<19)United States
`<12)Patent Application
`Wang
`
`Publication
`
`<10)Pub. No.:US 2008/0043472A1
`(43)Pub. Date:
`Feb. 21, 2008
`
`US 20080043472A1
`
`(54)
`
`LED LAMP HAVING A HEAT DISSIPATING
`STRUCTURE
`
`(76)
`
`Inventor:
`
`Chin-Wen Wang. Pingzhen City
`(TW)
`
`Conespondence Address:
`HDSL
`4331 STEVENS BATTLE LANE
`FAIRFAX. VA 22033
`
`(21)
`
`Appl. No.1
`
`ll/465.218
`
`(22)
`
`Filed:
`
`Aug. 17, 2006
`
`Publication Classification
`
`(51)
`
`Int. Cl.
`F2lV 29/00
`
`(2006.01)
`
`(S2) U.S. (fl.
`
`..................................................... 4>362/294
`
`(57)
`
`ABSTRACT
`
`A11LED lamp having a heat dissipating structure tbr dissi­
`pating the heat of the LED lamp includes a lamp casing. an
`LED lamp module_an isothermal board and a heat pipe. The
`lamp casing has an opening. and the LED lamp module is
`fixed to a side of the opening of the lamp casing and includes
`a circuit board and a plurality of LED fixed on a plane of a
`circuit board, and another plane of the circuit board is
`attached on the isothermal board. and a circular groove is
`formed on the isothennal board. The heat pipe has a heat
`receiving end attached onto an internal surface of the groove
`of the isothermal board. so as to significantly enhance the
`heat conducting and dissipating elfect and omit the manu­
`facturing process of flattening a portion of the heat pipe to
`lower the manulacturiug cost.
`
`311
`
`31
`
`> Q @ ‘ @
`\,
`D
`N * '
`
`//”
`
`32
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`_/23
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`/10
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`

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`Patent Application Publication
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`Feb. 21, 2008 Sheet 1 of 4
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`US 2008/0043472 A1
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`Feb. 21, 2008 Sheet 2 0f 4
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`US 2008/0043472 A1
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`Patent Application Publication
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`Feb. 21, 2008 Sheet 3 of 4
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`US 2008/0043472 A1
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`US 2008/0043472 A 1
`
`Feb. 21, 2008
`
`LED LAWP HAVING A HEAT DISSIPATING
`STRUCTURE
`
`BACKGROUND Ol*'THE INVENTION
`
`l. Field of the Invention
`[0001]
`[0002] The present
`invention relates to an LED lamp
`having a l1eat dissipating structure. and r11oreparticularly to
`a l1eat dissipating structure for dissipating the heat of an
`LED lamp.
`[0003]
`2. Description of Prior Art
`[0004] Since light emitting diodes (I .EDs) feature the
`advantages of high brightness, power saving and long life
`expectancy, LEDs have been used extensively for the illu­
`mination oflamps. Several LED bulbs are usually arranged
`and cormected to a circuit board to form an LED lamp
`module. Since the LED lamp usually comes with poor heat
`resistance, therefore it generally requires heat conducting
`and dissipating cornponents to conduct tl1eheat produced by
`each LED lamp, and each LED lamp can be operated at a
`lower temperature. Thus. the LED lamp and heat dissipating
`components are indispensable to each other, and designing
`a structure for enhancing the overall heat conducting and
`dissipating eflects becomes a11important subject for manu­
`facturers in the related industry.
`[0005] A traditional LED lamp having a heat dissipating
`structure includes a lamp casing, an LED lamp module, a
`heat pipe and a heat dissipating body, wl1erei11the LED lamp
`module is contained in the lamp casing, and a plurality of
`LEDs disposed at the bottom of the LED lamp module, and
`the back of the LED lamp module is attached onto a fiat
`bottom surface of the heat pipe. and the heat dissipating
`body comprises a plurality of heat sinks stacked with each
`other and a corresponding interconnecting hole disposed
`thereon. The interconnecting hole is provided and sheathed
`onto another end of the heat pipe. If each LED emits light
`and produces heat, the heat can be conducted to each heat
`sink by the heat pipe, so that the heat car1be dissipated fror11
`each heat sink to the outside. The assembly of the foregoing
`components constitutes an LED lamp having a heat dissi­
`pating structure.
