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`JP,2013~187380,A
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`Primary document l
`~.
`* NG‘i'iCE *
`we and iNPtT are not responsibie for any damages caused by the use of this transiat‘ion.
`1. This document has been translated by computer. So the translation may not reflect the original precisely.
`m . **** shows a word which cannot be tranSiated.
`
`
`
`{Patent Claims]
`[Claim 1]
`[n the fleXible circuit board, a fiexible circuit board body is constituted of an e
`xpano‘able thermoplastic eiastorner.
`-". le circuit board is characterized in that a rough surface for or
`'c
`An eia_
`eventing sticking is formed on an outer surface of a circuit board body to whi
`ch the thermoplastic elastomer is exposed.
`[Claim 2]
`The flexible flexible circuit board according to ciaim 1, wherein the circuit boa
`rd body includes an insulating base material made of a thermoplastic eiastom
`er, a wiring layer termed en the insulating base material, and an insulating la
`yer formed of a thermoplastic etastomer formed on the wiring tayer.
`[Claim 3]
`An elastic flexible -:'rcuit board according to claim 1, wherein the rough sulfa
`
`ti
`ce for preven rug sticking is constituted by a transfer pattern in which minute
`
`formed on a transfer material for rough surface forming with mi
`irregularit
`
`
`Uit board body is composed of an expandable therrriopia tic elastomer, and a
`
`rough surface for preventing sticking with minute irregularitie is formed on
`an outer surface of a circuit board body where the thermoplastic elastomer is
`exposed.
`in the method for manufacturing an elastic flexible circuit board, a rough surf
`ace forming transfer material on which minute unevenness is formed is preps
`red and a minute unevenness of a transfer material for forming a rough surfa
`ce is transferred onto an outer surface of the circuit board main body,
`[Ctaim 5]
`A meta! tail for forming a wiring iayer is laminated on one side surface 0‘ ‘n i
`ns-atating base material made of a thermopiastic elastomer, and a metal foil f
`or forming a rough surface having minute irreguiarities formed on the other 5
`ice surface is manufactured.
`
`
`A Wir
`ing layer is formed from the metal foil for forming the wiring layer.
` : single—sided metal clad plate is manutactureo' by lamina
`On the other ha
`
`I..
` a metal foil for forming a rough surface on one side of an insulating laye
`r forming material composed of a thermoplastic elastgmer, and a wiring layer
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`of the double-sided metal clad plate is laminated by the insut. ing layer forrni
`ng material of the metal clad plate.
`The method for manufacturing an elastic flexible cirCuit board is characterize
`d in that a metal foil for forming a reugh surface of the laminated double-sld
`ed metal clad plat and one side metal clad plate is removed, and a surface o
`
`
`insulating base material and an insulating layer to which
`he unevennes
`s of a meta' foil for rough surface formation is transferred is exposed
`[Claim 6]
`In the manufacturing method of an elastic flexible circuit board, a w H; laye
`r is formed -:n one side surface of an insulating base material made of a ther
`moplastic elastomer an ' the wi
`a layer is laminated by an insulating layer
`
`made of a thermoplasti“ e
`
`A pair of transfer materials on which a transfer rough surface having minute
`
`
`venness is formed by mat pr
`‘sing are prepared.
`In the method for manufacturing an elastic flexible circuit board, when an ins
`ulating layer is laminated on an insulating base material, an insulating base
`material and an insulating layer are sandwiched by the transfer material and
`a transfer rough surface for transfer of the transfer material is transferred, w
`
`hereby fine unevenness of a rough surface for transfer is transf . ed on the s
`urfat‘es of the insulating base material and the insulating layer.
`
`
`
`{Detailed description of the invention]
`|
`[1‘ chnical field]
`{0001]
`The present invention relates to an elastic flexible circuit board having wear r
`esistance and toughness and toughness and capable of beino applied to mov
`
`able parts and bent parts of industrial robots, such as industrial robots, servi
`ce and medical fields, and medical and healthcare equrnent.
`{Background of the Invention}
`[0002]
`A conventional flexible circuit board cannot be expanded or contracted in a c
`urved or planar manner, and therefore, when a movable part of a robot arm
`
`er the like is wired to a movable part or an exten: ole part, an extra length p
`art is provided.
