`
`(12) Laid Open Patent Publication (A)
`
`
`
`
`
` (11) Publication Number:
`Unexamined Patent Application 2002-215059
`(P2002-215059)
`
`
`(19) Japanese Patent Agency (JP)
`
`
`
`ID Code
`348
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`(43) Publication Date: 7.31.2002
`Theme Code (ref.)
`
`FI
`348C 2H092
`G09F 9/00
`348L
` 5E317
`
`
`G02F 1/1345
`5E344
`H05K 1/11 D
`5G435
`
`1/14 C
`
`
`
`
` (51) Int. Cl.7
`
`H01L G09F 9/00
`
`
`
`
`
`G02F 1/1345
`
`H05K 1/11
`
`
`
`1/14
`
`
`Request for Examination: None; Number of Claims: 10; OL (total 11 pages)
`(21) Application No.: 2001-10573
`(71) Applicant: 000002369
`(P2001-10573)
`
`
`Seiko Epson Corp.
`
`
`2-4-1 Nishi-Shinjuku, Shinjuku-ku,
`(22) Date of Application: 1.18.2001
`
`
`Tokyo
`
`(72) Inventor: Ken’ichi HASEGAWA
`
`
`Seiko Epson Corp., 3-3-5 Owa,
`
`
`Suwa City, Nagano
`(74) Agent: 100095728
`
`
`Masataka KAMIYANAGI, Benrishi
`
`
`(and one other)
`(continued on last page)
`
`
`(54) Title of Invention: Electro-Optical Device
`
`(57) Abstract
`Problem: To provide an electro-optical device with
`which, by improving the structure of terminal[s]
`electrically connected to a flexible wiring board formed
`on a substrate, electro-optical devices with good display
`characteristics and be stably obtained without offsets
`occurring in the pressure bonding of the substrate and
`the flexible wiring board.
`
`Solution Means: Terminals 91 and dummy terminals 93
`are formed on a substrate 20, corresponding to a
`positioning structure for electrodes 82 and dummy
`electrodes 81 on flexible wiring board 8. By this means,
`an essentially uniform pressure is applied within a
`flexible wiring board connecting region 80 in the
`pressure bonding process between substrate 20 and
`flexible wiring board 8, therefore the proportion of
`positioning offset between terminals 91 and electrodes
`82 can be greatly reduced, and an electro-optical
`device free of poor contact and with good display
`characteristics can be obtained.
`
`
`
`
`Page 1 of 37
`
`Tianma Exhibit 1006
`
`
`
`Claims
`
`Claim 1
`
`An electro-optical device furnished with:
`
`a substrate;
`
`a conductive pattern disposed on the substrate;
`
`a semiconductor device disposed on the substrate and electrically connected to
`the conductive pattern;
`
`multiple terminals disposed on the substrate and electrically connected to wiring
`via the semiconductor device;
`
`and dummy terminal disposed on the substrate and disposed essentially in
`parallel to a part of the terminals;
`
`whereby the multiple terminals and the dummy terminal are disposed so that the
`inter-terminal distance between adjacent terminals is essentially uniform.
`
`Claim 2
`
`The electro-optical device of Claim 1, further furnished with a flexible wiring
`board comprising multiple dummy electrodes disposed so that the inter-electrode
`distances between adjacent terminals is uniform;
`
`whereby the electrodes and dummy electrodes are disposed to oppose the
`terminals and dummy terminals;
`
`and the electrode and terminals, and dummy electrodes and dummy terminals,
`are respectively electrically connected via anisotropic conductive films.
`
`Claim 3
`
`An electro-optical device furnished with:
`
`a substrate;
`
`a conductive pattern disposed on the substrate;
`
`a semiconductor device disposed on the substrate and electrically connected to
`the conductive pattern;
`
`a flexible wire board on which multiple electrodes and dummy electrodes are
`disposed, electrically connected to the semiconductor device;
`
`
`
`2
`
`Page 2 of 37
`
`
`
`multiple terminals electrically connected in correspondence to the multiple
`
`electrodes on the flexible wiring board on the substrate and electrically connected to the
`conductive patterns via the semiconductor device;
`
`and dummy terminals disposed essentially in parallel to part of the terminals on
`the substrate, and electrically connected to the dummy terminals.
