throbber

`
`(12) Laid Open Patent Publication (A)
`
`
`
`
`
` (11) Publication Number:
`Unexamined Patent Application 2002-215059
`(P2002-215059)
`
`
`(19) Japanese Patent Agency (JP)
`
`
`
`ID Code
`348
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`(43) Publication Date: 7.31.2002
`Theme Code (ref.)
`
`FI
`348C 2H092
`G09F 9/00
`348L
` 5E317
`
`
`G02F 1/1345
`5E344
`H05K 1/11 D
`5G435
`
`1/14 C
`
`
`
`
` (51) Int. Cl.7
`
`H01L G09F 9/00
`
`
`
`
`
`G02F 1/1345
`
`H05K 1/11
`
`
`
`1/14
`
`
`Request for Examination: None; Number of Claims: 10; OL (total 11 pages)
`(21) Application No.: 2001-10573
`(71) Applicant: 000002369
`(P2001-10573)
`
`
`Seiko Epson Corp.
`
`
`2-4-1 Nishi-Shinjuku, Shinjuku-ku,
`(22) Date of Application: 1.18.2001
`
`
`Tokyo
`
`(72) Inventor: Ken’ichi HASEGAWA
`
`
`Seiko Epson Corp., 3-3-5 Owa,
`
`
`Suwa City, Nagano
`(74) Agent: 100095728
`
`
`Masataka KAMIYANAGI, Benrishi
`
`
`(and one other)
`(continued on last page)
`
`
`(54) Title of Invention: Electro-Optical Device
`
`(57) Abstract
`Problem: To provide an electro-optical device with
`which, by improving the structure of terminal[s]
`electrically connected to a flexible wiring board formed
`on a substrate, electro-optical devices with good display
`characteristics and be stably obtained without offsets
`occurring in the pressure bonding of the substrate and
`the flexible wiring board.
`
`Solution Means: Terminals 91 and dummy terminals 93
`are formed on a substrate 20, corresponding to a
`positioning structure for electrodes 82 and dummy
`electrodes 81 on flexible wiring board 8. By this means,
`an essentially uniform pressure is applied within a
`flexible wiring board connecting region 80 in the
`pressure bonding process between substrate 20 and
`flexible wiring board 8, therefore the proportion of
`positioning offset between terminals 91 and electrodes
`82 can be greatly reduced, and an electro-optical
`device free of poor contact and with good display
`characteristics can be obtained.
`
`
`
`
`Page 1 of 37
`
`Tianma Exhibit 1006
`
`

`

`Claims
`
`Claim 1
`
`An electro-optical device furnished with:
`
`a substrate;
`
`a conductive pattern disposed on the substrate;
`
`a semiconductor device disposed on the substrate and electrically connected to
`the conductive pattern;
`
`multiple terminals disposed on the substrate and electrically connected to wiring
`via the semiconductor device;
`
`and dummy terminal disposed on the substrate and disposed essentially in
`parallel to a part of the terminals;
`
`whereby the multiple terminals and the dummy terminal are disposed so that the
`inter-terminal distance between adjacent terminals is essentially uniform.
`
`Claim 2
`
`The electro-optical device of Claim 1, further furnished with a flexible wiring
`board comprising multiple dummy electrodes disposed so that the inter-electrode
`distances between adjacent terminals is uniform;
`
`whereby the electrodes and dummy electrodes are disposed to oppose the
`terminals and dummy terminals;
`
`and the electrode and terminals, and dummy electrodes and dummy terminals,
`are respectively electrically connected via anisotropic conductive films.
`
`Claim 3
`
`An electro-optical device furnished with:
`
`a substrate;
`
`a conductive pattern disposed on the substrate;
`
`a semiconductor device disposed on the substrate and electrically connected to
`the conductive pattern;
`
`a flexible wire board on which multiple electrodes and dummy electrodes are
`disposed, electrically connected to the semiconductor device;
`
`
`
`2
`
`Page 2 of 37
`
`