`
`As described in Patent Document 1, a space efficiency is improved by windin
`-; up an extra length portion.
`However, even if the extra length portion is wound up, there is a problem tha
`ta storage space is also required, and when it is attached to a three dirnensi
`onal surface, there is a problem that it cannot
`e brought into close con w;
`
`and a flexible circuit board which can be expanded and contracted is
`
`Prior art reference]
`Patent document]
`
`[Problem to be solved by the invention]
`[0004]
`In order to meet such a demand, it has been studied to use a soft thermopla
`stic elastorner for an insulating base material or an ins-alating layer constituti
`rig a flexible circuit board. However, when a soft thermoplastic eiastomer is u
`sed, there is a problem that, unlike a non-stretchable flexible circuit board, t
`k'
`
`
`! :ie is a problem that it is easy to stick (ta
`ness) and is difficult to handle
`because of its adhesive property to the resin itself. In particular, when overla
`pping flexible circuit boards stick together, the eiastomer resin tends to be st
`retched, and the wiring portions do not extend, so that when the attached bo
`ards are peeled -: ffrom each other, a large amount of the board may be stre
`tched and the wiring portions may be broken.
`[0005:]
`It is an object o the present invention to provide an elastic flexible circuit bb
`m
`
`ard capable of preventing adhesion of a therrnopi
`elastorner resin. an .'
`method of manufacturing the same.
`[Means for solving the problem]
`
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`[0006]
`In order to achieve the above object, according to the present invention, ther
`e is provided an elastic flexible circuit board in which a flexible circuit board b
`edy is made of a flexible thermoplastic elastomer.
`
`
`A rough surface for preven rig sticking is formed on an outer surface of a cir
`cuit board body to which the thermoplastic elastomer is exposed.
`The circuit board body is applicable to a general configuration including an in
`sulating base material made of a thermoplastic elastomer, a wiring layer for
`med on the insulating base material, and an insulating layer formed of a ther
`moplastic elastomer formed on the wiring layer.
`The rough surface for preventing sticking can be constituted by a tr
`tern in which minute irregularities formed on a transfer material for rough su
`rface forming with minute irregularities formed thereon are transferred.
`{0007]
`In add on, a method of manufacturing an elastic flexible Circuit board accord
`
`r flexible c
`ing to the present invention is a method of manufacturing an el s.i
`ircuit board, wherein a flexible circuit board body is corriposed of a thermopla
`stic elastomer which is stretchable, and a rough surface for preventing stickin
`g is formed on an outer surface of the Circuit board body, on which the therrn
`oplastit‘ elastomer is exposed, with minute irregularities.
`Formation of a rough surface for preventing sticking of an outer surface of th
`e circuit board body is rough.
`A transfer material for forming a surface is prepared, and minute unevenness
`of a transfer material for forming a rough surface is transferred to an outer s
`urface of the circuit board main body.
`A more specific manufacturing method,
`It-
`A metai i-_iil for forming a wiring layer is laminated cn one side surface of
`nsulating base material made of a thermoplastic elastomer, and a metal foil f
` ng a rough surface h ving minute irregularities formed on the other 5
`
`ide surface is manufactured.
`A wiring layer is formed rom the metal foil for forming the wiring layer.
`0n the other hand, a single—Sided metal clad plate is manufactured by lamina
`ting a metal foil for forming a rough surface on one side of an insulating laye
`r forming material composed of a thermoplastic elastomer, and a wiring layer
`of the double—sided metal clad plate is laminated by the insulating layer forrni
`ng material of the metal clad plate.
`It is particularly preferred to remove the rough surface forming metal foil of t
`he laminated double-sided metal clad plate and one sided metal clad plate, a
`nd to expose the surfaces of the insulating base material and the insulating l
`ever on which fine irregularities of the rough surface forming metal foil have
`been transferred.
`
`It is considered as the mark.
`[0008]
`In addition, the present invention provides a method of manufacturing anoth
`er flexible flexible circuit board.
`
`H; laye
`In the manufacturing method of an elastic flexible circuit board, a w
`r is formed cn one side surface of an insulating base material made of a ther
`
`
`moplastic elastomer an ' the wi
`9 layer is laminated by an insu.