`
`Claim 4
`
`The electro-optical device of any one of Claims 1 through 3, wherein the
`substrate has a rectangular shape;
`
`the terminals and dummy terminals are disposed along the side of the substrate;
`
`the terminals have a first width along the aforementioned side;
`
`and the electrodes have a second width wider than the first width along the
`aforementioned side.
`
`Claim 5
`
`The electro-optical device of any one of Claims 1 through 3, wherein the
`substrate has a rectangular shape;
`
`the terminals and dummy terminals are disposed along the side of the substrate;
`
`the terminals have a first width along the aforementioned side;
`
`and the electrodes have a second width narrower than the first width along the
`aforementioned side.
`
`
`Claim 6
`
`The electro-optical device of any one of Claims 1 through 5, wherein the
`substrate has a rectangular shape;
`
`the terminals and dummy terminals are disposed along the side of the substrate;
`
`and the terminals and dummy terminals have essentially the same width along
`the aforementioned side.
`
`Claim 7
`
`
`
`3
`
`Page 3 of 37
`
`
`
`The electro-optical device of any one of Claims 4 through 6, having first
`
`electrodes electrically connected via an anisotropic conductive film to the terminals and
`second electrodes electrically connected via an anisotropic conductive film to the wiring;
`
`whereby the first electrodes have a third width which is wider than the first width
`along the aforementioned side.
`
`
`Claim 8
`
`The electro-optical device of any one of Claims 4 through 6, wherein the
`semiconductor device has a first electrode, electrically connected via an anisotropic
`conductive film to the terminal, and a second electrode, electrically connected via an
`anisotropic conductive film to the wiring, and whereby the first electrode has a third
`width, which is narrower than the first width along the side.
`
`
`
`Claim 9
`
`The electro-optical device of any one of Claims 4 through 8, wherein the terminal
`has an essentially vertical, straight shape relative to the side.
`
`Claim 10
`
`An electro-optical device formed by sandwiching of an electro-optical substance
`between one of the conductive patterns, wherein
`
`one of the conductive patterns is provided on a substrate;
`
`a semiconductor device for driving the electro-optical substance is provided on
`the substrate;
`
`one of the conductive patterns is connected to the semiconductor device output
`electrode;
`
`a terminal connected to an I/O electrode on the semiconductor device is provided
`on the substrate;
`
`the terminals have a connecting part for connecting to flexible wire board through
`an anisotropic conductive film;
`
`dummy terminals disposed to be essentially parallel to the terminal connecting
`part are provided on the substrate;
`
`
`
`4
`
`Page 4 of 37
`
`
`
`and the terminals and dummy terminals are disposed so that adjacent inter-
`
`terminal distances are approximately uniform.
`
`
`Detailed Description of the Invention
`0001
`Technical Field of the Invention
`
` The present embodiment belongs to the technical field of electro-optical devices,
`and in particular pertains to a terminal structure for connecting a terminal on a substrate
`to an electrode on a flexible wiring board using an anisotropic conductive film.
`
`0002
`Conventional Art
`
` A typical electro-optical device is a liquid crystal device. Using Figs. 9-11, we
`explain the structure of a simple matrix liquid crystal device as an example of such a
`liquid crystal device. Fig. 9 is a simplified perspective view of a liquid crystal device. Fig.
`10 is a partial expanded plan view of a liquid crystal device, showing a connecting
`structure between terminals 19 formed on second substrate 20, and electrodes 82
`formed on flexible wiring board 8. Fig. 11 is a simplified cross section through line C-C'
`in Fig. 10, explaining a defect in a conventional structure in which a terminals 191 and
`electrodes 82 are pressure bonded via an anisotropic conductive film.
`
`0003
`
`As shown in Fig. 9, in a simple matrix liquid crystal device 1, a pair [made up] of
`a first transparent substrate 10 and a second transparent substrate 20 formed on glass
`or the like are adhesively affixed, separated by a predetermined gap via seal material
`30. A liquid crystal (electro-optical substance) 5 is encapsulated within a liquid crystal
`encapsulated region 300, segmented by a first transparent substrate 10, second
`transparent substrate 20, and seal material 30. A first conducting pattern and second
`conducting pattern for driving are respectively formed in a mutually perpendicular
`direction on first transparent substrate 10 and second transparent substrate 20 to apply
`
`
`
`5
`
`Page 5 of 37
`
`
`
`voltages to the liquid crystal.