`[0006] However, the traditional LED lar11pshaving a heat
`dissipating structure still have the following problerns in
`actual applications. Since the traditional LED lamps require
`a process of flattening the bottom of the heat pipe to increase
`the contact area of the heat pipe Withthe I.ED lamp module.
`not only increasing the manufacturing cost of the heat pipe,
`but also causing a possible peel-otf of capillary tissues and
`walls of the heat pipe and a loss of thermal conduction and
`greatly lowering the heat conducting and dissipating etfects.
`Furthermore, the contact area of the heat pipe with the LED
`lamp is very limited, and thus the heat dispersion effect is
`poor, particularly for
`power LED lamps. As a result, the
`current LED lamps cannot meet the heat dissipation require­
`ments. and its low heat conducting and dissipating perfor­
`mance shortens the life expectancy of the LED lamps, and
`thus the prior art requires ftnther improvements.
`
`SUMMARY OF TIIE INVENTION
`
`In view of the foregoing shortcomings of the prior
`[0007]
`art, the inventor of the present invention based on years of
`experience in the related industry to conduct experiments
`
`and modifications. and finally designed an I.ED lamp having
`a heat dissipating structure in accordance with the present
`invention.
`[0008] Therefore, the present invention is to provide an
`LED lamp having a heat dissipating structure that uses a
`large contact area between the isothermal board and the heat
`pipe to greatly increase the heat conducting and dissipating
`effect and also omit the manufacturing process of flattening
`a portion of the heat pipe to lower the manufacturing cost.
`[0009] The present invention provides an LED lamp hav­
`ing a heat dissipating structure for dissipating the heat
`produced by the I.ED lamp, and the structure comprises a
`lamp casing, an LED lamp module, an isothermal board and
`a heat pipe. The lamp casing has an opening, and the LED
`lamp module is fixed to a side of the opening of the lamp
`casing and includes a circuit board and a plurality of LEDs
`fixed on a plane of a circuit board, and another plane of the
`circuit board is attached on the isothermal board, and a
`circular groove is formed on the isothermal board. The heat
`pipe has a heat receiving end attached onto an internal
`surface of the groove of the isothennal board.
`
`BRIEF IJESCRIPTION O1‘ DRAWINGS
`
`[0010] The features of the invention believed to be novel
`are set forth with particularity in the appended claims. The
`invention itself however may be best understood by refer­
`ence to the following detailed description of the invention,
`which describes certain exemplary embodiments of the
`invention,
`taken in conjunction With the accompanying
`drawings ir1which:
`[0011] FIG. 1 is an exploded view of the present invention;
`[0012] FIG. 2 is a schematic view of a portion of an
`assembly of the present invention;
`[0013] FIG. 3 is a perspective view of an assembly of the
`present invention; and
`[0014] FIG. 4 is a cross-sectional view of an assembly of
`the present invention.
`
`DETAILED DESCRIPTION OF THE
`INVENTION
`
`[0015] The technical characteristics, features and advan­
`tages of the present invention will become apparent ir1the
`following detailed description of the preferred embodiments
`with reference to the accompanying drawings. Ilowever, the
`drawings are provided for reference a11dillustration only and
`are not intended for limiting the scope of the invention.
`[0016] Referring to FIGS. 1 to 4 for an exploded view, a
`schematic view, a perspective view and a cross-sectional
`view of the present
`invention,
`the invention provides a11
`LED lamp having a heat dissipating structure that comprises
`a lamp casing 10, an LED lamp module 20, an isothermal
`board 30 and a heat pipe 40 (as shown ir1l-‘IG. 2).
