module
`
`including
`[0003] For
`
`M.
`
`radio-frequencycircuit.
`"A 77-GHz SiGe
`
`Single-Chip
`
`Four-Channel
`
`ANTENNA-INTEGRATED MODULE AND RADAR DEVICE
`
`BACKGROUND
`
`1. Technical Field
`[0001] The present disclosure relates to a module structure in a wireless communication
`device such as a mobile terminal or a radar device. For
`the present disclosure
`example,
`relates to a small module in which a
`radio-frequency circuit and an antenna are
`integral
`with each other in a millimeter-wave band and to a radar device including the small
`module.
`
`2.
`
`in a wireless communication
`
`reducing
`
`the size of a
`
`Description of the Related Art
`[0002] There have been attempts to achieve integration
`device or a radar device
`a millimeter-wave for the purpose of
`using
`an antennaand a
`
`example,
`Wojnowski,
`Transceiver Module with Integrated
`Electronic Components and Technology Conference, May. 2012, pp.1027-1032
`(hereinafter referred to as Non-Patent Literature 1) discloses an
`antenna-integrated module
`in which a
`surrounding region of a semiconductor chip is expanded by using
`an
`insulating
`material layer, and an array antenna madeupofa plurality of antenna elements is disposed
`in the expanded region.
`[0004] However, the conventional
`on the semiconductor
`
`Antennas in Embedded Wafer-Level BGA
`
`Package,"
`
`of Non-Patent Literature 1 necessitates
`
`technique
`the same numberof external terminals for
`
`chip,
`providing,
`as the number of
`connection with the antenna elements
`in the
`disposed
`expanded region
`antenna elements. This leads to a risk of an increase in size of the semiconductorchip.
`
`SUMMARY
`
`an
`
`[0005] One
`non-limiting and exemplary embodiment provides
`antenna-integrated
`module in whicha plurality of antenna elements can be disposed without increasing the
`size of a semiconductor chip, and a radar device including the antenna-integrated module.
`In one
`disclosed here feature an
`general aspect, the
`techniques
`antenna-integrated
`one or more semiconductor
`a
`a silicon substrate,
`each
`including:
`chips
`having
`stacked on
`first surface of the silicon substrate, and one or more
`frequency
`insulating layer that surrounds the one or more semiconductorchips;
`a re-
`converters;
`distribution layer that is stacked on a first surface of the insulating layer and ona first
`1
`
`[0006]
`
`module
`
`metal
`
`layer
`
`an
`
`P681442
`
`

`

`one or morefirst antenna elements that are
`
`onthefirst
`
`surface of the metal layer;
`provided
`surface of the metal layer with a first conductor pattern and that are connected to the one
`or more
`frequency converters; and one or more second antenna elements that are
`provided
`on a first surface of the re-distribution
`stacked on the
`with a second conductor pattern
`first surface of the
`
`insulating layer
`
`layer
`and that are connected to the one or more
`
`frequency
`
`converters.
`
`to the present disclosure, it is possible
`[0007] According
`elements without increasing the size of a semiconductorchip.
`or
`It should be noted that general
`specific embodiments may be implemented
`a
`an
`or any
`computer program, a
`
`to
`
`dispose
`
`a
`
`plurality of antenna
`
`as a
`
`storage medium,
`
`[0008]
`
`system,
`
`method,
`
`integrated circuit,
`
`a
`
`selective combination thereof.
`
`advantages
`
`ofthe disclosed embodiments will become
`
`[0009] Additional benefits and
`and
`apparent from the
`
`specification
`
`drawings.
`
`The benefits and/or
`
`advantages may be
`the various embodiments and features of the
`and
`
`obtained
`
`individually
`by
`drawings, which need not all be provided
`and/or advantages.
`
`specification
`in order to obtain one or more of such benefits
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0010]
`
`Fig.
`
`a
`
`configuration of a semiconductor
`| is a cross-sectional view illustrating
`an
`antenna disclosed in Patent Literature 1;
`an outline structure of an
`
`integrated patch
`chip including
`2 is a cross-sectional view
`
`antenna-integrated
`
`Fig.
`illustrating
`module disclosed in Non-Patent Literature 1;
`3 is a
`an outline structure of the
`
`view
`
`antenna-integrated
`
`module
`
`Fig.
`plan
`illustrating
`disclosed in Non-Patent Literature 1;
`4A is a
`an outline configuration of an
`top viewillustrating
`to Embodiment | of the present disclosure;
`according
`4B is a cross-sectional view illustrating
`an outline configuration of the antenna-
`Fig.
`to Embodiment | of the present disclosure;
`integrated module according
`5 illustrates functional blocks of the antenna-integrated module according
`Fig.
`Embodiment 1 ofthe present disclosure;
`6A is a cross-sectional view
`
`Fig.
`
`antenna-integrated module
`
`to
`
`Fig.
`
`a
`
`module
`
`way in which the
`illustrating
`antenna-integrated
`to Embodiment1 of the present disclosure is mounted;
`according
`6B is a
`a way in which the antenna-integrated module according
`plan view illustrating
`Fig.
`to Embodiment1 of the present disclosure is mounted;
`2
`
`P681442
`
`