`
`0004
`
`In this liquid crystal device 1, second transparent substrate 20 is larger than first
`transparent substrate 10, and a portion of second transparent substrate 20 projects out
`from the edge of first transparent substrate 10. An IC packaging region 70 for packaging
`a drive IC (semiconductor device) 7, and a flexible wiring substrate connecting region
`80 for connecting flexible wiring board 8 which supplies various signals and voltages to
`IC drive IC 70 are formed on this projecting part 200 of second transparent substrate
`20.
`
`0005
`
`Here, signals are supplied directly from the drive IC 7, packaged in IC packaging
`region 70, to wiring 92, corresponding to one end portion of a second conducting
`pattern formed on second transparent substrate 20. In response, when the first
`transparent substrate 10 and second transparent substrate 20 are adhered by a seal
`material 30, the first conducting pattern formed on first transparent substrate 10
`electrically connects inter-substrate conducting material or the like included in seal
`material 30 to the end portion of wiring 94 for conducting between substrates, which
`extends from both ends of IC packaging region 70 in second transparent substrate 20.
`
`0006
`
`Also, as shown in Fig. 10, electrodes 82 and dummy electrodes 81 are formed to
`be essentially parallel on flexible wiring board 8, so that inter-electrode distances are
`essentially uniform. At the same time, terminals 191 are formed in opposition to
`electrodes 82 on flexible wiring substrate connecting region 80 of second transparent
`substrate 20. Terminals 191 and electrodes 82 are electrically connected via an ACF
`(anisotropic conductive film), not shown. In this packaging method, which uses an
`anisotropic conductive film made by dispersing conductive particles in resin, the
`anisotropic conductive film is disposed, for example, on a flexible wiring substrate
`connecting region 80 on second transparent substrate 20. Thereafter, flexible wiring
`
`
`
`6
`
`Page 6 of 37
`
`
`
`board 8 electrodes 82 are positionally registered to terminals 191, superimposing
`second transparent substrate 20 and flexible wiring board 8. In this state, flexible wiring
`board 8 is heated and pressure bonded to second transparent substrate 20. As a result,
`the resin component contained in the anisotropic conductive film melts, and conductive
`particles contained in the anisotropic conductive film are squeezed between terminals
`191 and electrode 82. Terminals 191 and electrodes 82 are thus electrically connected
`via conductive particles, and the resin portion which had been contained in the
`anisotropic conductive film hardens so that second transparent substrate 20 and flexible
`wiring board 8 are adhesively affixed.
`
`0007
`Problems the Invention Seeks to Solve
`
`In a pressure bonding step using such an anisotropic conductive film, the gaps
`between adjacent terminals 191 are non-uniform in the flexible wiring substrate
`connecting region 80 on second transparent substrate 20, so there is nothing disposed
`at positions corresponding to the dummy electrodes 81 formed on second transparent
`substrate 20. Therefore, as shown in Fig. 11, in the pressure bonding step of the
`packaging process the inter-substrate gaps between flexible wiring board 8 and the
`second transparent substrate differ between the region where dummy electrodes 81
`(81a-81f) are formed and the region where electrodes 82 (82a-82g) are formed,
`resulting in non-uniform pressure within the plane such that flexible wiring board 8 sags,
`which produces positional offsets. As a result, electrode 82b and terminal 191b,
`electrode 82c and terminal 191c, etc. are adhered in an offset state, creating problems
`of higher adhesion resistance and degraded display characteristics in the electro-optical
`device. In addition, if there is a large offset between electrode 82e and terminal 191e,
`which are supposed to be connected, then they may not connect, or electrode 82f and
`terminal 191e, which are not supposed to be connected, may connect, creating
`problems of display defects in the liquid crystal device. These problems become more
`pronounced as the gap between terminals 191 narrows as liquid crystal devices
`become higher in definition.
`
`
`
`
`7
`
`Page 7 of 37
`
`
`
`0008
`
`The problem of this invention, in light of these problems, is to improve the
`structure of terminals on a substrate electrically connected to a flexible wire board so as
`to provide an electro-optical device in which no positional offset occurs in the process of
`pressure bonding a substrate to a flexible wire board, so that an electro-optical device
`with good display characteristics can be obtained.
