TITLE OF THE INVENTION
`
`DISPLAY DEVICE, MANUFACTURING METHOD AND APPARATUS THEREOF
`
`CROSS—REFERENCE TO RELATED APPLICATIONS
`
`The present application claims priority from Japanese
`
`ApplicationJP2008—30952?filedonDecember4,2008,thecontent
`
`of which is hereby incorporated by‘
`
`reference into this
`
`application.
`
`10
`
`BACKGROUND OF THE INVENTION
`
`1. Field of the Invention
`
`[0001]
`
`The present invention relates to a manufacturing method
`
`of a display device, a manufacturing apparatus of a display
`
`15
`
`device, and a display device, and more particularly to a
`
`manufacturing method of a display device having a display region
`
`in which a plurality of light emitting elements are formed,
`
`a manufacturing apparatus of a display device, and a display
`
`device.
`
`20
`
`2. Background Art
`
`[0002]
`
`Recently, there has been proposed a display device which
`
`displays various kinds of information by integrating a large
`
`number of light emitting elements on a substrate . As a typical
`
`25
`
`exampleofsuchadisplaydevice,anorganicelectroluminescence
`
`
`
`DISPLAY DEVICE, MANUFACTURING METHOD AND APPARATUS THEREOF
`
`CROSS—REFERENCE TO RELATED APPLICATIONS
`
`The present application claims priority from Japanese
`
`ApplicationJP2008—30952?filedonDecember4,2008,thecontent
`
`of which is hereby incorporated by‘
`
`reference into this
`
`application.
`
`10
`
`BACKGROUND OF THE INVENTION
`
`1. Field of the Invention
`
`[0001]
`
`The present invention relates to a manufacturing method
`
`of a display device, a manufacturing apparatus of a display
`
`15
`
`device, and a display device, and more particularly to a
`
`manufacturing method of a display device having a display region
`
`in which a plurality of light emitting elements are formed,
`
`a manufacturing apparatus of a display device, and a display
`
`device.
`
`20
`
`2. Background Art
`
`[0002]
`
`Recently, there has been proposed a display device which
`
`displays various kinds of information by integrating a large
`
`number of light emitting elements on a substrate . As a typical
`
`25
`
`exampleofsuchadisplaydevice,anorganicelectroluminescence
`
`
`
`display'
`
`(OLED) which Inakes use of emission. of
`
`light by
`
`electroluminescence can be named.
`
`Conventionally, with
`
`respect to such an organic electroluminescence display,
`
`to
`
`protect elements formed on a substrate, in forming a display
`
`panel, a sealing material is applied to the substrate such that
`
`the sealing material surrounds a periphery of a display part,
`
`andsealingglassisadheredtothesubstrate. Aspaceisdefined
`
`between the substrate and the sealing glass, and an inert gas
`
`and a desiccant are sealed in the space.
`
`10
`
`[0003]
`
`The above-mentioned sealing method is referred to as
`
`hollowsealing. Suchaisealingnmthod,however,hasdrawbacks
`
`including following drawbacks. That is, it is necessary to
`
`perform working for forming recessed portions in the sealing
`
`glass. Coating of the sealing material requires time. When
`
`the sealing glass is deflected and comes into contact with an
`
`element on the substrate, there arises a possibility.that the
`
`elementisbroken. Accordingly,itispreferabletoadopttotal
`
`sealing which is a sealing method where all elements on a
`
`substratearecoveredwithaaresin,andsealingglassisadhered
`
`to the resin from above.
`
`[0004]
`
`However, the total sealing produces a panel having the
`
`structure where a hardened resin layer is sandwiched between
`
`the substrate and the sealing glass and.hence, cutting of the
`
`15
`
`20
`
`25
`
`
`
`panelbecomesdifficult. Currently,ascribe-breakmethodhas
`
`been popularly used as a method for cutting a panel. However,
`
`in applying such alnethod to the panel having the resin layer,
`
`a crack which is formed in glass in a scribing step stops at
`
`5
`
`the resin layer so that the hardened resin layer cannot be cut.