`

`7 illustrates functional blocks of the antenna-integrated module according
`Fig.
`Embodiment 2 of the present disclosure;
`8A illustrates an
`of a
`
`Fig.
`
`example
`
`phase
`
`to
`
`difference between antenna
`
`systemsofthe
`
`antenna-integrated module;
`8B illustrates an
`
`Fig.
`
`example
`
`of a
`
`phase
`
`difference between antenna
`
`systems of the
`
`antenna-integrated module;
`8C illustrates an
`example of a
`
`Fig.
`
`phase difference between antenna systems of the
`
`Fig.
`
`Fig.
`
`an outline structure of an
`
`antenna-integrated module
`
`antenna-integrated module;
`9A is a
`top viewillustrating
`to Embodiment3 of the present disclosure;
`according
`9B is a cross-sectional view illustrating
`an outline structure of the antenna-integrated
`to Embodiment 3 of the present disclosure;
`module
`according
`10Ais a cross-sectional view
`a state where an
`
`Fig.
`
`illustrating
`antenna-integrated
`to Embodiment4 of the present disclosure is mounted; and
`according
`10B is a
`a state where the antenna-integrated module according
`plan view illustrating
`Fig.
`to Embodiment4 of the present disclosure is mounted.
`
`module
`
`Underlying Knowledge Forming Basis of the Present Disclosure
`First, underlying knowledge forming the basis of the present disclosure is
`[0011]
`described. The present disclosure relates to a small module in which a
`radio-frequency
`circuit and an antennaare
`with each other in a millimeter-wave band.
`integral
`and an antenna
`[0012] To reduce the size of a module in which a
`radio-frequencycircuit
`are
`integral with each other, the radio-frequency circuit is formed on a semiconductor chip
`a CMOS process, and the antenna is formed
`at low cost, for example, by integration using
`on a PCB
`a module in
`to
`(Printed Circuit Board). Itis conventionally general
`provide
`whicha radio-frequency circuit and an antenna are
`integral with each other by mounting
`on a PCB on which an antenna is formed.
`integrated semiconductor chip
`integrated semiconductor chip
`[0013] However, the method of separately producing
`and an antenna and
`on a PCB on which the
`the
`semiconductor
`
`DETAILED DESCRIPTION
`
`an
`
`an
`
`integrated
`mounting
`antenna is formed hasa risk of an increase in
`
`chip
`a decrease in
`
`production cost,
`reliability
`and an increase in connection loss between the
`
`caused
`
`the
`
`by
`implementation,
`semiconductor chip and the antenna caused by
`
`a
`
`implementation variation.
`
`P681442
`
`