`
`0009
`Means for Solving the Problems
`
`To solve these problems, the invention adopts the constitution described below.
`The electro-optical device of the present invention comprises: a substrate; wiring
`disposed on this substrate; a semiconductor device disposed on the substrate and
`electrically connected to the wiring; multiple terminals disposed on the substrate and
`electrically connected to the wiring via the semiconductor device; and a dummy terminal
`disposed on the substrate and disposed in parallel to part of the terminals; whereby the
`multiple terminals and dummy terminals are disposed so that inter-terminal distances
`between adjacent terminals are uniform.
`
`0010
`
`According to this constitution of the invention, in a flexible wiring substrate
`connecting region on a substrate to which a flexible interconnect board is adhered,
`provision of dummy terminals results in the essentially uniform placement of terminals
`and dummy terminals within the flexible wiring substrate connecting region. As a result,
`in a pressure bonding process for electrically connecting a substrate and a flexible
`wiring board via an anisotropic conductive film, pressure is applied in an essentially
`uniform manner within the flexible wiring substrate so that the proportion of positional
`offset between terminals and electrodes can be greatly reduced compared to the past.
`As a result, electrodes and terminals are securely electrically connected, and an electro-
`optical device free of electrical contact defects, with good display characteristics, can be
`stably obtained.
`
`
`
`
`8
`
`Page 8 of 37
`
`
`
`0011
`
`A flexible wiring board is further provided, comprising multiple electrodes and
`dummy electrodes disposed so that spacing between adjacent electrodes is uniform,
`whereby the electrodes and dummy electrodes are respectively disposed relative to the
`terminals and dummy terminals, such that the electrodes and terminals and dummy
`electrodes and dummy terminals are respectively electrically connected via an
`anisotropic conductive film. According to this constitution, in a flexible wiring substrate
`connecting region on a substrate to which a flexible wiring board is adhered, provision
`of dummy terminals results in terminals and dummy terminals being disposed in an
`essentially uniform manner within the region. Thus in a pressure bonding process for
`electrically connecting a substrate and a flexible wiring board via an anisotropic
`conductive film, pressure is applied in an essentially uniform manner within the flexible
`wiring substrate connecting region, so the proportion of positional offset between
`terminals and electrodes can be greatly reduced compared to the past. As a result,
`electrodes and terminals are securely electrically connected, and an electro-optical
`device free of electrical contact defects, with good display characteristics, can be stably
`obtained.
`
`0012
`
`Another electro-optical device of the present invention is furnished with: a
`substrate; wiring disposed on the substrate; a semiconductor device electrically
`connected to the wiring; a flexible wiring board electrically connected to the
`semiconductor device on which multiple electrodes and dummy electrodes are
`disposed; multiple terminals disposed to connect corresponding multiple electrodes on
`the flexible wiring board on the substrate, electrically connected to the multiple wires
`through the semiconductor device; and dummy terminals disposed essentially parallel to
`a part of the terminals on the substrate and electrically connected to the dummy
`electrodes.
`
`0013
`
`
`
`9
`
`Page 9 of 37
`
`
`
`According to this constitution of the invention, forming terminals and dummy
`
`terminals on a second transparent substrate so as to correspond to electrode structures
`on a flexible wiring board enables an essentially uniform pressure to be applied within
`the flexible wiring board connecting region on a substrate to which the flexible wiring
`board is adhered in the process of pressure bonding the substrate and the flexible
`wiring board, therefore the proportion of positional offsets between terminals and
`electrodes can be greatly reduced compared to the past. As a result, electrodes and
`terminals are securely electrically connected, and an electro-optical device free of
`electrical contact defects, with good display characteristics, can be stably obtained.
`
`0014
`
`The substrate has a rectangular shape, the terminals and dummy terminals are
`disposed along the side of the substrate, and the terminals have a first width along that
`side, while the electrodes have a second width which is wider than the first width along
`the side. According to such a constitution, so long as the second width fits within the
`first width, the contact surface area between the terminals and electrodes will not
`change during the pressure bonding process in which the flexible wiring board and
`substrate are pressure bonded via an anisotropic conductive film, even if there is some
`positional offset along the side on which the terminal is disposed. Therefore an electro-
`optical device with a constant fixed value for the contact resistance between terminals
`and electrodes can be obtained.