`
`Accordingly, the use of the scribe—breaklnethod gives rise to
`
`not only a possibility that a sharp cutting surface cannot be
`
`obtained but also a possibility that the panel per se is broken.
`
`[0005]
`
`10
`
`On the other hand, to increase production efficiency of
`
`display devices,
`
`it
`
`is necessary to use
`
`a
`
`so—called
`
`multiple-piecesimultaneousmanufacturingmethodwhereaipanel
`
`is prepared by forming a large number of display devices on
`
`a large substrate, and the respective display devices are
`
`15
`
`obtained by cutting the panel. Accordingly, it is necessary
`
`to apply a technique which ensures favorable cutting of a panel
`
`and enables multiple-piece simultaneous manufacturing even to
`
`the disPlay device which adopts the total sealing.
`
`[0006]
`
`20
`
`In this respect,
`
`JP—A—2005—322633 (patent document 1)
`
`describes a method where a large number of display parts are
`
`formed on a substrate, a sealing material is applied to the
`
`substrate such that
`
`the sealing material
`
`surrounds
`
`the
`
`peripheries of the respective display parts, a resin is filled
`
`25
`
`in the inside of the respective display parts surrounded by
`
`
`
`the sealing material, and sealing glass is adhered to the
`
`substrate (see Fig.
`
`2 or the like).
`
`SUMMARY OF THE INVENTION
`
`5
`
`[0007]
`
`According to the method disclosed in patent document 1.
`
`a.portion which.is not filled.with the resin is formed.between
`
`thedisplaypartsandhence,itiscmnsideredthatnoparticular
`
`problem arises in cutting a panel. However, such a method
`
`requiresacomplicatedandtime-consumingstepwherethesealing
`
`material is applied to the substrate such that the sealing
`
`material surrounds the peripheries of the plurality of display
`
`parts individually, and the resin is filled in the inside of
`
`theresPectivedisplaypartssurroundedbythesealingmaterial.
`
`Accordingly, it is impossible to sufficiently enhance the
`
`production efficiency of the display device.
`
`[0008]
`
`The present
`
`invention has been made in view of such
`
`drawbacks,anditisanobjectofthepresentinventiontoprovide
`
`amanufacturingmethodandamanufacturingapparatusofadisplay
`
`device which can favorably cut a display panel having the
`
`structurewhereairesinlayerissandwichedbetweentheelement
`
`substrate and the sealing substrate, and a display device
`
`10
`
`15
`
`20
`
`manufactured by such a method.
`
`25
`
`[0009]
`
`
`
`5
`
`10
`
`15
`
`20
`
`Tobrieflyexplainthesummaryoftypicalinventionsamong
`
`inventionsdescribedinthisspecification,theyareasfollows.
`
`[0010]
`
`(1) According to one aspect of the present invention,
`
`there is provided a manufacturing method of a display device
`
`which includes the steps of:
`
`forming a display panel by
`
`sandwiching a
`
`resin which is hardened by any one of
`
`electromagneticwaves,radioactiveraysandelectronbeamsand
`
`heat between an element substrate having a display region in
`
`which a plurality of light emitting elements are formed and
`
`a sealing substrate in such.a1nanner that the resin covers the
`
`displayregion;radiatingatleastoneofelectromagneticwaves,
`
`radioactive rays and.electron beams to the display panel thus
`
`hardeningfirstportionsoftheresinandleavingsecondportions
`
`oftheresininastatesofterthanthefirstportions;separating
`
`the display panel at positions corresponding to the second
`
`portions; and heating the separated display panel thus further
`
`hardening the resin.
`
`[0011]
`
`(2)
`
`In the manufacturing method of a display device
`
`having the constitution (1),
`
`the element substrate has a
`
`plurality of display regions, and the second portions include
`
`portions each.of‘which.is sandwiched.between every two display
`
`regions out of the plurality of display regions.
`
`25
`
`[0012]
`
`
`
`(3)
`
`In the manufacturing method of a display device
`
`havingtheccnstitution(1),theresincoversthedisplayregions
`
`and the second portions include the display regions.
