<19)United States
`<12)Patent Application
`Li
`
`Publication
`
`<10)Pub. N0.:US 2008/0007955A1
`(4%)Pub Date
`Jan
`10, 2008
`.
`.
`:
`.
`
`US 20080007955A1
`
`(54)
`
`MULTIPLE-SET HEAT-DISSIPATING
`STRUCTURE FOR LED LAMP
`
`(76)
`
`Inventor:
`
`.Iia-Han LI. Kao Hsiung Hsien
`(TW)
`
`Correspondence Address:
`HDSL
`4331 STEVENS BATTLE LANE
`FAIRFAX, VA 22033
`
`(21)
`
`Appl. No;
`
`ll/428,827
`
`(22)
`
`Filed:
`
`Jul. 5, 2006
`
`Publication Classification
`
`Int. CI.
`FZIV 29/00
`
`(51)
`
`(52)
`
`(2006.01)
`
`362/294
`
`(57)
`
`ABSTRACT
`
`A multiple-set heat-dissipating structure for a LED lamp for
`perlbntlitlg tl1e heat dissipation of the LED set includes at
`heat-conducting base. a plurality of heat pipes and :1plurality
`oflteat-dissipating bodies. ()n end face of the heat-conduct­
`ing base is used for adhering to zmdcontacting with the LED
`set. Each heat pipe has a heat-absorbing e11dand a heat­
`releasing end. respectively. 'lhe heat-absorbing end is con­
`nected to tl1e other end face of tl1e heat-condttcting base.
`Each heat-dissipating body has a hollow cylinder. The outer
`periphery of the cylinder is fonned with a plurality of radial
`heat-dissipating pieces and is cotutected o11the heat-releas­
`ing end of each heat pipe. By dispersing each heat pipe and
`heat-dissipating body. the heat generated hy the operation oi
`the LED set can be conducted and dissipated by each heat
`pipe and heat-dissipating body at multiple points. In this
`way. the l.F.l) set can he continuously operated under a
`suitable working temperature and thus its life cam be elon­
`gated.
`
`§
`
`32 311 33
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`Patent Application Publication
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`Jan. 10, 2008 Sheet 1 of 8
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`Patent Application Publication
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`Jan. 10, 2008 Sheet 2 of 8
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`US 2008/0007955 Al
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`Jan. 10, 2008 Sheet 3 of 8
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`US 2008/0007955 A1
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`US 2008/0007955 A1
`
`Jan. 10, 2008
`
`MULTIPLE-SET HEAT-DISSIPATING
`STRUCTURE FOR LED LAMP
`
`BACKGROUND OF THE INVENTION
`
`l. Field of the I_nvention
`[0001]
`[0002] The present
`invention relates to a rnultiple-set
`heat-dissipating structure for a LED lamp, and in particular
`to a multiple-set heat-dissipating structure for perfomiing
`the heat dissipation of the LED lamp.
`[0003] 2. Description of Prior Art
`[0004] Since light-emitting diodes fl_ED) are high-inten­
`sity, energy-saved and long-life, they are widely used in the
`illumination of electronic devices or lamps. Further. in order
`to increase t_heilluminating range and intensity thereof, a
`plurality of light-emitting diodes are usually combined to
`form a LED set. However, with the subsequent development
`of increasing number of light-ernitting diodes and high­
`power light-ernitting diodes,
`the heat generated by the
`operation of the ligl1t-ernitting diodes is inevitably increas­
`ing. Therefore, it is an important issue for those skilled in
`this art to provide a heat-dissipating structure for LED
`lamps.
`the conventional
`[0005] As shown in FIGS. 1 and 2,
`heat-dissipating structure for the LED lamp mainly corn­
`prises a heat pillar 10a and a heat-dissipating body 2011
`connected onto the heat pillar 10a. The bottom stu’faceof the
`heat pillar 10a is used for adhering to and contacting with a
`LED set (not shown). The heat-dissipating body 20a has a
`hollow cylinder 21a. A plurality of heat-dissipating pieces
`22a extend radially from the outer periphery of the cylinder
`21a. VvIiththe above arrangement, a heat-dissipating struc­
`ture for the LED lamp can be fonned.