`
`0015
`
`Also, the substrate has a rectangular shape, the terminals and dummy terminals
`are disposed along the side of the substrate, and the terminals have a first width along
`that side, while the electrodes have a second width which is narrower than the first
`width along the side. The possession of a second width wider than the first width along
`the side is a feature [of the invention]. According to this constitution, so long as the
`second width fits within the first width, the contact surface area between the terminals
`and electrodes will not change during the pressure bonding process in which a flexible
`wiring board and substrate are pressure bonded via an anisotropic conductive film, even
`
`
`
`10
`
`Page 10 of 37
`
`
`
`if there is some positional offset along the side on which the terminal is disposed.
`Therefore an electro-optical device with a constant fixed value for the contact resistance
`between terminals and electrodes can be obtained.
`
`0016
`
`The substrate has a rectangular shape, and the terminals and dummy terminals
`are disposed along a side of the substrate, and terminals and dummy terminals have
`the same width along the side. Thus the terminals and dummy terminals may also be
`formed to have the same width.
`
`0017
`
`The semiconductor device has a first electrode, electrically connected via an
`anisotropic conductive film to the terminal, and a second electrode, electrically
`connected to the wiring via an anisotropic conductive film, while the first electrode has a
`third width, which is wider than the first width along the side. According to such a
`constitution, so long as the first width fits within the third width, the contact surface area
`between the terminals and electrodes will not change during the pressure bonding
`process in which the semiconductor device and substrate are pressure bonded via an
`anisotropic conductive film, even if there is some positional offset along the side on
`which the terminal is disposed. An electro-optical device with a constant fixed value for
`the contact resistance between terminals and electrodes can thus be obtained.
`
`0018
`
`Also, the semiconductor device has first electrodes, electrically connected via an
`anisotropic conductive film to terminals, and second electrodes, electrically connected
`to the wiring via an anisotropic conductive film, whereby the first electrodes have a third
`width, which is narrower than the first width [measured] along the side. According to
`such a constitution, so long as the first width fits within the third width, the contact
`surface area between the terminal and the first electrode will not change during the
`pressure bonding process in which the semiconductor device and substrate are
`pressure bonded via an anisotropic conductive film, even if there is some positional
`
`
`
`11
`
`Page 11 of 37
`
`
`
`offset along the side on which the terminal is disposed. Therefore an electro-optical
`device with a constant fixed value for the contact resistance between terminals and
`electrodes can be obtained.
`
`0019
`
`Also, the terminal has a straight shape which is essentially perpendicular to the
`aforementioned side. According to this constitution, the wiring resistance value can be
`lowered by adopting a straight shape for terminals rather than a diagonal shape so that
`the terminal is diagonal to the side of the substrate. If terminals are formed in a straight
`shape from the part contacting the flexi[ble wiring board] to the part contacting the
`semiconductor device, then a part is created in which the distance between terminals is
`larger than in other parts; however in this invention dummy terminals are provided so
`that the inter-terminal distance is essentially a uniform gap in that part, so the type of
`defect described above does not occur in the process for pressure bonding the
`terminals and the flexi[ble wiring board].
`
`0020
`
`Embodiments of the Invention
`
`Below, based on drawings, we explain an embodiment of the invention using an
`example of a simple matrix liquid crystal device.
`
`0021
`
` Fig. 1 is a perspective view schematically showing the external appearance of a
`liquid crystal device. Fig. 2 is a perspective view schematically showing an exploded
`view of the liquid crystal device shown in Fig. 1. Fig. 3 is a cross section of a liquid
`crystal device cut through line A-A’ in Fig. 1. Note that the present invention is
`characterized by the structure of the part connecting the flexible wiring board; wiring
`formed on the substrate for displaying images with a liquid crystal device is shown
`schematically in Figs. 1 and 2, and a detailed illustration thereof is here omitted.