`
`[0013]
`
`(4)
`
`In the manufacturing method of a display device
`
`having the constitution (1), at least one of electromagnetic
`
`waves,radioactiveraysandelectronbeamsisblockedpartially
`
`in the radiation step thus leaving the second portions.
`
`[0014]
`
`10
`
`(5)
`
`In the manufacturing method of a display device
`
`havingtheconstitution(1),intheseparationstep,thedisplay
`
`panel is separated by applying scribing to at least one of the
`
`element substrate and the sealing substrate and, thereafter,
`
`by breaking the display panel.
`
`15
`
`[0015]
`
`(6) Accordingtoanotheraspectofthepresentinvention,
`
`there is provided a manufacturing apparatus of a display device
`
`which includes: a panel forming device which forms a display
`
`panel by sandwiching a resin which is hardened by any one of
`
`electromagneticwaves,radioactiveraysandelectronbeamsand
`
`heat between an element substrate having a display region in
`
`which a plurality of light emitting elements are formed and
`
`a sealing substrate in such alnanner that the resin covers the
`
`display region; a radiation device which radiates at least one
`
`of electromagneti13waves, radioactive rays and electron beams
`
`20
`
`25
`
`
`
`to the display panel thus hardening first portions of the resin ‘
`
`and leaving second portions of the resin in a state softer than
`
`the first portions; a separation device which separates the
`
`disPlaypanelatpositionscorrespondingtothesecondportions;
`
`and a heating device which heats the separated display panel
`
`thus further hardening the resin.
`
`[0016]
`
`(7)
`
`In the manufacturing apparatus of a display device
`
`having the constitution (6),
`
`the radiation device partially
`
`blocks at least one of electromagnetic waves, radioactive rays
`
`and electron beams.
`
`[0017]
`
`(8)
`
`In the manufacturing apparatus of a display device
`
`having the constitution (6), the separation device separates
`
`the display panel by applying scribing to at least either one
`
`of
`
`the element substrate and the sealing substrate and,
`
`thereafter, by breaking the display panel.
`
`[0018]
`
`(9) According to still another aspect of the present
`
`invention, there is provided.a display device which includes:
`
`an element substrate which includes a display region in which
`
`a plurality of light emitting elements are formed; a sealing
`
`substrate; and a resin layer which is sandwiched between the
`
`element substrate and the sealing substrate and covers the
`
`display region, wherein on at least one side of the display
`
`10
`
`15
`
`20
`
`25
`
`
`
`device, a region at an edge portion of the resin layer exhibits
`
`ahigherthermalhardeningrateandaalowerradiationhardening
`
`rate attributed to at least one of electromagnetic waves,
`
`radioactiveraysandelectronbeamscomparedtoziregioninside
`
`the region at the edge portion of the resin layer.
`
`[0019]
`
`(10)
`
`In the display device having the constitution (9) ,
`
`a region of the resin layer which corresponds to the display
`
`region exhibits a higher thermal hardening rate compared to
`
`the region inside the region at the edge portion of the resin
`
`layer.
`
`[0020]
`
`According to the above-mentioned inventions,
`
`it is
`
`possibletoprovidethemanufacturingmethodofadisplaydevice,
`
`the manufacturing apparatus of a display device which can
`
`favorably cut the display'panel.having the structurtawhere the
`
`resin layer is sandwiched between the element substrate and
`
`the sealing substrate, and the display device manufactured.by
`
`the manufacturing method.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0046]
`
`Fig.
`
`1 is a schematic view of a manufacturing apparatus
`
`of a display device according to a first embodiment;
`
`Fig. 2 is a View for explaining a manufacturing method
`
`10
`
`15
`
`20
`
`25
`
`
`
`of a display device according to the first embodiment; and
`
`Fig. 3 is a View for explaining a manufacturing method
`
`of a display device according to a second embodiment.
`
`DETAIL DESCRIPTION OF THE EMBODIMENTS
`
`[0021]
`
`Hereinafter,afirstpreferredembodimentofthepmesent
`
`invention is explained in conjunction with drawings.
`
`E0022]
`
`Fig..ljs a schematiC'vieW'ofaimanufacturing apparatus
`
`1 of a display device 101 according to this embodiment. Fig.