`

`multiple terminals electrically connected in correspondence to the multiple
`
`electrodes on the flexible wiring board on the substrate and electrically connected to the
`conductive patterns via the semiconductor device;
`
`and dummy terminals disposed essentially in parallel to part of the terminals on
`the substrate, and electrically connected to the dummy terminals.
`
`Claim 4
`
`The electro-optical device of any one of Claims 1 through 3, wherein the
`substrate has a rectangular shape;
`
`the terminals and dummy terminals are disposed along the side of the substrate;
`
`the terminals have a first width along the aforementioned side;
`
`and the electrodes have a second width wider than the first width along the
`aforementioned side.
`
`Claim 5
`
`The electro-optical device of any one of Claims 1 through 3, wherein the
`substrate has a rectangular shape;
`
`the terminals and dummy terminals are disposed along the side of the substrate;
`
`the terminals have a first width along the aforementioned side;
`
`and the electrodes have a second width narrower than the first width along the
`aforementioned side.
`
`
`Claim 6
`
`The electro-optical device of any one of Claims 1 through 5, wherein the
`substrate has a rectangular shape;
`
`the terminals and dummy terminals are disposed along the side of the substrate;
`
`and the terminals and dummy terminals have essentially the same width along
`the aforementioned side.
`
`Claim 7
`
`
`
`3
`
`Page 3 of 37
`
`

`

`The electro-optical device of any one of Claims 4 through 6, having first
`
`electrodes electrically connected via an anisotropic conductive film to the terminals and
`second electrodes electrically connected via an anisotropic conductive film to the wiring;
`
`whereby the first electrodes have a third width which is wider than the first width
`along the aforementioned side.
`
`
`Claim 8
`
`The electro-optical device of any one of Claims 4 through 6, wherein the
`semiconductor device has a first electrode, electrically connected via an anisotropic
`conductive film to the terminal, and a second electrode, electrically connected via an
`anisotropic conductive film to the wiring, and whereby the first electrode has a third
`width, which is narrower than the first width along the side.
`
`
`
`Claim 9
`
`The electro-optical device of any one of Claims 4 through 8, wherein the terminal
`has an essentially vertical, straight shape relative to the side.
`
`Claim 10
`
`An electro-optical device formed by sandwiching of an electro-optical substance
`between one of the conductive patterns, wherein
`
`one of the conductive patterns is provided on a substrate;
`
`a semiconductor device for driving the electro-optical substance is provided on
`the substrate;
`
`one of the conductive patterns is connected to the semiconductor device output
`electrode;
`
`a terminal connected to an I/O electrode on the semiconductor device is provided
`on the substrate;
`
`the terminals have a connecting part for connecting to flexible wire board through
`an anisotropic conductive film;
`
`dummy terminals disposed to be essentially parallel to the terminal connecting
`part are provided on the substrate;
`
`
`
`4
`
`Page 4 of 37
`
`

`

`and the terminals and dummy terminals are disposed so that adjacent inter-
`
`terminal distances are approximately uniform.
`
`
`Detailed Description of the Invention
`0001
`Technical Field of the Invention
`
` The present embodiment belongs to the technical field of electro-optical devices,
`and in particular pertains to a terminal structure for connecting a terminal on a substrate
`to an electrode on a flexible wiring board using an anisotropic conductive film.
`
`0002
`Conventional Art
`
` A typical electro-optical device is a liquid crystal device. Using Figs. 9-11, we
`explain the structure of a simple matrix liquid crystal device as an example of such a
`liquid crystal device. Fig. 9 is a simplified perspective view of a liquid crystal device. Fig.
`10 is a partial expanded plan view of a liquid crystal device, showing a connecting
`structure between terminals 19 formed on second substrate 20, and electrodes 82
`formed on flexible wiring board 8. Fig. 11 is a simplified cross section through line C-C'
`in Fig. 10, explaining a defect in a conventional structure in which a terminals 191 and
`electrodes 82 are pressure bonded via an anisotropic conductive film.
`
`0003
`
`As shown in Fig. 9, in a simple matrix liquid crystal device 1, a pair [made up] of
`a first transparent substrate 10 and a second transparent substrate 20 formed on glass
`or the like are adhesively affixed, separated by a predetermined gap via seal material
`30. A liquid crystal (electro-optical substance) 5 is encapsulated within a liquid crystal
`encapsulated region 300, segmented by a first transparent substrate 10, second
`transparent substrate 20, and seal material 30. A first conducting pattern and second
`conducting pattern for driving are respectively formed in a mutually perpendicular
`direction on first transparent substrate 10 and second transparent substrate 20 to apply
`
`
`
`5
`
`Page 5 of 37
`
`