`ting layer
`made of a thermoplastic elasto ”rer.
`A pair of transfer materials on which a transfer rough surface having minute
`unevenness is formed by mat processing are prepared.
`When an insulating layer is laminated on an insulating base material. an insul
`ating base material and an insulating layer are sandwiched by the transfer m
`
`aterial and a transfer coar
`urface of the transfer material is transfer
`
`, s
`d that fine unevenness of a transfer rough surface is transferred on the surfa
`ces of the insulating base material and the insulating layer.
`[Effect of the nvention}
`[0009]
`ccording to the elastic flexible circuit board of the present invention, since t
`h K5 circuit board body is made of the thermoplastic elastomer which can expa
`
`nd and contract, even when the flexible printed circuit board is applied to the
`rnevable portion, the excessive length obition becomes unnecessary as in th
`e prior art, and the flexible printed circuit board expands and contracts follow
`ing the uneven surface even when it is attached to the uneven surface of the
`body surface or the like, and can be attached without any gap.
`Further, since minute irregularities are provided on the surface of the out rl
`
`
`ayer portion such as a
`insu -
`base material or an insulating layer, even i
`fthe substrates come into contact with each other, the surfaces are brought i
`
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`nto contact wi h each other in a dotted manner, so that sticking is hardly cau
`sed. Therefore, it is possible to realize an elastic flexible circuit board which c
`
`an be handled similarly to a general non-stretchable flexible cirCoit hoard, ha
`
`s no possib ty of disconnection one to sticking, and has high reliaoi
`ty.
`Further, according to the manufacturing method of the present invention, it i
`s possible to easily manufacture the transfer rough surface by transferring tn
`e uneven pattern of the transfer rough surface.
`Specifically, when the metal foil of the double-sided metal clad laminate an '
`the metal foil of the singie~sided metai clad laminate which are normally use
`.4
`a is used as a transfer material for the rough surface transir. , no new equip
`'rI.
`ment is required, an it is possible to mar
`
`rnetal clad laminate b
`
`y a current process in a current proce 5
`Further, if a transf:r material for transferring a rough surface is separately u
`ng a metal foil, it is possible to repeatedly use the transfer ma
`
`Description o the Drawings}
` ill-‘IG. 1 a is a schematic plan view of an elastic fleXible circuit board ac
`
`
`1 b lS a partial
`.nt invention, and FIG.
`cor-din ' to an embodiment of the or
`
`o sectional View of the flexible circuit board of FIG. 1 a ;,
`[Fig ZEFIG. 2 is a schematic process diagram of a method of manufacturing
`1
`nt in
`an elastic flexible circuit board according to an embodiment of the p.
`vention ;.
` chernatic process diagram showing a method of manufact
`lFig. 3lFtG. 3 is ;
`oring an elastic flexible circuit board according to another embodiment of the
`present invention ;.
`[Mode for carrying out the invention]
`[001 1]
`With reference to Drawings, this description of the embodiment of the inventi
`on is described in detail eirempiarily below. However, the dimensions, materi
`als, shapes, and relative arrangements of the components described in the fo
`ilowing embodiments will he described.
`it is not intended to be exhaustive or to limit the scope of the invention to an
`y particular description.
`
`l—‘I-is. 1 shows an elastic fleXible circuit board according to an embodiment oft
`he present invention,
`in this fleXible circuit board 1,. a flexible circuit board main body 10 is constit
`uted of a flexible thermoplastic elastomer, and a rough surface 3 a and a ran
`
`gh surface 7 a for pr venting sticking w: h minute irregularities are formed 0
`n an outer surface of the circuit board main body 10 exposing the thermopias
`tic eiastomer.
`The circuit board body 10 has a constitution of a single side circuit structure,
`and has an insulating base material 3 made of a thermoplastic elastomer, a
`
`
`‘Ji ng layer 5 formed on the insulating base material 3, and an insulating iay
`er 7 made of a thermoplastic elastomer formed on th wiring layer 5.