`
`1 shows a state of the manufacturing apparatus 1 as viewed in
`
`a plan view. The manufacturing apparatus 1 is constituted of
`
`an element substrate receiving portion 2, a sealing substrate
`
`receiving portion 3, an adhesion device 4, a radiation device
`
`5 , a separation device 6 , a heating device 7 , a delivery portion
`
`8, a receiving—side conveying device 9 and a delivery-side
`
`conveying device 10.
`
`{0023]
`
`The element substrate receiving portion 2 is a buffer
`
`which receives and stocks an element substrate 20 on which a
`
`pluralityoflightemittingelementsareformed,andthesealing
`
`substrate receiving portion 3 is a buffer which receives and
`
`stocks a sealing substrate 30. The element substrate 20 and
`
`the sealing substrate 30 are conveyed from a preceding step
`
`10
`
`15
`
`20
`
`25
`
`
`
`using an arbitrary conveying means such as a conveying robot
`
`or a conveyer. The adhesion device 4 is a device which forms
`
`a display panel by adhering the element substrate 20 and the
`
`sealing substrate 30 to each other with a resin sandwiched
`
`therebetween . The radiation device 5 is a device which radiates
`
`at least one of electromagnetic waves, radioactive rays and
`
`electron beams to the display panel thus temporarily hardening
`
`the resin. Here, temporary hardening implies hardening to an
`
`extent
`
`that
`
`the resin is not completely hardened.
`
`The
`
`separation device 6 is a device which cuts and separates the
`
`display panel by a scribe—break method.
`
`[0024]
`
`The conveyance of the element substrate 20, the sealing
`
`substrate 30 and the display panel among the element substrate
`
`receiving portion 2, the sealing substrate receiving portion
`
`3,
`
`the adhesion device 4,
`
`the radiation device 5 and the
`
`separation device 6 is performed by the receiving- side conveying
`
`device 9 .
`
`In the drawing, the receiving—side conveying device
`
`9 is illustrated as a scalar—type robot provided with a suction
`
`hand. However,
`
`the receiving-side conveying device 9 is not
`
`limited to such a robot, and any device can be used provided
`
`that the device can convey the element substrate 20 , the sealing
`
`substrate 30 and the display panel.
`
`[ 0025]
`
`The heating device 7 is a device which hardens the resin
`
`10
`
`15
`
`20
`
`25
`
`10
`
`
`
`by heating the separated display panel. As the heating device
`
`7 , various kinds of heating devices such as a hot plate , a hot~air
`
`heating device or'an infrared heating device can'be used. The
`
`delivery portion 8 is a buffer which stocks an obtained display
`
`device 101 and, at the same time, delivers the display device
`
`101 to a succeeding step using an arbitrary conveyance means
`
`such as a conveying robot or a conveyer.
`
`[0026]
`
`In this embodiment,
`
`the manufacturing apparatus 1 is
`
`describedas21so—calledstation—typemanufacturingapparatus
`
`which includes the element substrate receiving portion 2, the
`
`sealing substrate receiving portion 3 and the delivery portion
`
`8 and, at the same time, performs the conveyance of the display
`
`panel among the respective devices using the robots . However,
`
`the manufacturing apparatus :1
`
`is not
`
`limited to such a
`
`station—type manufacturing apparatus, and.may be a so—called
`
`line-typenmnufacturingapparatuswhereaiproductflowstoward
`
`a down stream side from an upper stream side. Further, with
`
`respect to the respective devices , one set of device is provided
`
`for each device in the drawing. However, the number of devices
`
`for the same device is not limited, and.a plurality of devices
`
`maybeprovidedfcrthesamedevice. Further,devicesnotshown
`
`in the drawing may be provided additionally. As one example,
`
`apolishingdevicewhichpolishesanedgesurfaceoftheéfisplay
`
`device 101, a cleaning device or the like may be added.
`
`10
`
`15
`
`20
`
`25
`
`11
`
`
`
`[0027]
`
`Next, a manufacturing method of the display device 101
`
`using the manufacturing apparatus 1 is explained in conjunction
`
`with Fig. 2.