`

`voltages to the liquid crystal.
`
`0004
`
`In this liquid crystal device 1, second transparent substrate 20 is larger than first
`transparent substrate 10, and a portion of second transparent substrate 20 projects out
`from the edge of first transparent substrate 10. An IC packaging region 70 for packaging
`a drive IC (semiconductor device) 7, and a flexible wiring substrate connecting region
`80 for connecting flexible wiring board 8 which supplies various signals and voltages to
`IC drive IC 70 are formed on this projecting part 200 of second transparent substrate
`20.
`
`0005
`
`Here, signals are supplied directly from the drive IC 7, packaged in IC packaging
`region 70, to wiring 92, corresponding to one end portion of a second conducting
`pattern formed on second transparent substrate 20. In response, when the first
`transparent substrate 10 and second transparent substrate 20 are adhered by a seal
`material 30, the first conducting pattern formed on first transparent substrate 10
`electrically connects inter-substrate conducting material or the like included in seal
`material 30 to the end portion of wiring 94 for conducting between substrates, which
`extends from both ends of IC packaging region 70 in second transparent substrate 20.
`
`0006
`
`Also, as shown in Fig. 10, electrodes 82 and dummy electrodes 81 are formed to
`be essentially parallel on flexible wiring board 8, so that inter-electrode distances are
`essentially uniform. At the same time, terminals 191 are formed in opposition to
`electrodes 82 on flexible wiring substrate connecting region 80 of second transparent
`substrate 20. Terminals 191 and electrodes 82 are electrically connected via an ACF
`(anisotropic conductive film), not shown. In this packaging method, which uses an
`anisotropic conductive film made by dispersing conductive particles in resin, the
`anisotropic conductive film is disposed, for example, on a flexible wiring substrate
`connecting region 80 on second transparent substrate 20. Thereafter, flexible wiring
`
`
`
`6
`
`Page 6 of 37
`
`

`

`board 8 electrodes 82 are positionally registered to terminals 191, superimposing
`second transparent substrate 20 and flexible wiring board 8. In this state, flexible wiring
`board 8 is heated and pressure bonded to second transparent substrate 20. As a result,
`the resin component contained in the anisotropic conductive film melts, and conductive
`particles contained in the anisotropic conductive film are squeezed between terminals
`191 and electrode 82. Terminals 191 and electrodes 82 are thus electrically connected
`via conductive particles, and the resin portion which had been contained in the
`anisotropic conductive film hardens so that second transparent substrate 20 and flexible
`wiring board 8 are adhesively affixed.
`
`0007
`Problems the Invention Seeks to Solve
`
`In a pressure bonding step using such an anisotropic conductive film, the gaps
`between adjacent terminals 191 are non-uniform in the flexible wiring substrate
`connecting region 80 on second transparent substrate 20, so there is nothing disposed
`at positions corresponding to the dummy electrodes 81 formed on second transparent
`substrate 20. Therefore, as shown in Fig. 11, in the pressure bonding step of the
`packaging process the inter-substrate gaps between flexible wiring board 8 and the
`second transparent substrate differ between the region where dummy electrodes 81
`(81a-81f) are formed and the region where electrodes 82 (82a-82g) are formed,
`resulting in non-uniform pressure within the plane such that flexible wiring board 8 sags,
`which produces positional offsets. As a result, electrode 82b and terminal 191b,
`electrode 82c and terminal 191c, etc. are adhered in an offset state, creating problems
`of higher adhesion resistance and degraded display characteristics in the electro-optical
`device. In addition, if there is a large offset between electrode 82e and terminal 191e,
`which are supposed to be connected, then they may not connect, or electrode 82f and
`terminal 191e, which are not supposed to be connected, may connect, creating
`problems of display defects in the liquid crystal device. These problems become more
`pronounced as the gap between terminals 191 narrows as liquid crystal devices
`become higher in definition.
`
`
`
`
`7
`
`Page 7 of 37
`
`

