Title of Invention:
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`SEMICONDUCTOR MODULE
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`Electronic AcknowledgementReceipt
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`Application Number:
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`16968772
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`International Application Number:
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`Confirmation Number:
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`5787
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`
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`ee
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`Paymentinformation:
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`Submitted with Payment
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`File Listing:
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`42b25
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`Pages
`Multi
`File Size(Bytes)/
`DocumentDescription
`Document
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`
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`Number Message Digest|Part/.zip|P (if appl.)
`1034315
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`Information Disclosure Statement (IDS)|P201007US00_IDS_07_13_202
`e524165409592fa865ef9aal b54bd03e1db
`Form (SB08)
`1.pdf
`
`

`

`Information:
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`AU.S. Patent Number Citation or a U.S. Publication Number Citation is required in the Information Disclosure Statement (IDS) form for
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`Foreign Reference
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`JP2004-214452A_MT.pdf
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`6480150
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`9f3a66ce1 e522d688c6bal 273aSfe123a9e9)
`c76f
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`1113484
`
`the application.
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`New Applications Under 35 U.S.C. 111
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`National Stage of an International Application under 35 U.S.C. 371
`If a timely submission to enter the national stage of an international application is compliant with the conditions of 35
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`Information:
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`Information:
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`Non Patent Literature
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`P1015432EP01_EPSR_210413.
`pdf
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`00cd55ad0998039c006f1 9128cf64fd63489}
`of22
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`This AcknowledgementReceipt evidences receipt on the noted date by the USPTO ofthe indicated documents,
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