`[0013]
`
`As thermoplastic elastomer, they are a polyurethane system elastomer and a
`
`styrene thermoplastic eiastc ier, An olefin thermoplastic elastomer, a vinyl c
`hioride thermoplastic elastomer, an ester thermoplastic elastomer, an amide
`thermoplastic elastomer, a 1,2 - 8R thermoplastic elastomer, a fluorine ther
`moplastic elastomer, and the like can be used. In View of mechanical strengt
`n and abrasion resistance, it is preferable to use a urethane-based elastome
`
`3014]
`
`The stretchable Wiring layer 5 h .’u w a zigz. 9 pattern shape of a waveform and
`can be expanded and contracted in a shape. The Wll’lflg layer 5 is not limited
`to a 2 ozeg shape as shown in the drawing, and may be formed by various pa
`tterns such as a snake shape and a horseshoe shape.
`0015]
`In the present invention, the front surface of the insulating base material 3 a
`
`no the insulating layer 7 made of a thermopl
`ic elastomer constituting the
`circuit board body 10 is formed as a rough surface 3 a, 7 a for preventing sti
`cking, which has been subjected to matte processing The pattern of the roug
`h surface may be roughened in an irregular scattering spot, a regular pattern
`or a linear pattern, and is not particularly limited.
`In this example, as the transfer material, a material harder than a thermopla
`stic elastomer such as a metal or a hard resin is used as a transfer material
`
`r '
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`which is formea by transferring minute unevenness formed on a transfer mat
`erial for forming a rough surface on which fine unevenness is formed, as a tr
`ansfer material, such as a metal or a hard resin, and the like, and the rough
`surface 3 a, 7 a, and the like.
`[0016]
`According to the stretchable flexible circuit board 1 of the present embodime
`n'r, since the insulating base member 3, the insulating layer 7, and the wirin
`layer 5 are expandable and contractible, even when applied to a movable per
`
`tion, the excess length portion becom-s unnecessary as in the prior art, and i
`
`
`tcan be adhered to the surface shape in accordance with a thr
`dimensional
`surface of the body surface or the like.
`Further, since the outer surfaces of the insulating base material 3, the insulat
`
`lng layer 7, and the like are roughened surfaces 3 a and 7 a for preventing st
`l King, which have minute irregularities, even if the substrates come into con
`tact With each other. they come into contact with each other in a scattered st
`ate, and thus adhesion is hardly caused. Therefore, it is possible to realize an
`elastic flexible circuit board which can be handled similarly to a general non~s
`tretcha'ole flexible circuit board, has no possibility of disconnection due to stic
`king, and has high reliability.
`l0017]
`The size of the unevenness of the rough surfaces 3 a, 7 a for preventing
`
`lng va. as depending on the hardness and the tackiness of the thermoplastic
`elastomer, and is set according to the degree of sticking. if it is too small, th
`e contact area is increased, and if it is too large, the insulating layer 7 is lowe
`red in insulating property, so that it is set to an appropriate range.
`When urethane elastomers of hardness HS A 60 of hardness are used, 10 p
`dint average roughness R2 is preferably 1.9 u m or more. Further, an upper li
`mlt is preferably about 7.0 u n”.
`Note that, in this example, the rough surfaces 3 a and 7 a for preventing
`
`esion are formed over the entire outer surfaces of the insulating base materi
`al 3 and the insulating layer 7, but in some cases, only one surface or partiall
`y may be provided.
`{0018]
` ‘odlment of the present invention i...-
`._E
`[Embodiment 1]
`Next, a method of manufacturing the flexible circuit board will be described.
`PEG. 2 shows an embodiment 1 of a method of manufacturing an extensible fl
`exible circuit board having a single-sided circuit configuration.
`
`The manufacturing method in this embodiment includes 4 steps of a manufac
`turing process of a double-sided copper~clad laminate, is single~sided circuit t:
`oard manufacturing process, an insulating layer laminating process, and an u
`peer and lower copper foil removing process.
`
`(1) A process for producing double-sided copper-clad laminate ;
`in w3
`a
`..own in FIG. 2 a, a wiring layer forming copper foil 50 serving as a
`al foil for forming a wiring layer is laminated on one side surfa
`an ins
`
`
`ulta ing base material 3 made of a tt <rmoplastic elastomer, and m
`
`
`te proje
`ctions and recesses are formed on the other side of the insulating base mater
`:al.
