrier and into the
`second material, a photon or particle of light is produced.
`
`[0004] Because I.EDs produce light based on semicon
`ductor principles of operation, the light output thereof is
`typically along a narrow wavelength band, i.e., a single color
`output. Recent advances, however, have resulted in I.EDs
`that produce a near white light output. A known method
`being utilized to produce white light from LEDs employs a
`light emitting module that includes a plurality of regularly
`arranged red, green, and blue LEDs.
`[0005] The light emitting module composed of LEDs
`typically lasts for l00,000 hours or more before the I.EDs
`need to be replaced. The LEDs generate very little heat and
`require relatively little power. Therefore, LEDs are well
`suited for a wide variety ofapplications. The unique features
`of LEDs make them very attractive to many industries.
`However, one of the drawbacks of LED technology is that
`the brightness of' an I.ED that is operated with a certain
`current
`is greatly affected by the ambient and its own
`temperature. For a circuit with a certain current, a typical
`LED will shine brighter in colder temperatures a11dmore
`dimly in hotter temperatures. Further, the temperature of the
`light emitting module composed of I_EDs will inevitably
`increase after an operation for a period of time, so its
`brightness will decrease. Thus, the brightness of the light
`emitting module is unstable during its use, and a utilization
`efliciency of ligl1t of the light emitting module is lowered
`after a long time of usage.
`
`[0006] What are needed, therefore, are a light emitting
`module with high utilization efliciency of light, a11da ligl1t
`source device using the light emitting module.
`SUIVIIVIARYOE INVENTION
`[0007] A light emitting module according to one preferred
`embodiment includes a metal circuit board, a number of
`
`light emitting units arranged on a first surface of the metal
`circuit board, and a cooling system mounted on an opposite
`second surface of the metal circuit board.
`
`[0008] A light source device according to one preferred
`embodiment includes a light emitting module, a housing a11d
`a transparent light cover. The light emitting module includes
`a metal circuit board, a number of light emitting units
`arranged on a first surface of the metal circuit board, and a
`cooling system mounted on an opposite second surface of
`the metal circuit board. The housing has a base with the light
`emitting module being mounted thereon. The transparent
`light cover covers the housing.
`
`ligl1t emitting n1od
`[0009] Compared with conventional
`ule, the present light emitting module has following advan
`tages. Because the cooling system is used, with the circu
`latio11of the cooling liquid in the cooling passage, the heat
`generated by the light emitting units can be effectively
`dissipated. The temperature of the LEDs is lowered, and
`maintained in a safety range. Thus, the ligl1temitting capa
`bility of'the I.EDs can be fillly exploited. The brightness of
`the light emitting module is improved, and the utilization
`efficiency of light thereof is also increased, accordingly.
`
`[0010] Other advantages and novel features will become
`more apparent fro111the following detailed description of
`present light emitting module, when taken in conjunction
`with the accompanying drawings.
`
`BRIEF DESCRIPTION OF DRAWINGS
`
`[0011] Many aspects of the present light emitting module
`and light source device can be better understood with
`reference to the following drawings. The components i11the
`drawings are not necessarily to scale. the emphasis instead
`being placed upon clearly illustrating the principles of the
`present light emitting module and light source device. More
`over, in the drawings.
`like reference numerals designate
`corresponding parts throughout the several views.
`
`[0012] FIG. 1 is a schematic, side view ofa light emitting
`module in accordance with a preferred embodiment;
`
`[0013] FIG. 2 is a schematic, top view of the light emitting
`module of FIG. 1;
`
`[0014] FIG. 3 is a schematic, plan view of an exemplary
`light emitting unit of the light emitting module of FIG. I;
`
`[0015] FIG. 4 is a schematic, cross-sectional view of a
`cooling system of the light emitting module of FIG. 1; and
`
`[0016] FIG. 5 is a schematic, cross-sectional view of a
`light source device in accordance with a preferred embodi
`ment.
`
`DETAILED DESCRIPTION
`
`[0017] Reference will now be made to the drawings to
`describe preferred embodiments of the present light emitting
`module a11dligl1t source device,
`in detail.
`
`[0018] Referring to FIG. 1, a light emitting module 10, in
`accordance with a preferred embodiment,
`is shown. The
`ligl1t emitting module 10 includes a metal circuit board 11,
`a plurality of light emitting units 12 arranged on the metal
`circuit board 11, and a cooling system 13 attached to an
`underside of the metal circuit board 11.
`
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`
`US 2006/0209545 A 1
`
`Sep. 21, 2006
`
`[0019] The metal circuit board ll may be a metal printed
`circuit board that has a plurality of driving circuits (not
`shown) thereon. The driving circuits can provide driving
`currents for controlling the plurality of ligl1t emitting units
`12 to er11itwhite light with desired brightness. The metal
`circuit board 11 can be made from a heat conducting
`material with a high heat conducting property, such as Cu,
`Al, or theirs alloy. Thus, heat generated by the light emitting
`units 12 can be effectively conducted to the metal circuit
`board 11.