`

`101 includes the semiconductor substrate 103,
`[0016] The semiconductor chip
`102 madeup ofa plurality of insulating layers
`multilayer distribution portion
`122 that are stacked on the semiconductor substrate
`plurality of metal distribution layers
`103, and a
`conductor 125.
`grounded
`In the antenna
`
`[0017]
`
`in metal
`
`[0018] Furthermore,
`
`a feeder line 111 and a
`
`conductor 113 are
`grounded
`so as to form a
`microstrip line, and a slot
`specific region overlapping the feeder
`
`portion 11A,
`Mi and
`layers
`Mj, respectively,
`disposed
`as a
`primary radiation source in a
`112 is provided
`line 111 in the grounded conductor 113.
`in a metal layer Mback on a surface of the
`a radiator 1141s provided
`to the multilayer distribution portion
`semiconductor substrate 103
`102. The
`opposite
`antenna in a desired frequency band by adjusting the
`
`Application Publication No. 2013-247493
`Japanese Unexamined Patent
`[0014]
`arrangement in which a radio-
`(hereinafter referred to as Patent Literature 1) discloses an
`circuit and a
`antenna are formed on the same semiconductor substrate.
`
`frequency
`
`[0015]
`
`Fig.
`
`patch
`1 is a cross-sectional view
`
`a
`
`of a semiconductor
`
`configuration
`illustrating
`antenna described in Patent Literature 1. In
`
`101
`
`chip
`
`including
`
`an
`
`integrated patch
`
`antenna is constituted
`
`by
`11B that are formed on an
`
`Fig. 1,
`an
`
`the semiconductor
`
`antenna
`
`portion
`
`101
`
`chip
`11A and a
`
`including
`integrated patch
`radio-frequency circuit portion
`identical semiconductor substrate 103.
`
`the
`
`a
`
`121 anda
`
`radiator | 14 can
`
`as a
`
`operate
`patch
`radiator 114 to a desired resonant
`
`in-plane
`loss. In view of this, metal TSVs
`radiator 114 at intervals that are
`
`an
`
`in
`
`frequency.
`Inacase where the semiconductor substrate 103 is thick,
`[0019]
`electromagnetic
`wavealso diffuses in an
`direction of the semiconductor substrate 103, resulting
`115 are
`around the
`(Through-Silicon Vias)
`provided
`to or less than 1/4 of the wavelength of the
`equal
`wave in the semiconductor substrate 103. The presence of the TSVs 115
`electromagnetic
`wave.
`inhibits unnecessary diffusion of an
`
`a transistor 124 is formed on the
`
`electromagnetic
`In the radio-frequency circuit portion 11B,
`[0020]
`semiconductor substrate 103, and a
`radio-frequencycircuit is realized by using lines of the
`metal layers and metal vias 123 that connect the metal layers and the transistor 124.
`to such a
`line made up ofthe feederline
`the
`microstrip
`on the semiconductor substrate 103
`
`[0021] According
`111 and the
`
`grounded
`
`configuration,
`conductor 113 is
`
`provided
`11B
`
`shared
`
`the
`
`circuit
`
`by using
`by
`radio-frequency
`portion
`11B. Furthermore, the antenna
`122 shared bythe radio-frequency circuit portion
`as a
`primary radiation source in a
`11A in whichthe slot 112 is provided
`4
`
`the metal distribution
`
`layers
`
`portion
`
`specific portion
`
`P68 1442
`
`