`

`0008
`
`The problem of this invention, in light of these problems, is to improve the
`structure of terminals on a substrate electrically connected to a flexible wire board so as
`to provide an electro-optical device in which no positional offset occurs in the process of
`pressure bonding a substrate to a flexible wire board, so that an electro-optical device
`with good display characteristics can be obtained.
`
`0009
`Means for Solving the Problems
`
`To solve these problems, the invention adopts the constitution described below.
`The electro-optical device of the present invention comprises: a substrate; wiring
`disposed on this substrate; a semiconductor device disposed on the substrate and
`electrically connected to the wiring; multiple terminals disposed on the substrate and
`electrically connected to the wiring via the semiconductor device; and a dummy terminal
`disposed on the substrate and disposed in parallel to part of the terminals; whereby the
`multiple terminals and dummy terminals are disposed so that inter-terminal distances
`between adjacent terminals are uniform.
`
`0010
`
`According to this constitution of the invention, in a flexible wiring substrate
`connecting region on a substrate to which a flexible interconnect board is adhered,
`provision of dummy terminals results in the essentially uniform placement of terminals
`and dummy terminals within the flexible wiring substrate connecting region. As a result,
`in a pressure bonding process for electrically connecting a substrate and a flexible
`wiring board via an anisotropic conductive film, pressure is applied in an essentially
`uniform manner within the flexible wiring substrate so that the proportion of positional
`offset between terminals and electrodes can be greatly reduced compared to the past.
`As a result, electrodes and terminals are securely electrically connected, and an electro-
`optical device free of electrical contact defects, with good display characteristics, can be
`stably obtained.
`
`
`
`
`8
`
`Page 8 of 37
`
`

`

`0011
`
`A flexible wiring board is further provided, comprising multiple electrodes and
`dummy electrodes disposed so that spacing between adjacent electrodes is uniform,
`whereby the electrodes and dummy electrodes are respectively disposed relative to the
`terminals and dummy terminals, such that the electrodes and terminals and dummy
`electrodes and dummy terminals are respectively electrically connected via an
`anisotropic conductive film. According to this constitution, in a flexible wiring substrate
`connecting region on a substrate to which a flexible wiring board is adhered, provision
`of dummy terminals results in terminals and dummy terminals being disposed in an
`essentially uniform manner within the region. Thus in a pressure bonding process for
`electrically connecting a substrate and a flexible wiring board via an anisotropic
`conductive film, pressure is applied in an essentially uniform manner within the flexible
`wiring substrate connecting region, so the proportion of positional offset between
`terminals and electrodes can be greatly reduced compared to the past. As a result,
`electrodes and terminals are securely electrically connected, and an electro-optical
`device free of electrical contact defects, with good display characteristics, can be stably
`obtained.
`
`0012
`
`Another electro-optical device of the present invention is furnished with: a
`substrate; wiring disposed on the substrate; a semiconductor device electrically
`connected to the wiring; a flexible wiring board electrically connected to the
`semiconductor device on which multiple electrodes and dummy electrodes are
`disposed; multiple terminals disposed to connect corresponding multiple electrodes on
`the flexible wiring board on the substrate, electrically connected to the multiple wires
`through the semiconductor device; and dummy terminals disposed essentially parallel to
`a part of the terminals on the substrate and electrically connected to the dummy
`electrodes.
`
`0013
`
`
`
`9
`
`Page 9 of 37
`
`