`
`[0020] The cooling system 13 includes a hollow heat
`receiving portion 131, a cooling pipe 132 communicating
`with the heat receiving portion 131, and a cooling liquid
`witl1 a high heat capacity, such as water or a supercritical
`liquid. The heat receiving portion 131 is attached to a bottom
`surface of the metal circuit board 11. The heat receiving
`portion I31 and the cooling pipe 132 cooperatively define a
`circulatory liquid passage for the circulation of the cooling
`liquid therein. The cooling pipe 132 ca11be configured to be
`in a curved or spiral fashion for economi7ing space occupied
`by the light emitting module 10. In addition, a pump 133 can
`be provided in the liquid passage for enhancing the fiow of
`the cooling liquid in the liquid passage. Furthermore, a
`cooling tank 134 can be arranged in the liquid passage for
`supplying the cooling liquid and enhance the cooling effi
`ciency of the cooling liquid. Preferably, a thermal interface
`material car1be applied between the metal circuit board I1
`and the heat receiving portion 131 for enhancing the heat
`conducting efiiciency therebetween. Nanomaterials such as
`carbon nanotubes can also be admixed in the thennal
`interface material for further enhancing the heat conducting
`efliciency associated therewith.
`
`[0021] Referring to FIG. 2, the plurality of ligl1temitting
`units 12 are regularly arranged on the metal circuit board ll.
`As illustrated, ten white light emitting units 12 are used in
`the preferred embodiment, of which six light emitting tmits
`12 are evenly arranged on an intermediate portion of the
`metal circuit board 11 in two colurrms, and the other four
`light emitting units 12 are evenly, arranged adjacent two
`opposite lateral edges ofthe metal circuit board ll . The four
`light emitting units 12 are preferably lengthways perpen
`dicular to the six light emitting units 12. This configuration
`ensures that an evenly brightness of the light emitting
`module 10 can be obtained. Understandably, of the configu
`ration of the light emitting units 12 is not limited to the
`present embodiment. If the number of the ligl1t emitting
`units 12 arranged on the intermediate portion of the metal
`circuit board 11 is increased or decreased, the number of the
`light emitting units 12 arranged adjacent two edges of the
`center light emitting units 12 needs to be correspondingly
`increased or decreased.
`
`[0022] Referring to FIG. 3, a configuration of an exem
`plary light emitting unit 12 is shown. The light emitting unit
`12 includes at least a red (R) LED 123, at least a green (G)
`LED I21, and at least a blue (B) LED 122 as light emitting
`elements. In the preferred embodiment, the light emitting
`u11it12 includes two red LED 123, two green LED 121, and
`a blue LED 122. The LEDs are arranged in an order of
`G-R-B-R-G thereby obtain a satisfactory white light. Alter
`natively, the LEDs of the light emitting u11it12 can also be
`arranged in the order of one of R-G-B-G-R, B-G-R-G-B,
`B-R-G-R-B, and G-B-R-B-G. The arrangement of the LEDs
`can be linear, as shown in FIG. 3, or curved, circular, etc.
`
`Alternatively, laser diodes (I.Ds) could also be used as the
`li@t emitting unit 12 in a similar way.
`
`[0023] Referring to FIG. 4, a working process of the
`cooling system 13 is shown. The Working process of the
`cooling system 13 includes the steps as follows: heat
`absorbed by the metal circuit board 11 is transferred to the
`heat receiving portion I31 (as indicated by the downward
`arrows). The heat is then transferred to the cooling liquid
`fiowing in the heat receiving portion 131. The cooling liquid
`is driven by the pump 133 and circularly t-lowsin the cooling
`passage. The heat is finally dissipated ir1tothe ambient air.
`[0024] Compared with conventional light emitting mod
`ule. the present
`light emitting module 10 has following
`advantages. Because the cooling system 13 is used, with the
`circulation of the cooling liquid in the cooling passage, the
`heat generated by the light emitting units 12 can be effec
`tively dissipated. The temperature of the LEDs is lowered,
`and maintained in a safety range. Thus, the light emitting
`capability ofthe I.EDs can be fully exploited. The brightness
`of the light emitting module 10 is improved, and the
`utilization efliciency of light
`thereof is also increased,
`accordingly.
`
`[0025] Referring to FIG. S, a light source device 1 having
`the light emitting module 10 is shown. The light source
`device 1 includes a housing 30 with a base 31 for mounting
`the li@t emitting module 10 thereon, and a transparent light
`cover 2|). The housing 30 and the light cover 2|) coopera
`tively fon11 a sealing space for accommodating the ligl1t
`emitting module 10. A shape of the housing 30 car1 be
`trumpet-shaped, cone-shaped,
`truncated cone-shaped, a
`combination of these shapes, or any other similar shapes. An
`inner surface of the housing 30 can be configured to be a
`reflective stu’face for refiecting the light emitted from the
`ligl1t emitting module 10 to the outside of the housing 30.