`
`0022
`
`
`
`12
`
`Page 12 of 37
`
`
`
`As shown in Figs. 1, 2, and 3, in a simple matrix liquid crystal device 1, a pair
`
`[consisting] of glass, quartz, or plastic rectangular first transparent substrate 10 and
`second transparent substrate 20 are adhered and affixed at a predetermined gap,
`sandwiching a seal material 30. A discontinuous part is formed on seal material 30 as a
`liquid crystal injection port 301 for injecting liquid crystal, and this liquid crystal injection
`port 301 is sealed with a sealing material 302 consisting of UV-hardened resin. A liquid
`crystal (electro-optical substance) 5 is encapsulated within liquid crystal encapsulated
`region 300, segmented by seal material 30 between first transparent substrate 10 and
`second transparent substrate 20. Mutually perpendicular drive conductor patterns 15,
`25 are formed in a stripe shape of transparent ITO (Indium Tin Oxide) film or the like on
`first transparent substrate 10 and second transparent substrate 20. A drive signal for
`driving the liquid crystal in each pixel is applied to these conductive patterns. Note than
`when the liquid crystal device is of the reflective or semi-transmissive reflective type,
`these conductive patterns may form one of the electrode patterns by using a reflective
`metal film such as aluminum.
`
`0023
`
`Oriented films 101, 201 are formed on the surface of first transparent substrate
`10 and second transparent substrate 20, and various liquid crystal modes such as STN
`(Super Twisted Nematic) may be used on the surface of first transparent substrate 10
`and second transparent substrate 20.
`
`0024
`
`Pixels are constituted by liquid crystals corresponding to the intersecting parts of
`conductor patterns 15, 25. The present embodiment is a simple matrix liquid crystal
`device, therefore one of the drive conductor patterns 15, 25 functions as a scanning
`electrode to which a scan signal is applied, and the other functions as a signal electrode
`to which an image signal such as an on voltage or off voltage is applied. In addition,
`polarizing plates 19, 29 are affixed to each of the outer surfaces of first transparent
`substrate 10 and second transparent substrate 20. Also, phase differential plates are
`interposed between transparent substrates 10 and 20 to erase coloring occurring in the
`
`
`
`13
`
`Page 13 of 37
`
`
`
`liquid crystal layer as needed.
`
`0025
`
`In this liquid crystal device 1 of the present embodiment, second transparent
`substrate 20 is larger than first transparent substrate 10, and a part of second
`transparent substrate 20 projects out from one side of first transparent substrate 10. Of
`the projecting part 200 of this second transparent substrate 20, flexible wiring substrate
`connecting region 80 is formed along one side of second transparent substrate 20, and
`IC packaging region 70 is formed in parallel to flexible wiring substrate connecting
`region 80 on the interior region of this flexible wiring substrate connecting region 80. IC
`packaging region 70 is a region for packaging drive IC 7, which is a semiconductor
`device for outputting a drive signal to wiring 15, 25; flexible wiring substrate connecting
`region 80 is a region for connecting flexible wiring board 8, which supplies various
`signals and power supplies from the outside to drive IC 7, to second transparent
`substrate 20. Drive IC7 applies a drive signal to various wiring in order to drive each
`liquid crystal device pixel; the active surface is placed in opposition to the substrate in a
`chip state and packaged by the COG (Chip On Glass) method.
`
`0026
`
`When the first transparent substrate 10 and second transparent substrate 20 are
`adhered by seal material 30, the first conducting pattern formed on first transparent
`substrate 10 electrically connects inter-substrate conducting material or the like included
`in seal material 30 to the end portion of wiring 94 for conducting between substrates,
`which extends from both ends of IC packaging region 70 in second transparent
`substrate 20. Wiring 94 is electrically connected via anisotropic conductive film 6 to a
`second electrode 73, described below, provided on drive IC 7. At the same time, one
`end portion of conductive pattern 25, formed on second transparent substrate 20,
`functions as second wiring 92, electrically connected through output electrode (second
`electrode) 73, described below, provided on drive IC 7, and anisotropic conductive film
`6.
`
`
`
`
`14
`
`Page 14 of 37
`
`
`
`0027
`
`Next, using Figs. 4-7, we describe the connecting structure close to drive IC 7
`and close to flexible wiring substrate connecting region 80.