`

`According to this constitution of the invention, forming terminals and dummy
`
`terminals on a second transparent substrate so as to correspond to electrode structures
`on a flexible wiring board enables an essentially uniform pressure to be applied within
`the flexible wiring board connecting region on a substrate to which the flexible wiring
`board is adhered in the process of pressure bonding the substrate and the flexible
`wiring board, therefore the proportion of positional offsets between terminals and
`electrodes can be greatly reduced compared to the past. As a result, electrodes and
`terminals are securely electrically connected, and an electro-optical device free of
`electrical contact defects, with good display characteristics, can be stably obtained.
`
`0014
`
`The substrate has a rectangular shape, the terminals and dummy terminals are
`disposed along the side of the substrate, and the terminals have a first width along that
`side, while the electrodes have a second width which is wider than the first width along
`the side. According to such a constitution, so long as the second width fits within the
`first width, the contact surface area between the terminals and electrodes will not
`change during the pressure bonding process in which the flexible wiring board and
`substrate are pressure bonded via an anisotropic conductive film, even if there is some
`positional offset along the side on which the terminal is disposed. Therefore an electro-
`optical device with a constant fixed value for the contact resistance between terminals
`and electrodes can be obtained.
`
`0015
`
`Also, the substrate has a rectangular shape, the terminals and dummy terminals
`are disposed along the side of the substrate, and the terminals have a first width along
`that side, while the electrodes have a second width which is narrower than the first
`width along the side. The possession of a second width wider than the first width along
`the side is a feature [of the invention]. According to this constitution, so long as the
`second width fits within the first width, the contact surface area between the terminals
`and electrodes will not change during the pressure bonding process in which a flexible
`wiring board and substrate are pressure bonded via an anisotropic conductive film, even
`
`
`
`10
`
`Page 10 of 37
`
`

`

`if there is some positional offset along the side on which the terminal is disposed.
`Therefore an electro-optical device with a constant fixed value for the contact resistance
`between terminals and electrodes can be obtained.
`
`0016
`
`The substrate has a rectangular shape, and the terminals and dummy terminals
`are disposed along a side of the substrate, and terminals and dummy terminals have
`the same width along the side. Thus the terminals and dummy terminals may also be
`formed to have the same width.
`
`0017
`
`The semiconductor device has a first electrode, electrically connected via an
`anisotropic conductive film to the terminal, and a second electrode, electrically
`connected to the wiring via an anisotropic conductive film, while the first electrode has a
`third width, which is wider than the first width along the side. According to such a
`constitution, so long as the first width fits within the third width, the contact surface area
`between the terminals and electrodes will not change during the pressure bonding
`process in which the semiconductor device and substrate are pressure bonded via an
`anisotropic conductive film, even if there is some positional offset along the side on
`which the terminal is disposed. An electro-optical device with a constant fixed value for
`the contact resistance between terminals and electrodes can thus be obtained.
`
`0018
`
`Also, the semiconductor device has first electrodes, electrically connected via an
`anisotropic conductive film to terminals, and second electrodes, electrically connected
`to the wiring via an anisotropic conductive film, whereby the first electrodes have a third
`width, which is narrower than the first width [measured] along the side. According to
`such a constitution, so long as the first width fits within the third width, the contact
`surface area between the terminal and the first electrode will not change during the
`pressure bonding process in which the semiconductor device and substrate are
`pressure bonded via an anisotropic conductive film, even if there is some positional
`
`
`
`11
`
`Page 11 of 37
`
`