`The transparent light cover 20 can be a lens, or a prism. In
`the preferred embodiment, the transparent light cover 20 is
`attached to edge portions of the housing 30. Alternatively,
`the light cover 20 could be disposed at positions as indicated
`by broken line 20‘, broken line 20", or any positions ther
`ebetween. The light source device 1 can produce White light
`with high brightness, and is suitable for use as illumination
`light sources such as a desk lamp or a searchlight, or
`projection light sources.
`
`It is to be understood that the above-described
`[0026]
`embodiment is intended to illustrate rather than limit the
`invention. Variations may be n1ade to the embodiment
`without departing from the spirit ofthe invention as claimed.
`The above-described embodiments are intended to illustrate
`the scope of the invention and not restrict the scope of the
`invention.
`
`What is claimed is:
`1. A light emitting module, comprising:
`a metal circuit board:
`
`a plurality of light emitting units arranged on a first
`surface of the metal circuit board; and
`
`a cooling system mounted on an opposite second surface
`of the metal circuit board.
`2. The light emitting module as claimed in claim l,
`wherein the cooling system comprises a hollow heat receiv
`ing portion attached to the second surface of tl1emetal circuit
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`US 2006/0209545 A 1
`
`Sep. 21, 2006
`
`hoard, a cooling pipe defining a liquid passage in commu
`nication with the heat receiving portion, and a cooling liquid
`received in the liquid passage.
`3. The light emitting module as claimed in claim 2,
`wherein the cooling pipe is one of a curved pipe and a spiral
`pipe.
`4. The light emitting module as claimed in claim 2,
`wherein the cooling system further comprises a pump
`arranged in the liquid passage for enhancing the flow of the
`cooling liquid in the liquid passage.
`5. The light emitting module as claimed in claim 2.
`wherein the cooling system further comprises a cooling tank
`arranged in the liquid passage for supplying the cooling
`liquid and enhancing the cooling efliciency of the cooling
`liquid.
`6. The light emitting module as claimed in claim 2,
`wherein the cooling system tiirther comprises a thermal
`interface material applied between the metal circuit board
`and the heat receiving portion.
`7. The light emitting module as claimed in claim 6.
`wherein the thennal interface material is incorporated with
`nanornaterials.
`8. The light emitting module as claimed in claim 2,
`wherein t_hecooling liquid is one of water and supercritical
`liquid.
`9. The light emitting module as claimed in claim 1,
`wherein the light emitting units are white light emitting
`units.
`10. The ligl1t emitting module as claimed in claim 9,
`wherein each of the White light emitting units comprises a
`plurality of color light emitting diodes, or color laser diodes.
`11. The light emitting module as claimed in claim 10,
`wherein the Whitelight emitting unit comprises the plurality
`of color light emitting diodes, and the plurality of color light
`emitting diodes is arranged in an order selected from the
`group consisting of G-R-B-R-G, R-G-B-G-R, B-G-R-G-B.
`B-R-G-R-B. or G-B-R-B-G.
`
`12. The light emitting module as claimed in claim 10,
`wherein the white light emitting unit comprises the plurality
`of color laser diodes, and the plurality of color laser diodes
`are arranged i11a11order selected from the group consisting
`of G-R-B-R-G, R-G-B-G-R. B-G-R-G-B, B-R-G-R-B, and
`G-B-R-B-G.
`13. The light emitting module as claimed in claim 1,
`wherein the metal circuit board is a metal printed circuit
`board.
`14. The light emitting module as claimed in claim 1,
`Wherein the metal circuit hoard is comprised of heat cori
`ducting material With a high heat conducting property.
`15. The light emitting module as claimed in claim 14,
`Wherein the heat conducting material is selected from the
`group consisting of Cu, Al and theirs alloy.
`16. A light source device, comprising:
`a light emitting module comprising a metal circuit board,
`a plurality of light emitting units arranged on a first
`surface ot'the metal circuit hoard, and a cooling system
`mounted on an opposite second surface of the metal
`circuit hoard;
`a housing having a base with the light emitting module
`being mounted thereon; and
`a transparent light cover covering the housing.
`17. The light source device as claimed in claim 16,
`Whereinthe cooling system comprises a hollow heat receiv
`ing portion attached to the bottom ofthe metal circuit board,
`a cooling pipe defining a liquid passage in communication
`Withthe heat receiving portion, and a cooling liquid received
`in the liquid passage.
`18. The light source device as claimed in claim 16,
`wherein an inner surface of the housing is a reflective
`surface for retlecting the light emitted from the light emit
`ting module to the outside of the housing.
`
`*
`
`>I<
`
`*
`
`*
`
`*
`
`