`[0017] The lamp casing 10 includes a rectangular fixing
`base 11, a through hole 111 disposed separately at four
`corners of the fixing base 11, a circular external cover 12
`extended downward fron1 the bottom surface of the fixing
`base 11, a bowl-shape
`internal cover 13 fon11ed on an
`internal side of the external cover 12, an opening 14 formed
`at the top surface of tl1e ir1ten1alcover 13. and a fixing rir1g
`15 formed at an internal side of the bottom of the internal
`cover 13 fixing ring 15 for connecting a light transmitting
`lens 16 (as shown i11FIG. 4).
`
`

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`
`US 2008/0043472 A 1
`
`Feb. 21, 2008
`
`[0013] The LED lamp module 20 is fixed on a side of the
`opening 14 of the lamp casing 1|) and includes a circuit
`board 21 and a plurality of LEDs 22 fixed onto the bottom
`surface of the circuit board 21, and a power cable 23
`disposed 011tl1e circuit board 21 a11delectrically connected
`to the LEDs 22. The bottom surface of the circuit board 21
`is attached onto the top s1u’faceof the internal cover 13, and
`each LED 22 is contained in the internal cover I3.
`[0019] The bottom surface of the isothermal board 30 is
`attached onto the top surface of t_hecircuit board 21 of the
`LED la111pmodule 20, a11dthe isothennal board 30 includes
`an upper casing plate 31 and a corresponding lower casing
`plate 32 engaged with the bottom of the upper casing plate
`31. A vacuum chamber is formed between the upper and
`lower casi11gplates 31. 32, and capillary tissues a11doper­
`ating fluids are filled into the vacuum chamber, and the fluid
`phased then11al conduction 111echan_ismis used to achieve a
`quick thermal conduction effect. Further, a stairway-like
`circular surrounding plate 311 is extended upward from the
`center of the upper casing plate 31, and an arc groove 312
`is for111edon the surrounding plate 311, a11da penetrating
`hole 33 is disposed separately at four corners of the isother­
`mal board 3|) and corresponding to the through hole 111 of
`the lamp casing 10 for passing and securing a fixing element
`such as a screw bolt.
`[0020] The heat pipe 40 includes a circular heat receiving
`end 41 and two heat discharging ends 42 extended vertically
`upward from the distal ends ofthe heat receiving end 41, and
`the heat receiving end 41 is attached onto an intemal surface
`of the groove 312 of the isothermal board 30.
`[0021] Tl1e present invention further includes a heat dis­
`sipating body 5|) comprised of a plurality of heat sinks 51
`stacked with each other, a corresponding interconnecting
`hole 52 disposed on each heat sink 51 for passing and
`connecting a heat discharging end 42 of the heat pipe 40.
`[0022]
`In the assembling process, the circuit board 21 of
`the LED lamp module 20 is installed on the top of the
`internal cover 13 of the lamp casing 10 and then each
`penetrating hole 33 of the isothermal board 30 corresponds
`to the through hole lll of the fixing base ll. and then a
`screw bolt is passed sequentially through the through l1ole
`111 and the penetrating hole 33 and secured with a screw
`nut, so that the bottom surface of the lower casing plate 32
`of the isothermal board 30 is attached onto the top surface
`of tl1ecircuit board 21. Further, the intercomiecting hole 52
`of the heat dissipating body 50 is sheathed onto the heat
`discharging end 42 of the heat pipe 40, and then a lower arc
`surface of the heat receiving end 41 of the heat pipe 40 is
`attached to the internal surface of the groove 312 of the
`isothermal board 30, and a thermal conducting medium can
`be coated between the heat receiving end 41 and the groove
`312 to improve the heat conducting effect. Finally, glue is
`applied onto the fixing ring 15 at the internal cover 13, and
`then the light transmitting lens 16 is connected to fonn an
`LED lamp.