`
`[0028]
`
`A first step is a panel forming step indicated by (1a)
`
`and (lb) in Fig. 2.
`
`In this step, a resin 40 is sandwiched
`
`between an element substrate 20 and a sealing substrate 30 by
`
`an adhesion device 4 thus forming a display panel 100. The
`
`element substrate 20 and the sealing substrate 30 are introduced
`
`by the receiving—side conveying device 9.
`
`[0029]
`
`In Fig. 2, (la) is a cross section schematically showing
`
`a mode in which the resin 40 is sandwiched between the element
`
`substrate 20 and the sealing substrate 30.
`
`A plurality of
`
`display regions 21 each of which forms a plurality of light
`
`emitting elements therein are formed on the element substrate
`
`20. As shown in the drawing, a slight gap is formed between
`
`the respective display regions 21.
`
`In this embodiment,
`
`the
`
`element substrate 20 which adopts a so-called four—piece
`
`simultaneous manufacturing is shown in the drawing. That is,
`
`two display regions 21 are arranged in the long—side direction
`
`of the element substrate 20 as well as in the short—side direction
`
`of the element substrate 20 respectively so that four display
`
`regions 21 are arranged in total on the whole surface . However ,
`
`10
`
`15
`
`20
`
`25
`
`12
`
`
`
`such an element substrate 20 is illustrated for the sake of
`
`brevity, and an arbitrary number of display regions 21 may be
`
`formed on the element substrate 20.
`
`That
`
`is,
`
`six—piece
`
`simultaneous manufacturing,
`
`eight—piece
`
`simultaneous
`
`manufacturing, twenty-piece simultaneous manufacturing or the
`
`like may be adopted.
`
`It is needless to say that single—piece
`
`manufacturing in which only one display region 21 is formed
`
`on
`
`the element
`
`substrate 20 or
`
`two-piece
`
`simultaneous
`
`manufacturing in which two display regions 21 are formed on
`
`the element substrate 20 may also be adopted. Although the
`
`element substrate 20 is preferably'made of glass, the element
`
`substrate 20 may be made of other materials such.as ceramics.
`
`The resin 40 has property of being hardened by any one of
`
`electromagneticwaves,radioactiveraysandelectronbeamsand
`
`heat.
`
`Inthisembodiment,anultraviolethardeningepoxyresin
`
`is used as the resin 40. However, the resin 40 is not limited
`
`to such a resin. Further, as a method for applying the resin
`
`40 to the element substrate 20 and the sealing substrate 30,
`
`the resin 40 in a liquid form is dropped on either one of the
`
`elementsubstrateZOandthesealingsubstrateBOand,thereafter,
`
`the resin 401nay'be sandwiched between both substrates 20, 30.
`
`Alternatively,
`
`the resin 40 formed into a flexible sheet by
`
`molding may be applied to either one of the element substrate
`
`20 and the sealing substrate 30 and, thereafter, the resin 40
`
`may be sandwiched between both substrates 20, 30. Although
`
`10
`
`15
`
`20
`
`25
`
`13
`
`
`
`the sealing substrate 30 is preferably made of glass , the sealing
`
`substrate 30 may preferably be made of other materials such
`
`as ceramics.
`
`[0030]
`
`At this point of time,
`
`the resin 40 is not hardened so
`
`that the resin 40 is soft. Accordingly, when the resin 40 is
`
`sandwiched between the element substrate 20 and the sealing
`
`substrate 30, as indicated by (lb) in Fig. 213,
`
`the resin 40
`
`is deformed following the unevenness of a surface shape of the
`
`display regions 21, and is filled so as to cover at least the
`
`display regions 21 without
`
`forming any gap between both
`
`substrates.
`
`In this embodiment,
`
`the resin 40 is uniformly
`
`filled between the element substrate 20 and the sealing substrate
`
`30 over the substantially whole surface of these substrates
`
`except for edge portions of the substrates . However, the resin
`
`40 may be filled also into the edge portions of these substrates .