`
`0028
`
` Fig. 4 is a partial perspective view of a liquid crystal device explaining the
`connecting structure close to IC packaging region 70. Fig. 5 is a partial perspective view
`of a liquid crystal device explaining the connecting structure close to flexible wiring
`substrate connecting region 80. Fig. 6 is a partial plan view of a liquid crystal device
`explaining the connecting structure close to flexible wiring substrate connecting region
`80. Fig. 7 is a simplified cross section cut through line B-B' in Fig. 6.
`
`0029
`
`In Fig. 4, IC packaging region 70 and flexible wiring substrate connecting region
`80 are connected to multiple first terminals 91 made up of an ITO film and a conductive
`film such as aluminum film formed at the same time as drive conductive pattern 25.
`Multiple input electrodes (first electrodes) 71 and dummy electrodes 72 corresponding
`to first terminals 91 on the flexible wiring substrate connecting region 80 side are
`disposed on drive IC 7, which is disposed in IC packaging region 70, and multiple output
`electrodes (second electrodes) 73 are disposed on second wiring 92 and wiring 94, in
`one-to-one correspondence to the terminals thereof. First electrodes 71 and second
`electrodes 73 are formed in a protruding shape as bump electrodes. Here, first
`electrodes 71 are electrodes for inputting scanning signals or video signals from flexible
`wiring board 8; second electrodes 73 respectively output scanning signals and video
`signals to wiring 15 or wiring 25.
`
`0030
`
`In second transparent substrate 20, each of the multiple first terminals 91 has an
`essentially vertical straight part relative to side 120 of second transparent substrate 20,
`and some first terminals 91 have a partially diagonal wiring shape. In the flexible wiring
`substrate connecting region 80, in addition to first terminals 91, non-electrically
`
`
`
`15
`
`Page 15 of 37
`
`
`
`connected dummy terminals 93 are disposed on both conductor patterns 15 and 25,
`which are formed at the same as first terminals 91. Dummy terminals 93 have a straight
`shape essentially parallel to the straight shaped part of first terminals 91. Dummy
`terminals 93 and first terminals 91 are disposed so that the inter-terminal distance
`between adjacent terminals is essentially uniform. In addition, dummy terminals 93 and
`first terminals 91 are formed so that the widths a along side 120 of each second
`transparent substrate 20 are respectively the same.
`
`0031
`
` In Figs. 5 and 6, electrodes 82 and dummy electrodes 81 are respectively
`disposed in pairs with first terminals 91 and dummy terminals 93, disposed on second
`transparent substrate 20 on flexible wiring board 8. Electrodes 82 and dummy
`electrodes 81 are formed essentially parallel [to one another] so that the gap between
`adjacent electrodes is uniform. Stated differently, the first terminals 91 and dummy
`terminals 93 disposed on the second transparent substrate are formed to be mutually
`opposing, matching the disposition of electrodes 82 and dummy electrodes 81 on
`flexible wiring board 8. A voltage such as ground potential Vss or high voltage potential
`Vdd is supplied from flexible wiring board 8 to drive IC 7 through electrodes 82 and first
`terminals 91. Also, as shown in Fig. 7, mutually opposing electrodes 82 and first
`terminals 91, and mutually [opposing] dummy electrodes 81 and dummy terminals 93,
`are electrically connected by conductive particles 62 in anisotropic conductive film 6,
`within which conductive particles 62 are dispersed in resin 61, and second transparent
`substrate 20 and flexible wiring board 8 are adhered and affixed by the resin 61 portion
`of anisotropic conductive film 6 in a cured state.
`
`0032
`
`The following is performed in the pressure bonding process between flexible
`wiring board 8 and second transparent substrate 20.
`
`0033
`
`
`
`16
`
`Page 16 of 37
`
`
`
`First, an anisotropic conductive adhesive is coated onto second transparent
`
`substrate 20 flexible wiring substrate connecting region 80, or a sheet-shaped
`anisotropic conductive film is disposed on flexible wiring substrate connecting region 80.
`Thereafter, flexible wiring board 8 electrode 82 and dummy electrodes 81 are
`positionally registered to first terminals 91 and dummy terminals 93, superimposing
`second transparent substrate 20 and flexible wiring board 8. In this state, flexible wiring
`board 8 is pressure bonded to second transparent substrate 20 as it is heated. As a
`result, as shown in Fig. 7, the resin 61 part included in anisotropic conductive film 6 is
`melted, and conductive particles 62 conta