`[0006] However, in practice, the conventional hcat-dissi­
`pating structure for the LED lamp still has the following
`problems. The heat generated by the LED set is transferred
`to the outside only by single heat pillar 10a. Since the inner
`volume of the heat pillar 10a is large, it responds to the heat
`slowly, and thus the speed of transferring the heat to the
`outside will be greatly reduced. Further, in the heat transfer
`path, since t_heheat is transferred from the surface of the heat
`pillar 19a to the cylinder 21a, and then from the cylinder 21a
`to each heat-dissipating piece 22a. the heat received by each
`heat-dissipating piece 22a is gadually decreased from its
`root portion to the outer portion. The region other than the
`middle portion of each heat-dissipating piece 22a only
`occupies a limited space and thus is insullicient for the heat
`dissipation of the LED set. Therefore, in the above-men­
`tioned 11eat-dissipating structure,
`the heat
`transferred by
`such structure is greatly restricted, so that the life of the
`light-ernitting diodes in the LED set is reduced.
`[0007]
`In view of t_heabove,
`the inventor proposes the
`present invention to overcome the above problems based on
`his expert experiences and deliberate researches.
`
`SUMMARY OI‘ THE INVENTION
`
`[0008] The present invention is to provide a rnultiple-set
`heat-dissipating structure for a LED lamp. By dispersing
`each heat pipe and heat-dissipating body, the heat generated
`by the operation of the LED set can be conducted and
`dissipated by each heat pipe and 11eat-dissipatingbody at
`multiple points. In this way, the LED set can be continuously
`operated under a suitable working temperature and thus its
`life can be elongated.
`
`[0009] The present invention provides a multiple-set heat­
`dissipating structure for a LED lamp for the perfon11ir1gheat
`dissipation of the LED set, which comprises a heat-conduct­
`ing base, a plurality of heat pipes and a plurality of heat­
`dissipating bodies. On end face of the heat-conducting base
`is used for adhering to and contacting with the LED set.
`Each heat pipe has a heat-absorbing end and a heat-releasing
`end, respectively. The heat-absorbing end is comiected to the
`other end face of the heat-conducting base. Each heat­
`dissipating body has a hollow cylinder. The outer periphery
`of the cylinder is formed with a plurality of radial heat­
`dissipating pieces and is connected on the heat-releasing end
`of each heat pipe.
`
`BRIEF DESCRIPTION OF TIIE DRAWINGS
`
`[0010] The features of the invention believed to be novel
`are set forth with particularity in the appended claims. The
`invention itself however may be best understood by refer­
`ence to the following detailed description of the invention,
`which describes certain exemplary embodiments of the
`invention,
`taken ir1 conjunction with the accompanying
`drawings in which:
`[0011] FIG. 1 is a transverse cross-sectional view of a
`heat-dissipating structure for a LED lar11pin prior art;
`[0012] FIG. 2 is a longitudinal cross-sectional view of a
`heat-dissipating structure for a LED lamp ir1prior art;
`[0013] FIG. 3 is an exploded perspective view of the first
`embodiment of the present invention;
`[0014] FIG. 4 is an assembled perspective view ofthe first
`embodiment of the present invention;
`[0015] FIG. S is a longitudinal cross-sectional view show­
`ing the assembling of the first embodiment of the present
`invention;
`[0016] FIG. 6 is a cross-sectional view taken along the line
`6-6 of FIG. 5;
`[0017] FIG. 7 is a longitudinal cross-sectional View show­
`ing the assembling of the second embodiment of the present
`invention;
`[0018] FIG. 8 is a cross-sectional view taken along the line
`8-S of FIG. 7; and
`[0019] FIG. 9 is a cross-sectional view showing the
`assembling of the heat pipe and the heat-dissipating body of
`the third embodiment of the present invention.
`
`DETAILED DESCRIPTION OF THE
`INVENTION
`
`[0020] The characteristics and the technical contents of the
`present invention will be described with reference to the
`following detailed description and the accompanying draw­
`ings. However, it should be understood that the drawings are
`illustrative but not used to limit
`the scope of the present
`invention.
`[0021] FIG. 3 is an exploded perspective view of the first
`embodiment ofthe present invention. FIG. 4 is an assembled
`perspective view of the first embodiment of the present
`invention. FIG. 5 is a longitudinal cross-sectional View
`showing the assembling of the first embodiment of the
`present
`invention. FIG. 6 is a cross-sectional view taken
`along the line 6-6 of FIG. 5. The present invention provides
`a rnultiple-set 11eat-dissipating structure for a LED lar11pfor
`performing the heat dissipation of the LED set 50, which
`comprises a heat-conducting base 10, a plurality of heat
`pipes 20 and a plurality of heat-dissipating bodies 30.