`

`offset along the side on which the terminal is disposed. Therefore an electro-optical
`device with a constant fixed value for the contact resistance between terminals and
`electrodes can be obtained.
`
`0019
`
`Also, the terminal has a straight shape which is essentially perpendicular to the
`aforementioned side. According to this constitution, the wiring resistance value can be
`lowered by adopting a straight shape for terminals rather than a diagonal shape so that
`the terminal is diagonal to the side of the substrate. If terminals are formed in a straight
`shape from the part contacting the flexi[ble wiring board] to the part contacting the
`semiconductor device, then a part is created in which the distance between terminals is
`larger than in other parts; however in this invention dummy terminals are provided so
`that the inter-terminal distance is essentially a uniform gap in that part, so the type of
`defect described above does not occur in the process for pressure bonding the
`terminals and the flexi[ble wiring board].
`
`0020
`
`Embodiments of the Invention
`
`Below, based on drawings, we explain an embodiment of the invention using an
`example of a simple matrix liquid crystal device.
`
`0021
`
` Fig. 1 is a perspective view schematically showing the external appearance of a
`liquid crystal device. Fig. 2 is a perspective view schematically showing an exploded
`view of the liquid crystal device shown in Fig. 1. Fig. 3 is a cross section of a liquid
`crystal device cut through line A-A’ in Fig. 1. Note that the present invention is
`characterized by the structure of the part connecting the flexible wiring board; wiring
`formed on the substrate for displaying images with a liquid crystal device is shown
`schematically in Figs. 1 and 2, and a detailed illustration thereof is here omitted.
`
`0022
`
`
`
`12
`
`Page 12 of 37
`
`

`

`As shown in Figs. 1, 2, and 3, in a simple matrix liquid crystal device 1, a pair
`
`[consisting] of glass, quartz, or plastic rectangular first transparent substrate 10 and
`second transparent substrate 20 are adhered and affixed at a predetermined gap,
`sandwiching a seal material 30. A discontinuous part is formed on seal material 30 as a
`liquid crystal injection port 301 for injecting liquid crystal, and this liquid crystal injection
`port 301 is sealed with a sealing material 302 consisting of UV-hardened resin. A liquid
`crystal (electro-optical substance) 5 is encapsulated within liquid crystal encapsulated
`region 300, segmented by seal material 30 between first transparent substrate 10 and
`second transparent substrate 20. Mutually perpendicular drive conductor patterns 15,
`25 are formed in a stripe shape of transparent ITO (Indium Tin Oxide) film or the like on
`first transparent substrate 10 and second transparent substrate 20. A drive signal for
`driving the liquid crystal in each pixel is applied to these conductive patterns. Note than
`when the liquid crystal device is of the reflective or semi-transmissive reflective type,
`these conductive patterns may form one of the electrode patterns by using a reflective
`metal film such as aluminum.
`
`0023
`
`Oriented films 101, 201 are formed on the surface of first transparent substrate
`10 and second transparent substrate 20, and various liquid crystal modes such as STN
`(Super Twisted Nematic) may be used on the surface of first transparent substrate 10
`and second transparent substrate 20.
`
`0024
`
`Pixels are constituted by liquid crystals corresponding to the intersecting parts of
`conductor patterns 15, 25. The present embodiment is a simple matrix liquid crystal
`device, therefore one of the drive conductor patterns 15, 25 functions as a scanning
`electrode to which a scan signal is applied, and the other functions as a signal electrode
`to which an image signal such as an on voltage or off voltage is applied. In addition,
`polarizing plates 19, 29 are affixed to each of the outer surfaces of first transparent
`substrate 10 and second transparent substrate 20. Also, phase differential plates are
`interposed between transparent substrates 10 and 20 to erase coloring occurring in the
`
`
`
`13
`
`Page 13 of 37
`
`