`
`A double—sided metal clad plate 300 laminated with a rough surface forming
`copper foil 30 as a rough surface forming metal foil formed is manufactured.
`The bonding surface of the rough surface formino copper foil 30 with the insu
`lating base material 3 has a rough surface profile having a predetermined sur
`face roughness. During this lamination, the rough surface profile 30 a of the
`rough surface forming cooper foil 30 is transferred to the insulating base mat
`eriai 3.
`l0
`0]
`Since the rough surface forming cooper foil 30 is directly laminated to the ins
`ulating base material 3 without using an adhesive since it is necessary to tra
`nsfer the rough surface profile, an adhesive layer may he interposed so long
`as the rough surface profile 30 a of the rough surface forming copper foil 30
`can be transferred.
`[0021]
`(2) a single-sided circuit board manufacturing process ;
`Next, as shown in FIG. 2 b, a wiring layer 5 having a predetermined pattern l
`5 formed from the other wiring copper foil SO by etching, while leaving the re
`ugh surface forming copper foil 30.
`{0022]
`
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`(3) An insulating layer lamination process ;
`Next, as shown in HS. 2 d, an insulating layer 7 made of a thermoplastic ela
`stomer is laminated on the surface of the insulating base material 3 on the w
`iring layer 5 side. In this case, as shown in FIG. 2 c, a single-sided copper-cl
`ad laminate 700 in which a copper foil .70 for rough surface formation is lami
`nated on one surface of an insulating layer 7 made of thermoplastic elastome
`r is prepared beforehand.
`The bonding surface of the rough surface forming copper foil 70 with the insu
`iating layer 7 has a rough surface profile havihg a predetermined surface rou
`ghfieSS. During this lamination, the rough surface profile .70 a of the rough su
`
`rface forming copper foil 70 is trans <l red to the insulating layer 7. in a lami
`nation of a single-sided copper-clad laminate 7f‘i), an insulating layer 7 made
`of a thermoplastic elastdmer of " single-sided copper-clad plate 700 is super
`posed oh a surface of an insulating ase material 3 on which a wiring layer 5;
`is formed to cover a wiring layer 5,
`{0023
`(4) a step of removing rough surface forming copper foil ;
`Then,
`.he rough surface forming copper foils 30,70 70 are removed from the
`
`surfaces of the
`sulaling base material 3 and the insulating layer 7, and the
`rough surfaces 30 a, 7 a of the insulating base material 3 and the insulating l
`
`ayer 7 surface on which the rough s
`‘ ce profile of the rough surface formin
`g copper foil 3 is transferred are exposed.
`The rough surface forming copper foil 30,70 is removed by etching. The expo
`sed terminal portion is masked.
`As described above, according to the manufacturing method of the present e
`mbodimeht, it is possible to form a rough surface in a manufacturing process
`and a material used in a normal manufacturing process of a flexible circuit bo
`ard such as the double-sided copper-clad laminate 3GB and the single—sided c
`oppe.-clad laminate 700, and it is also unnecessary to provide a special man
` acturing facility.
`{0024]
`:'E Ibodiment 2]
`Next, in FIG. 3, a 2 embodiment of the present invention is described,
`
`In Embodiment 2, one side of the insulating base 3 made of tliermopiast ‘
`astomer is provided with wiring lines,
`A layer 5 is formed and a wiring layer 5 is laminated by an insulating layer 7
`made of a thermoplastic elastorner.
`At the time of laminating, transfer materials 30 a, 70 a for forming rough sur
`faces having minute irregularities are prepared, For example, a material such
`as PET or the like, which has a higher hardness than a thermoplastic elastom
`er, such as PET, and does not cause sticking, is selected for the rough surfac
`
`e forming transfer ma
`ials 30 A and 70 A. Surfaces of the transfer material
`30 A and 70 A for rough surface formation have a rough surface profile.
`[0025]
`According to this manufacturing method, in the laminating process of the ins
`
`ulating layer 7, by pressing the transfer rough surface of the transfer materia
`iagaihst the insulating base material 3 and the insulating layer, minute irreg
`ularities 70 a and 30 a can be formed on the sui
`
`-es of the insulating base
`material 3 and the insulating layer 7.