`
`

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`US 2008/0007955 A 1
`
`Jan. 10, 2008
`
`[0022] The heat-conducting base l0 can be made of alu­
`minum, copper or other r11aterialshaving good heat cor1duc­
`tivity and has a circular plate 11. A circular protruding plate
`12 extends upwardly or1the plate 11. Tl1eouter diameter of
`the circular protruding plate 12 is slightly smaller than that
`of the plate 11. Further, the outer peripheries of the plate 11
`and the protruding plate 12 are recessed to fonn a plurality
`of symmetric notches 13. Tl1e center of t_heprotruding plate
`12 is provided with a circular accommodating hole 14.
`[0023] The heat pipe 20 can be formed into an l-lettered.
`L-lettered, U-lettered shape or other different shapes. The
`outside of the heat pipe has a heat-absorbing end 21 and a
`heat-releasing end 22. The interior thereof is filled with the
`capillary structure and a working fluid. In the present
`embodiment, the heat pipe is constituted of one I-lettered
`heat pipe 20 and two U-lettered heat pipes 20. The heat­
`absorbing end 21 of t_heI-lettered heat pipe 20 is connected
`into the accommodating hole 14 of the heat-conducting base
`10. The l1eat-absorbing end 21 of the U-lettered heat pipe 20
`is used for adhering to and contacting with the top face of the
`protruding plate 12 of the heat-conducting base 10.
`[0024] The heat-dissipating body 30 can be made by
`extruding the materials having good heat conductivity and
`heat-dissipating perfonnance (such as aluminum). The heat­
`dissipating body has a hollow cylinder 31. The outer periph­
`ery of t_hecylinder 31 is formed with a plurality of radial
`heat-dissipating pieces 32. The cylinder is used for covering
`on the heat-releasing end 22 of each heat pipe 20. One side
`of the cylinder 31 is provided with a solder inlet 33. The
`solder inlet 33 can be a hole in communication with the
`interior ar1dexterior of the cylinder 31. The solder inlet 33
`of each heat-dissipating body 30 is arranged toward the
`same direction (as shown in FIG. 6). With the above
`structure, during the manufacturing process, it is easy to
`melt
`the solder (such as tin paste) and the melted solder
`flows into the gap between the heat pipe 20 and the cylinder
`31 and the iimer wall of tl1eheat-releasing end 22. Further,
`the solder inlet 33 can be also a longitudinal hole (as shown
`in FIG. 9) provided on the iimer wall of the cylinder (31).
`Therefore, the above structure makes the heat-dissipating
`body 30 to exert an elastic clamping force to the heat pipe
`20, thereby to facilitate the assembling of the heat-dissipat­
`ing body 30 and the heat pipe 2|).
`[0025] The heat-dissipating structure of the present inven­
`tion can be applied to a LED lamp 5. The LED lamp 5
`comprises a LED set 50, a lamp cover 51 covered over the
`LED set 50 and two power lines 52 electrically connected to
`the LED set 50. In assembling, the bottom surface of the
`LED set 50 adheres on the bottom surface of the heat­
`conducting base 10. Two power lines 52 penetrate through
`the notches 13 of the heat-conducting base 10, respectively.
`The lamp cover 51 covers the I-lettered heat pipe 20 with the
`heat pipe penetrating therethrough, and then is fixedly
`connected onto the plate 11 of the heat-conducting base 10.
`Then, each heat-dissipating body 30 is subsequently con­
`nected onto the heat-releasing end 22 of the heat pipe 20.
`The solder inlet 30 of each heat-dissipating body 30 is filled
`with solder (not shown). Then, by heating, the solder melts
`and t-lowsinto the gap between the heat-releasing end 22 of
`the heat pipe 20 and the inner wall of the cylinder 31. In this
`way, a LED lamp can be constructed.
`[0026]
`In use, after each power line 52 of the LED lamp
`5 is supplied with electric current, the light-emitting diodes
`of the LED set 50 can emit light and generate heat. With the
`
`heat conduction ofthe heat-conducting base l0, the heat can
`be transferred to the heat-absorbing end 21 of each heat pipe
`20. With the phase change between liquid phase and vapor
`phase of the working liquid within each heat pipe 20, the
`generated heat can be rapidly transferred to the outside. By
`dispersing each heat-dissipating body 30, the heat generated
`by the light-emitting diodes of the LED set 50 car1 be
`dissipated by each heat pipe 20 and heat-dissipating body
`30, thereby to perform the heat conduction and dissipation
`As a result, the LED set 50 can be continuously operated ir1
`a suitable working temperature, so that
`its lite can be
`elongated.
