`
`1 . A manufacturing method of a display device comprising
`
`the steps of:
`
`forming a display panel by sandwiching a resin which is
`
`hardened by any one of electromagnetic waves , radioactive rays
`
`andelectronbeamsandheatbetweenzn1elementsubstratehaving
`
`a display region in which a plurality of light emitting elements
`
`are formed and a sealing substrate in such a manner that the
`
`10
`
`resin covers the display region;
`
`radiating at
`
`least' one of electromagnetic waves,
`
`radioactive rays and electron beams to the display panel thus
`
`hardeningfirstportionsoftheresinandleavingsecondportions
`
`of the resin in a state softer than the first portions;
`
`separating the display panel at positions corresponding
`
`to the second portions; and
`
`heating the separated display panel
`
`thus
`
`further
`
`hardening the resin.
`
`2.Thenmnufacturingnmthodofaidisplaydeviceaccording
`
`to claim 1, wherein the element substrate has a plurality of
`
`display regions , and the second portions include portions each
`
`of which is sandwiched between every two display regions out
`
`of the plurality of display regions.
`
`15
`
`20
`
`3.Themanufacturingmethodofaidisplaydeviceaccording
`
`25
`
`to claim 1; wherein the resin covers the display regions and
`
`23
`
`
`
`the second portions include the display regions.
`
`4.Themanufacturingmethodofaidisplaydeviceaccording
`
`to claim 1 , wherein at least said one of electromagnetic waves ,
`
`radioactive rays and electron beams is blocked partially in
`
`the radiation step thus leaving the second portions.
`
`5.ThenmnufacturingnmthodofEadisplaydeviceaccording
`
`to claim 1, wherein in the separation step, the display panel
`
`is separated by applying scribing to at least one of the element
`
`substrateandthesealingsubstrateand,thereafter,bybreaking
`
`10
`
`the display panel.
`
`6.
`
`A. manufacturing apparatus of a' display device
`
`comprising:
`
`a panel forming device which forms a display panel by
`
`sandwiching a
`
`resin which is hardened by any one of
`
`15
`
`electromagneticwaves,radioactiveraysandelectronbeamsand
`
`heat between an element substrate having a display region in
`
`which a plurality of light emitting elements are formed and
`
`a sealing substrate in such alnanner that the resin covers the
`
`display region;
`
`20
`
`a radiation device which radiates at
`
`least one of
`
`electromagnetir:waves, radioactive rays and electron beams to
`
`the display panel thus hardening first portions of the resin
`
`and leaving second portions of the resin in a state softer than
`
`the first portions;
`
`25
`
`a separation device which separates the display panel
`
`24
`
`
`
`at positions corresponding to the second portions; and
`
`a heating device which heats the separated display panel
`
`thus further hardening the resin.
`
`7. The manufacturing apparatus of a display device
`
`according to claim 6, wherein the radiation device partially
`
`blocks at least said one of electromagnetic waves, radioactive
`
`rays and electron beams.
`
`8. The manufacturing apparatus of a display deviCe
`
`according to clain16, wherein the separation device separates
`
`the display panel by applying scribing to at least either one
`
`of
`
`the element substrate and the sealing substrate and,
`
`thereafter, by breaking the disPlay panel.
`
`9. A display device comprising:
`
`an element substrate~which includes a display region in
`
`which a plurality of light emitting elements are formed:
`
`a sealing substrate; and
`
`a resin layer which is sandwiched between the element
`
`substrateandthesealingsubstrateandcoversthedisplayregion,
`
`wherein
`
`on at least one side of the display device, a region at
`
`an edge portion of the resin layer exhibits a higher thermal
`
`hardeningrateandaalowerradiationhardeningrateattributed
`
`to at least one of electromagnetic waves , radioactive rays and
`
`electron beams compared to a region inside the region at the
`
`10
`
`15
`
`20
`
`25
`
`edge portion of the resin layer.
`
`25
`
`
`
`
`
`10. The display device according to claim 9, wherein a
`
`regionoftheresinlayerwhichcorrespondstothedisplayregion
`
`exhibits a higher thermal hardening rate compared to the region
`
`inside the region at the edge portion of the resin layer.
`
`26
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`
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