`[0026]
`
`
`
`[Evaluation test]
`Next, a test for evaluating ad lesion o the elastic flexible circuit board of the
`present invention will be describe ,
` Evaluation tests produced a plurality of test samples and tested for stic
`i. Test Purpose
`To confirm a tack reducing effect by an adhesion preventing roughened surfa
`ce formed on a surface of an eiast
`
`Xible circuit board,
`[0027]
`A. Test Method
`2- 1) Preparation of test samples
`
`n / test sampl
`In the construction of the copper foil for rough surface form.
`e/ PEl' (release sheet), pressing was performed under the following press co
`nditions.
`Press conditions : 100 ° C., 5 sec - 30 sec, 2 MPa.
`The test sample is a thermoplastic urethahe sheet, and has 3 kinds of copper
`foils A (surface roughness : 0.7.7 p m), copper foil 5 (surface roughness : 1.9
` ss : surface roughness : t u m) diffe
` id copper foil B (surface roug
`rent in surface roughness. A copper foil C (surface roughness : 2.5 p m) was
`
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`prepared, and the uneven shape
`xace was transferred to a test sam
`ple, and the surface was pressed ente both sides of a PET (release sheet) wit
`
`h a Surface roughness of approximately 0 p m instead of a copper foil for rpu
`gll surface formation 3:; a comparative sample.
`In order to be bended to the test sample, the copper foil for rough surface to
`rmation was etched away using an etching apparatus, and the rough surface
`for preventing adhesion to which the unevenness of the copper foil for rough
`surface formation was transferred was exposed.
`[0028]
`
`2) Confirmation of blocking
`x 2
`About a comparison sample and the test samples 1, 2, and - (mm [ SO
`00 mm}, it piled up so that the two-sheet and split-far
`
`together, respectively, and it inserted into the griddle who;
`he, and neglected it by 23 degreeC t r 1 hour.
`A rul‘ber sheet was sandwiched between the test sampks 1. and 2,3 and the
`iron plate so that the pr:ssure was uniformly applied. ’l'
`0112. (calculated from the iron plate weight).
`For this test sample 1, 2, 3, the blocking strength was measured (23 ° C.) by
`a method of T-type peel test.
`aJ.
` shown in Table i, in comparison with the comparative example having a
`urface roughness of approximately C, no improvement in bloclcing was obser
`ved in the test sample 1 having a surface roughness of 0.77 p m. In Samples
`2 and 3 having a surface roughness of 1.9 u m or more, improvement in bloc
`king was observed.
`On the other hand, when the surface roughness is 2.5 p m, it is considered t
`
`hat the surface roughness tends to in-.rease
`.ghtly, and it is considered effe
`ctive to set the surface roughness to about 2.5 u m.
`[0029]
`
`
`
`[0030]
`In addition, although an extensible flexible circuit board hav'ng a single—sided
`m
`m
`
`xtendable r rcuit body 10 in the above em
`rircuit configuration is used as
`
`bodiment, a double—sided circuit structure in which stretchable w
`9 pattern
`a are provided on both surfaces of an expandable insulating base material 3
`or a multilayer structure in which 3 or more wiring layers are stacked may be
`used.
`
`Further, although the expandable wiring portion has a pattern shape that can
`be expanded and contracted in terms of shape, the wiring poition may be for
`med of a material that can expand and contract in the conductor itself of the
`Wiring portion, rather than a configuration in which the wiring portion expand
`s and contracts in a shape.
` ; an extensible material of the conductor itself, for e ‘ nple, a carbon nanet
`ube rubber composition described in the known conductive rubber W02009/1
`02 A77 can be used.
`[Explanation of letters or numerals]
`[0031]
`1 stretc able flexible circuit board
`to circuit board body
`3 insulating base material, 5 wiring layer, 7 insulating layer
`Rougnened surface for preventing sticking of 3 a, 7 a
`300 double—sided metal clad plate
`30 rough surface forming copper foil. 30 a rough surtace profile, and 50 wrrin
`g layer forming copper foil
`700 single-sided copper-clad laminate
`70 rough surface forming copper foil and 7G a rough surface profile
`Transfer rnaterial for forming rough surface 30 a, 70 a
`
`
`
`
`
`30l9l'1l/l5
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`(P0101)
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