`

`facing the feederline 11 in the grounded conductor 113 and the radiator 114 is formed on a
`rear surface of the semiconductor substrate 103 is provided. This allows the radio-
`antenna to be
`circuit and the
`
`patch
`
`frequency
`[0022] However, in the
`configuration
`loss in a
`103
`has
`
`large
`
`produced together.
`of Patent Literature 1, the semiconductor substrate
`band,andit is difficult to obtain
`
`high gain
`
`generally
`radio-frequency
`in the case of an
`antenna suchas an
`on-chip
`integrated patch
`[0023] Furthermore, in a case where an array antenna is provided by disposing
`plurality
`of antennas on the semiconductorsubstrate 103, it is necessary to increase the size of the
`101 in accordance with the size and the numberof antennas. This
`
`antenna.
`
`a
`
`semiconductor chip
`leads to an increasein cost.
`
`In
`
`For
`
`provided
`
`aligning
`
`intervals of
`
`antennas that constitute an array antenna are
`[0024]
`disposed
`general,
`in a case where an
`array antenna is
`1/2 of the free space wavelength.
`example,
`elements, the antenna elements are
`four 80 GHz antenna
`by
`disposed
`of a side of
`1.9mm. This makes it necessary to set the
`approximately
`101 to 6 mm or
`the semiconductor chip
`elements.
`
`at intervals of
`
`at
`
`length
`in consideration of the size of the antenna
`
`longer
`
`[0025] Non-Patent Literature 1 discloses another arrangement in which a
`surrounding
`an
`region of a semiconductor chip is expanded by using
`insulating material layer and an
`array antenna is disposed
`in the expanded region.
`2 is a cross-sectional view illustrating
`module 201 disclosed in Non-Patent Literature 1. In
`
`[0026]
`
`Fig.
`
`integrated
`
`an outline structure of an antenna-
`
`Fig. 2, the antenna-
`Microwave
`
`Integrated Circuit) chip
`
`(Monolithic
`so as to
`
`module 201 includes a MMIC
`
`203
`
`integrated
`an
`
`202,
`
`MMIC
`
`of the wiring
`202.
`
`material
`insulating
`layer
`provided
`expand
`a re-distribution layer 204, and an antenna 205.
`chip 202,
`204 is provided
`Inthe antenna-integrated module 201, the re-distribution layer
`[0027]
`a module in which the surrounding region of the MMIC
`202 is expanded by the
`203. The antenna 205 and a
`209 whose one endis
`insulating material layer
`connected to the antenna 205 are
`
`wiring
`in the re-distribution layer
`provided
`209 is connected to an external terminal 210
`on the MMIC
`
`a
`
`surrounding region
`
`of the
`
`on
`
`chip
`
`204. The other end
`
`provided
`
`chip
`
`[0028] The
`antenna-integrated
`208 made of a
`206. A reflection
`
`copper foil is
`plate
`patterned
`that faces the antenna
`205, thereby making the antenna 205 unidirectional.
`
`on a surface of the PCB 207
`
`module 201 is mounted on a PCB 207 via solderballs
`
`P681442
`
`

`

`[0029]
`
`Fig.
`
`an outline structure of the antenna-integrated
`3 isa plan viewillustrating
`3 is a view obtained
`module 201 disclosed in Non-Patent Literature 1.
`
`Fig.
`The antenna 205 formed
`
`Specifically, Fig.
`2 is viewed from the side on whichthe re-distribution
`
`by using
`
`the re-distribution
`
`204 is
`
`layer
`
`provided
`
`not
`
`204
`
`layer
`
`whenthe structure of
`
`202 but on the
`
`chip
`
`expanded insulating
`
`material
`
`203.
`
`is
`
`provided.
`on the MMIC
`
`layer
`to the
`2 and 3, it is
`illustrated in
`[0030] According
`configuration
`Figs.
`possible
`a module integrating the antenna 205 without increasing the size of the MMIC
`chip
`on the
`Furthermore, because of the arrangement in which the antenna 205 is provided
`insulating material layer 203, the antenna 205 can have higher gain than that in an
`on the MMIC
`arrangementin which the antenna 205 is provided
`202.
`chip
`to the configuration of the antenna-integrated module 201 of
`209 that connects the antenna 205 and the MMIC
`
`[0031] However, according
`Non-Patent Literature 1, the
`202 is
`in
`
`long, resulting
`
`large
`
`loss.
`
`wiring
`
`to obtain
`
`202.
`
`chip
`
`in
`
`a
`
`[0034]
`
`accomplished by
`
`to the arrangement in which the
`[0032] Furthermore, according
`antenna-integrated
`module 201 is mounted on the PCB 207,
`it is difficult to
`dispose the solder balls 206 in
`209 are
`regions where the antenna 205 andthe wiring
`provided. This restricts a
`region
`where the solder balls 206 are
`disposed. That is, it is difficult to obtain reliability
`mounting the antenna-integrated module 201.
`[0033] Furthermore, in a case where an array antenna is provided by disposing
`plurality
`of antennas, the number of external terminals 210 increases in accordance with the number
`of antennas. As a
`202 becomes
`result, the size of the MMIC
`chip
`large.
`In view of such circumstances, the present disclosure was
`on
`in an
`at which antenna elements are
`disposed
`antenna-integrated
`focusing
`positions
`on an
`module in which a semiconductor chip and a
`plurality of antenna elements disposed
`a
`insulating material layer expanding
`surrounding region of the semiconductor chip
`
`are
`
`provided.
`[0035] Embodiments of the present disclosure are described in detail below with
`Note that the embodiments below are
`reference to the drawings.
`examples, and the present
`disclosure is not limited to these embodiments.
`
`Embodiment 1
`
`an outline
`
`of an
`
`4A is a
`
`[0036]
`
`Fig.
`
`module 1
`
`according
`
`top view
`antenna-integrated
`illustrating
`configuration
`4B is a cross-
`to Embodiment 1| of the present disclosure.
`Fig.
`according
`an outline configuration of the antenna-integrated module 1
`sectional view illustrating
`to Embodiment1 of the present disclosure.
`6
`
`P681442
`
`