`
`The display panel 100 formed in this manner is conveyed to the
`
`radiation device 5 by the receiving—side conveying device 9.
`
`[0031]
`
`The next step is a radiation step indicated by (2) shown
`
`in Fig. 2.
`
`In this step, the resin 40 is temporarily hardened
`
`by the radiation device 5.
`
`In the drawing, a white bordered
`
`arrow indicates ultraviolet rays for hardening the resin . Here,
`
`depending on the property of the resin 40 , electromagnetic waves ,
`
`radioactive rays or electron beams may be radiated to the resin
`
`10
`
`15
`
`20
`
`25
`
`14
`
`
`
`40 when necessary.
`
`In this radiation step, a mask 50 is used
`
`for blocking some ultraviolet rays . The mask 50 is constituted
`
`of ray blocking portions 51 which are portions for blocking
`
`ultraviolet rays and ray transmitting portions 52 which are
`
`5
`
`portions for allowing the transmission of ultraviolet rays
`
`therethrough . First portions 41 of the resin 40 are temporarily
`
`hardened by receiving the radiation of ultraviolet rays. On
`
`the other hand, second portions 42 of the resin 40 do not receive
`
`the radiation of ultraviolet rays and hence , the second portions
`
`10
`
`42 are not hardened and remain soft. The second portions 42
`
`are formed in regions each of which is sandwiched by the display
`
`regions 21 and on edge portions of the display panel 100.
`
`[0032]
`
`Here, although the degree of temporary hardening depends
`
`15
`
`on property of the resin 40, assume a radiation quantity of
`
`ultraviolet rays for completely hardening the resin 40 as 100 ,
`
`it is preferable to set the radiation quantity of ultraviolet
`
`rays to approximately 10 to 50, and it is more preferable to
`
`set the radiation quantity of ultraviolet rays to approximately
`
`20
`
`20 to 40. Further,
`
`in this embodiment,
`
`the ultraviolet rays
`
`are not radiated to the second portions 42 so that the second
`
`portions are not hardened. However, it is not always necessary
`
`to prevent the second portions 42 from being completely hardened.
`
`As described later, provided that the second portions 42 are
`
`25
`
`soft to an extent that-the display panel 100 can be separated,
`
`15
`
`
`
`
`
`the second portions 42 may be hardened by radiating ultraviolet
`
`rays to the second portions 42 .
`
`In any case, the second portion
`
`42 remain in a soft state compared to the first portions 41
`
`which fix the positional relationship between the element
`
`substrate 20 and the sealing substrate 30.
`
`[0033]
`
`Further, in this embodiment, the radiation device 5 uses
`
`the mask
`
`50
`
`for blocking ultraviolet
`
`rays.
`
`However,
`
`ultraviolet rays may be radiated to only necessary portions
`
`10
`
`of the resin 40 without using the mask 50.
`
`[0034]
`
`After the radiation step is finished, the display panel
`
`100
`
`is conveyed to the separation device 6 using the
`
`receiving—side conveying device 9.
`
`15
`
`[0035]
`
`The next step is a separation step indicated by (3a) and
`
`(3b) in Fig. 2 .
`
`In this step, the display panel 100 is separated
`
`or divided into individual display devices 101 by the separation
`
`device 6. The separation device 6 cuts the display panel 100
`
`20
`
`by a scribe-break method.
`
`[0036]
`
`Firstly, as schematically indicated by (3a) in Fig. 2,
`
`a surface of the element substrate 20 and a surface of the sealing
`
`substrate 30 are scribed by scribing wheels 60 along lines for
`
`25
`
`separating the display panel 100, and cracks 61 are generated
`
`16
`
`
`
`on the surfaces of the respective substrates. This step is
`
`called scribing. The scribing wheel 60 is a tool having a sharp
`
`edge which is made of a super hard alloy, a diamond sintered
`
`body or the like. By pressing the scribing wheel 60 to a surface
`
`of a substrate made of glass or the like with a predetermined
`
`force, it is possible to generate cracks on the surface of the
`
`substrate . As a tool of this type, a disc—shaped scribing wheel
`
`60 used in this embodiment is often used. However, the scribing
`
`wheel 60 may have other shape such as a pin shape or a blade
`
`shape . Positions where the crack 61 is generated are positions
`
`where the display panel 100 is separated, that is, the regions
`
`each of which is sandwiched between the display regions 21 and
`
`the edge portions of the display panel 100 . At positions which
`
`correspond to such positions , the second portions 42 are formed
`
`as shown in the drawing.