`

`liquid crystal layer as needed.
`
`0025
`
`In this liquid crystal device 1 of the present embodiment, second transparent
`substrate 20 is larger than first transparent substrate 10, and a part of second
`transparent substrate 20 projects out from one side of first transparent substrate 10. Of
`the projecting part 200 of this second transparent substrate 20, flexible wiring substrate
`connecting region 80 is formed along one side of second transparent substrate 20, and
`IC packaging region 70 is formed in parallel to flexible wiring substrate connecting
`region 80 on the interior region of this flexible wiring substrate connecting region 80. IC
`packaging region 70 is a region for packaging drive IC 7, which is a semiconductor
`device for outputting a drive signal to wiring 15, 25; flexible wiring substrate connecting
`region 80 is a region for connecting flexible wiring board 8, which supplies various
`signals and power supplies from the outside to drive IC 7, to second transparent
`substrate 20. Drive IC7 applies a drive signal to various wiring in order to drive each
`liquid crystal device pixel; the active surface is placed in opposition to the substrate in a
`chip state and packaged by the COG (Chip On Glass) method.
`
`0026
`
`When the first transparent substrate 10 and second transparent substrate 20 are
`adhered by seal material 30, the first conducting pattern formed on first transparent
`substrate 10 electrically connects inter-substrate conducting material or the like included
`in seal material 30 to the end portion of wiring 94 for conducting between substrates,
`which extends from both ends of IC packaging region 70 in second transparent
`substrate 20. Wiring 94 is electrically connected via anisotropic conductive film 6 to a
`second electrode 73, described below, provided on drive IC 7. At the same time, one
`end portion of conductive pattern 25, formed on second transparent substrate 20,
`functions as second wiring 92, electrically connected through output electrode (second
`electrode) 73, described below, provided on drive IC 7, and anisotropic conductive film
`6.
`
`
`
`
`14
`
`Page 14 of 37
`
`

`

`0027
`
`Next, using Figs. 4-7, we describe the connecting structure close to drive IC 7
`and close to flexible wiring substrate connecting region 80.
`
`0028
`
` Fig. 4 is a partial perspective view of a liquid crystal device explaining the
`connecting structure close to IC packaging region 70. Fig. 5 is a partial perspective view
`of a liquid crystal device explaining the connecting structure close to flexible wiring
`substrate connecting region 80. Fig. 6 is a partial plan view of a liquid crystal device
`explaining the connecting structure close to flexible wiring substrate connecting region
`80. Fig. 7 is a simplified cross section cut through line B-B' in Fig. 6.
`
`0029
`
`In Fig. 4, IC packaging region 70 and flexible wiring substrate connecting region
`80 are connected to multiple first terminals 91 made up of an ITO film and a conductive
`film such as aluminum film formed at the same time as drive conductive pattern 25.
`Multiple input electrodes (first electrodes) 71 and dummy electrodes 72 corresponding
`to first terminals 91 on the flexible wiring substrate connecting region 80 side are
`disposed on drive IC 7, which is disposed in IC packaging region 70, and multiple output
`electrodes (second electrodes) 73 are disposed on second wiring 92 and wiring 94, in
`one-to-one correspondence to the terminals thereof. First electrodes 71 and second
`electrodes 73 are formed in a protruding shape as bump electrodes. Here, first
`electrodes 71 are electrodes for inputting scanning signals or video signals from flexible
`wiring board 8; second electrodes 73 respectively output scanning signals and video
`signals to wiring 15 or wiring 25.
`
`0030
`
`In second transparent substrate 20, each of the multiple first terminals 91 has an
`essentially vertical straight part relative to side 120 of second transparent substrate 20,
`and some first terminals 91 have a partially diagonal wiring shape. In the flexible wiring
`substrate connecting region 80, in addition to first terminals 91, non-electrically
`
`
`
`15
`
`Page 15 of 37
`
`