`[0027] FIG. 7 is a longitudinal cross-sectional view show­
`ing the assembling of the second embodiment of the present
`invention, and FIG. 8 is a cross-sectional view taken along
`the line 8-8 of FIG. 7. In addition to the construction of the
`above embodiment, an arm 34 is provided to extend between
`each heat-dissipating body 30, thereby to integrally combine
`the heat-dissipating bodies 3|) with each other. In this way,
`the whole strength of the structure of the LED lamp 5‘ can
`be enhanced.
`the multiple-set heat­
`[0028] According to the above,
`dissipating structure for the LED lamp ir1accordance with
`the present invention indeed achieves the desired el]'ects by
`employing the above-rnentioned structure. Further, since the
`construction of the present invention has not been used ir1
`any products of the same kind or in public or published prior
`to applying for patent. Therefore, the present invention has
`novelty and inventive steps and completely confonns to the
`requirements for a utility model patent.
`[0029] Although the present invention has been described
`with reference to the foregoing preferred embodiments, it
`will be understood that the invention is not limited to the
`details thereof. Various equivalent variations and modifica­
`tions can still be occtured to those skilled in this art in view
`of the teachings of the present
`invention. Thus, all such
`variations and equivalent modifications are also embraced
`within the scope of the invention as defined in the appended
`claims.
`What is claimed is:
`1. A r11ultiple-set heat-dissipating structure for a LED
`lamp for perfonning heat dissipation of the LED set, com­
`prising:
`a heat-conducting base with one end face adhering to ar1d
`contacting with the LED set;
`a plurality of heat pipes each l1avir1ga heat-absorbing end
`and a heat-releasing end, the heat-absorbing end con­
`nected to the other end face of the heat-conducting
`base; and
`a plurality of heat-dissipating bodies each having a hollow
`cylinder, a plurality of radial
`l1eat-dissipating pieces
`extending from an outer periphery of the cylinder, the
`cylinder connected onto the heat-releasing end of each
`heat pipe.
`2. The rnultiple-set heat-dissipating structure for a LED
`lamp according to claim 1, wherein the heat-conducting base
`has a plate, a protruding plate extending upwardly on the
`plate, an outer diameter of the protruding plate is slightly
`smaller than that of the plate, the LED lamp further has a
`lamp cover, and one end of the lamp cover is connected to
`the periphery of the protruding plate.
`3. The rnultiple-set heat-dissipating structure for a LED
`lamp according to claim 2, wherein the outer peripheries of
`the plate and the protruding plate of the heat-conducting
`
`

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`US 2008/0007955 A 1
`
`Jan. 10, 2008
`
`base are provided with a plurality of notches, the TFD lamp
`has two power lines, and each power line penetrates from tl1e
`notch to an exterior of the lamp cover.
`4. lhe multiple-set heat-dissipating structure for a LED
`lamp according to clai1112, wherein a center of the protrud­
`ing plate is provided with an accommodating hole for
`fixedly coimecting to a l1eat pipe.
`5. The multiple-set heat-dissipating structure for a LED
`lamp according to claim 1, wherein the heat pipe is formed
`into any one of an l-lettered, L-lettered or U-lettered shape.
`6. The multiple-set heat-dissipating structure for a TFD
`lamp according to claim 1, wherein the cylinder of each
`heat-dissipating body is provided with a solder inlet thereon.
`7. The multiple-set heat-dissipating structure for a TFD
`lamp according to claim 6, wherein the solder inlet is a hole
`
`in communication with the interior and exterior of the
`cylinder.
`8. The multiple-set heat-dissipating structure for a l.FD
`lamp according to claim 6, wherein the solder inlet is a
`longitudinal hole provided on the inner wall of the cylinder.
`9. The multiple-set heat-dissipating structure for a LED
`lamp according to claim 6, wherein the solder inlet of each
`heat-dissipating body is arranged toward the same direction
`10. The multiple-set heat-dissipating structure for a LFD
`lamp according to claim 1, wherein an arm extends between
`each heat-dissipating body for integrally combining the
`heat-dissipating bodies with each other.
`
`