`
`In this embodiment, scribing is
`
`performed from both surfaces of the display panel 100 . However ,
`
`when the display panel 100 can be cut by performing scribing
`
`only on one side, scribing may be performed only on one side.
`
`Further, Scribing may be applied to both surfaces of the display
`
`10
`
`15
`
`20
`
`panel 100 simultaneously or sequentially.
`
`[0037]
`
`Subsequently, an external force such as vibrations or
`
`bending is applied to the display panel 100 thus cutting the
`
`display panel 100 at positions where scribing is made as
`
`25
`
`schematically indicated by (3b) in Fig. 2 . This step is called
`
`17
`
`
`
`breaking. As a result, the display panel 100 is separated into
`
`the individual display devices 101 and undesired portions 102 .
`
`Asshowninthedrawing,attheperipheralportionsofthedisplay
`
`devices 101, that is, portions of the display panel 100 where
`
`the display panel 100 is cut, the resin 40 is not temporarily
`
`hardened and remain soft. Accordingly, the resin 40 does not
`
`interrupt breaking of the display panel 100 so that sharp and
`
`favorable cutting surfaces are obtained.
`
`That
`
`is,
`
`it is
`
`sufficient
`
`to cut
`
`the display panel
`
`100 at positions
`
`10
`
`corresponding to the second portions 42.
`
`The undesired
`
`portions 102 are discarded, or are collected as resources when
`
`necessary and.are recycled. The display device 101 is a part
`
`which becomes a product, and is conveyed to the heating device
`
`7 by a delivery—side conveying device 10.
`
`15
`
`[0038]
`
`The final step is a heating step indicated by (4) in Fig.
`
`2.
`
`Inthisstep,thedisplaydevice101isheatadbytheheating
`
`device 7 so that the resin 40 is completely hardened.
`
`In the
`
`drawing,
`
`in the display device 101, an inner region 43 which
`
`was the first portion 41 is completely hardened.by the heating
`
`step which comes after temporary hardening in the radiation
`
`step. Accordingly, the inner region 43 is a portion which is
`
`hardened by both the radiation of ultraviolet rays and heating .
`
`Ontheotherhand,ultravioletraysarenotradiatedtxJaregion
`
`44 which was the second portion 42 in the radiation step.
`
`20
`
`25
`
`18
`
`
`
`Accordingly, the region 44 becomes a portion which is hardened
`
`only by heating. As the position where the display panel 100
`
`is cut, a layer made of the resin 40 exhibits such composition.
`
`Accordingly, on at least one side of the display device 101,
`
`the region 44 at the edge portion of the layer of the resin
`
`40 is hardened.only by heating, while the region 43 inside the
`
`region 44 is hardened also by the radiation of ultraviolet rays .
`
`Here, when the resin 40 is hardened due to the radiation of
`
`ultraviolet rays or the like, some molecules are subjected to
`
`a.chemical change except for polymerization and.cross-linking
`
`such as breaking of molecular chains which constitute the resin
`
`40. Accordingly,somedifferenceexistsincompositionbetween
`
`the inner region 43 and the region 44 at the edge portion.
`
`[0039]
`
`Asdescribedpreviously,providedthatInnproblmnarises
`
`in the separation step, there arises no problem in slightly
`
`hardening the second portion 42 by also applying ultraviolet
`
`rays to the second portion 42. Eventually,
`
`the region 44 at
`
`the edge portion exhibits a higher thermal hardening rate and
`
`a lower ultraviolet—ray hardening rate compared to the inner
`
`region43. Thesamegoesforacasewhereelectromagneticwaves,
`
`radioactive rays or electron beams except for that ultraviolet
`
`rays are used in the radiation step.