`

`connected dummy terminals 93 are disposed on both conductor patterns 15 and 25,
`which are formed at the same as first terminals 91. Dummy terminals 93 have a straight
`shape essentially parallel to the straight shaped part of first terminals 91. Dummy
`terminals 93 and first terminals 91 are disposed so that the inter-terminal distance
`between adjacent terminals is essentially uniform. In addition, dummy terminals 93 and
`first terminals 91 are formed so that the widths a along side 120 of each second
`transparent substrate 20 are respectively the same.
`
`0031
`
` In Figs. 5 and 6, electrodes 82 and dummy electrodes 81 are respectively
`disposed in pairs with first terminals 91 and dummy terminals 93, disposed on second
`transparent substrate 20 on flexible wiring board 8. Electrodes 82 and dummy
`electrodes 81 are formed essentially parallel [to one another] so that the gap between
`adjacent electrodes is uniform. Stated differently, the first terminals 91 and dummy
`terminals 93 disposed on the second transparent substrate are formed to be mutually
`opposing, matching the disposition of electrodes 82 and dummy electrodes 81 on
`flexible wiring board 8. A voltage such as ground potential Vss or high voltage potential
`Vdd is supplied from flexible wiring board 8 to drive IC 7 through electrodes 82 and first
`terminals 91. Also, as shown in Fig. 7, mutually opposing electrodes 82 and first
`terminals 91, and mutually [opposing] dummy electrodes 81 and dummy terminals 93,
`are electrically connected by conductive particles 62 in anisotropic conductive film 6,
`within which conductive particles 62 are dispersed in resin 61, and second transparent
`substrate 20 and flexible wiring board 8 are adhered and affixed by the resin 61 portion
`of anisotropic conductive film 6 in a cured state.
`
`0032
`
`The following is performed in the pressure bonding process between flexible
`wiring board 8 and second transparent substrate 20.
`
`0033
`
`
`
`16
`
`Page 16 of 37
`
`

`

`First, an anisotropic conductive adhesive is coated onto second transparent
`
`substrate 20 flexible wiring substrate connecting region 80, or a sheet-shaped
`anisotropic conductive film is disposed on flexible wiring substrate connecting region 80.
`Thereafter, flexible wiring board 8 electrode 82 and dummy electrodes 81 are
`positionally registered to first terminals 91 and dummy terminals 93, superimposing
`second transparent substrate 20 and flexible wiring board 8. In this state, flexible wiring
`board 8 is pressure bonded to second transparent substrate 20 as it is heated. As a
`result, as shown in Fig. 7, the resin 61 part included in anisotropic conductive film 6 is
`melted, and conductive particles 62 conta

This document is available on Docket Alarm but you must sign up to view it.


Or .

Accessing this document will incur an additional charge of $.

After purchase, you can access this document again without charge.

Accept $ Charge
throbber

Still Working On It

This document is taking longer than usual to download. This can happen if we need to contact the court directly to obtain the document and their servers are running slowly.

Give it another minute or two to complete, and then try the refresh button.

throbber

A few More Minutes ... Still Working

It can take up to 5 minutes for us to download a document if the court servers are running slowly.

Thank you for your continued patience.

This document could not be displayed.

We could not find this document within its docket. Please go back to the docket page and check the link. If that does not work, go back to the docket and refresh it to pull the newest information.

Your account does not support viewing this document.

You need a Paid Account to view this document. Click here to change your account type.

Your account does not support viewing this document.

Set your membership status to view this document.

With a Docket Alarm membership, you'll get a whole lot more, including:

  • Up-to-date information for this case.
  • Email alerts whenever there is an update.
  • Full text search for other cases.
  • Get email alerts whenever a new case matches your search.

Become a Member

One Moment Please

The filing “” is large (MB) and is being downloaded.

Please refresh this page in a few minutes to see if the filing has been downloaded. The filing will also be emailed to you when the download completes.

Your document is on its way!

If you do not receive the document in five minutes, contact support at support@docketalarm.com.

Sealed Document

We are unable to display this document, it may be under a court ordered seal.

If you have proper credentials to access the file, you may proceed directly to the court's system using your government issued username and password.


Access Government Site

We are redirecting you
to a mobile optimized page.





Document Unreadable or Corrupt

Refresh this Document
Go to the Docket

We are unable to display this document.

Refresh this Document
Go to the Docket