`

`[0037] As illustrated in
`an
`
`semiconductor chip 2,
`5.
`
`Figs.
`
`4A and 4B, the antenna-integrated module | includes a
`a re-distribution layer 4, and a conductorplate
`
`insulating layer 3,
`
`22,
`
`a metal
`
`circuit 6
`
`layer
`
`(see
`
`2 includes twofirst antenna elements 21,
`[0038] The semiconductor
`chip
`a silicon substrate 23, and external terminals 24, and a
`radio-frequency
`that is a
`converter is mounted on the semiconductor
`
`chip
`antennas formed from a conductive
`
`2.
`
`Fig. 5)
`frequency
`[0039] The first antenna elements 21 are
`on-chip
`22 and are
`on the metal layer
`spaced away from each other by
`predetermined
`22 is stacked on oneof surfaces ofthe silicon substrate 23. On
`interval. The metal layer
`an internal wiring for connection with a transistor and the like included
`the metal layer 22,
`in the silicon substrate 23 and the external terminal 24 are
`provided. The silicon substrate
`the transistor and the like. The external
`
`pattern
`
`a
`
`23 is a semiconductor substrate
`
`including
`terminals 24 are terminals for connection with second antenna elements 31
`
`(described
`
`on the re-distribution
`
`4.
`
`2
`
`22
`
`2 is
`
`layer
`later) provided
`so as to surround the semiconductorchip
`3 is provided
`[0040] The insulating layer
`a surface of the
`except for the side on which the metal layer
`22 is stacked and to
`expand
`4 is stacked on the surface of the metal layer
`22. The re-distribution layer
`metal layer
`and a surfaceof the insulating layer
`so as to expandthe surface of the
`3 that is provided
`22.
`metal layer
`[0041] Thatis, in the antenna-integrated module 1, the semiconductor chip
`3 and the re-distribution
`embedded in the
`4.
`
`layer
`32 are formed from a
`
`insulating layer
`[0042] The two second antenna elements 31 and
`wirings
`on the re-distribution
`4. The second antenna elements 31 are
`conductive pattern
`layer
`on the re-distribution layer
`4 so as to be located abovethe insulating layer
`provided
`4A. The two second antenna elements 31 are
`viewed in the top view illustrated in
`Fig.
`same line as the twofirst antenna elements 21 so as to
`on the substantially
`provided
`sandwichthefirst antenna elements 21. The two second antenna elements 31 are
`
`3 when
`
`spaced
`predeterminedinterval.
`away from the respective
`by
`32 are metal patterns that are
`integral with the second antenna
`[0043] The wirings
`32 that are not in contact with the second antenna
`elements 31. Ends of the
`
`twofirst antenna elements 21
`
`a
`
`elements 31 are
`
`electrically
`
`wirings
`connected to the external terminals 24
`
`provided
`
`on the metal
`
`22.
`
`layer
`on a surface of the insulating layer
`5 is provided
`[0044] The conductor plate
`to the surface on whichthe re-distribution layer
`4 is provided.
`7
`
`opposite
`
`3 that is
`
`P681442
`
`