`
`[0040]
`
`When the hardening of the resin 40 is finished in this
`
`10
`
`15
`
`20
`
`25
`
`19
`
`
`
`manner, each display device 101 is conveyed to the delivery
`
`part 8 by the delivery—side conveying device 10 . Each display
`
`device 101 is, thereafter, conveyed to a downstream step by
`
`a conveying device such as a conveyer not shown in the drawing,
`
`electronic circuits such as drivers and a frame are mounted
`
`on the display device 101 , and the display device 101 is shipped
`
`as a product by way of inspection and the like.
`
`[0041]
`
`Here , in the above—mentioned embodiment , the explanation
`
`has been made with respect
`
`to the case where the organic
`
`electroluminescence display device is used as the display device
`
`101 . The organic electroluminescence display device is roughly
`
`classified into two types of display devices consisting of a
`
`top—emission—type display device which takes out emitted light
`
`from a sealing substrate side and a bottom-emission-type display
`
`device which takes out emitted light from an element substrate
`
`side.
`
`This
`
`embodiment
`
`is
`
`applicable
`
`to
`
`both
`
`the
`
`top—emission—type display device and the bottom—emission—type
`
`display device.
`
`In the top~emission-type display device, it
`
`is necessary to form at least the sealing substrate 30 and the
`
`resin 40 using a transparent material. On the other hand, in
`
`the top~emission—type display device,
`
`the element substrate
`
`20 is transparent.
`
`[0042]
`
`Fig. 3 is a view for explaining a manufacturing method
`
`20
`
`10
`
`15
`
`20
`
`25
`
`
`
`of a display device 101 according to a second preferred
`
`embodiment of
`
`the present
`
`invention.
`
`This embodiment
`
`is
`
`substantially equal to the first embodiment except for that
`
`a shape of a mask 50 used in a radiation step of this embodiment
`
`differs from the a shape of the corresponding mask 50 used in
`
`the radiation step of the first embodiment. Accordingly, in
`
`the drawing, parts which are identical with the parts of the
`
`first embodiment are given the same symbols and.their detailed
`
`explanation is omitted.
`
`10
`
`[0043]
`
`In this embodiment, in the radiation step indicated by
`
`(2) in Fig. 3, ray blocking portions 51 of the mask 50 are formed
`
`soastoalsocoverdisplayregions21. Suchstructureisadopted
`
`for preventing breaking or a change of characteristics of minute
`
`15
`
`electronic circuits including a thin film transistor formed
`
`in the display region 21 which may be caused by the radiation
`
`of ultraviolet rays. As a result, as shown in the drawing,
`
`second portions 42 are formed also on portion of a resin 40
`
`corresponding to the display regions 21.
`
`20
`
`[0044}
`
`Thereafter,
`
`in a display device 101 which is obtained
`
`through a separation step and a.heating step which follow the
`
`above—mentioned radiation step, as shown in the drawing, on
`
`at least one side of the display region 21, a region 44 which
`
`25
`
`constitutes an edge portion of a layer made of the resin 40
`
`21
`
`
`
`
`
`is hardened only by heating, and.a region 43 Which.is arranged
`
`inside the region 44 is hardened also by the radiation of
`
`ultraviolet rays, and.a region 45 which.is arranged.inside the
`
`region 43 and corresponds to the display region 21 are hardened
`
`only by heating.
`
`{0045]
`
`It is needless to say that also in this embodiment, in
`
`thesamemannerasthefirstembodiment,providedthatnoproblem
`
`arises in the separation step,
`
`the second portion 42 may be
`
`slightlyhardenedbyalSoapplyingultravioletraystothesecond
`
`portion 42. Accordingly,
`
`the region 44 at the edge portion
`
`and the region 45 corresponding to the display region 21 exhibit
`
`a higher thermal hardening rate and a lower ultraviolet-ray
`
`hardening rate compared to the inner region 43. Further, in
`
`thesamemannerasthefirstembodiment,electromagneticwaves,
`
`radioactive rays or electron beams other than ultraviolet rays
`
`10
`
`15
`
`may be used in the radiation step.
`
`22
`
`
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