`[0023] During the use ofan LED lamp, a current is passed
`into the LED lamp module 20, such that each LED 22 emits
`light and produces l1eat, a11dthe heat
`is conducted to the
`circuit board 21. With the large contact area between the
`circuit board 21 and the isothermal board 30 and the fluid
`phased thermal conduction mechanism of the isothennal
`
`board 30, the heat is dispersed rapidly to the heat receiving
`end 41 of the heat pipe 40 and conducted to the heat
`discharging end 42 for a heat exchange with each heat sink
`51. Finally, the low-temperature airflow outside the LED
`lamp can carry away the heat ofeach heat sink 51, such that
`each LED 22 can be operated at a lower temperature, so as
`to extend the life expectancy of the LED 22.
`[0024]
`In view of the foregoing structure, the present
`invention uses a large contact area between the isothemial
`board 30 and the heat pipe 40 to greatly improve the heat
`conducting and dissipating effects and omit the manufactur­
`ing process of flattening a portion of the heat pipe 40 to
`lower the manufacturing cost.
`[0025]
`in summation of the above description, the LED
`lamp having a heat dissipating structure in accordance with
`the invention herein enhances the performance than the
`conventional structure and further complies with the patent
`application requirements.
`[0026] The present invention is illustrated with reference
`to the preferred embodiment a11dnot intended to limit the
`patent scope of the present invention. Various substitutions
`and modifications l1ave suggested in the foregoing descrip­
`tion, and other will occur to those of ordinary skill in the art.
`Therefore, all such substitutions and modifications are
`intended to be embraced within the scope of the invention as
`defined in the appended claims.
`
`What is claimed is:
`1. An LED lamp having a heat dissipating structure,
`comprising:
`a lamp casing, having an opening;
`an LED lamp module, fixed at one side of the opening of
`the lamp casing, and having a circuit board and a
`plurality of LED fixed onto one plane of the circuit
`board:
`a11isothermal board, attached onto the other plane of the
`circuit board of the LED lamp module, and forming a
`circular groove thereon; and
`a heat pipe, having a heat receiving end attached onto an
`intemal surface of a groove of the isothermal board.
`2. The LED lamp having a heat dissipating structure of
`claim 1, wherein the lamp casing includes a fixing base, a
`through l1oledisposed separately at four corners of the flxi11g
`base, and a penetrating hole disposed separately at four
`corners of the isothermal board and corresponding to the
`through l1ole, for passing and securing a fixing element.
`3. The LED lamp having a heat dissipating structure of
`claim 2, wherein the fixing base includes an external cover
`extended downward from the bottom of the fixing base, an
`inter11al cover formed on an i11ter11alside of the extemal
`cover, and an opening fon11edat a top surface of the internal
`cover.
`4. The LED lamp having a heat dissipating structure of
`claim 3, wherein the internal cover forms a fixing ring at a
`bottom of the internal cover, for connecting a li@t trans­
`mitting lens.
`5. Tl1e LED lamp having a heat dissipating structure of
`claim 1, wherein the isothermal board includes an upper
`casing plate, a lower casing plate engaged with the corre­
`sponding upper casing plate, a surrounding plate extended
`upward from the upper casing plate. and a groove formed on
`the surrounding plate.
`6. The LED lamp having a heat dissipating structure of
`claim 1, wherein the heat receiving end of the heat pipe is
`
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`US 2008/0043472 A 1
`
`Feb. 21, 2008
`
`in shapc of a horizontal ring, and a heat discharging end is
`extended vertically upward from a distal e11dof the heal
`receiving end.
`7. lhe LED la111phaving a heat dissipating structure of
`claim 6, further comprising a heat dissipating body sheathed
`onto a heat discharging end of the heat pipe,
`
`8. The LFD lamp having a heat dissipating structure 01‘
`claim 7, wherein the heat dissipating body includes a plu­
`rality of heat sinks stacked With each other.
`
`4-
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`~
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`+
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`+
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`4­
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