`

`[0045] Next, functional blocks of the antenna-integrated module | are described. Fig.
`is a
`diagram illustrating the functional blocks of the antenna-integrated module 1
`to Embodiment1 of the present disclosure.
`module 1 has four
`[0046] The
`semiconductor
`
`antenna-integrated
`
`2. The
`
`chip
`
`radio-frequency
`
`radio-frequencycircuits
`circuits 6 are realized
`
`by amplifiers, mixers,
`
`according
`
`6 within the
`
`5
`
`or
`
`21 are
`
`the like
`(notillustrated).
`[0047] Two out of the four radio-frequency circuits 6 are connected to the respective
`on the metal layer
`first antenna elements 21
`22. Since the first antenna elements
`provided
`22 of the semiconductor chip 2, there is no terminal
`on the metal layer
`provided
`connecting the radio-frequency circuits 6 and the first antenna elements 21.
`According
`to suppress connection loss betweenthe radio-frequency
`this arrangement, it is possible
`circuits 6 and the first antenna elements 21.
`
`two
`
`to
`
`remaining
`
`twothat are not connectedto the first antenna elements 21 out of
`
`respective
`4. Since the second antenna elements 31
`
`two second antenna
`
`[0048] The
`the four
`
`elements 31
`
`are
`
`circuits 6 are connected to the
`radio-frequency
`on the re-distribution layer
`provided
`4 so as to be located outside the semiconductor
`onthe re-distribution layer
`provided
`chip 2, the external terminals 24
`connecting the radio-frequency circuits 6 included in the
`2 and the second antenna elements 31 exist.
`semiconductor chip
`[0049] Assumethat Fig.
`a
`to the semiconductor chip
`signal input
`elements 21 and the second antenna elements 31 via the four
`
`device,
`
`2 is radiated from the first antenna
`
`5 illustrates a transmission module used in a transmission
`
`6.
`
`radio-frequencycircuits
`reception device, the
`reception
`Fig.
`to that in the case of a transmission module.
`opposite
`Ina case where an array antennais provided by connecting
`[0050]
`a
`antenna structure in which an
`each of the four radio-frequencycircuits 6,
`high gain
`unnecessary radiation component is suppressed is obtained bysetting
`the antenna elements to the length that is substantially the same as the wavelength of a
`transmission signal.
`in a free space in a 80 GHz bandis substantially
`a half wavelength
`[0051] For
`example,
`In acase where an
`array antenna made up ofan array of four antenna elements is
`1.9mm.
`of 6 mm or
`is needed in a direction in which the antenna
`
`Assumethat
`
`5 illustrates a
`
`module usedin a
`
`signal
`
`flow is
`
`an antenna element to
`
`an interval between
`
`the
`
`provided,
`elements are
`
`length
`
`disposed
`the four antenna elements are
`
`longer
`in consideration of the size of each antenna. In a case whereall of
`on the semiconductorchip 2, the chip size becomes
`provided
`cost becomes high.
`
`large, and the production
`
`8
`
`P681442
`
`

`

`[0052] Meanwhile, in a case where the four antenna elements are
`provided
`2 but on the re-distribution layer
`4 in order to suppress the production
`semiconductor chip
`a
`2 to each antenna element becomes
`from the semiconductor
`and
`long,
`large. Furthermore, in a
`on the re-distribution
`layer 4, four
`on the
`
`provided
`external terminals for connection with the antenna elements needbe
`
`cost,
`
`chip
`wiring
`connection loss with each antenna element becomes
`
`accordingly
`case where the four antenna elements are
`
`not on the
`
`provided
`
`semiconductorchip
`In the present embodiment, two antenna elements are
`provided
`two antenna elements are
`provided outside the
`semiconductor chip 2, and the remaining
`2 to be suppressed
`2. This allows the size of the semiconductor chip
`semiconductor chip
`3 mm ona side. With the arrangement, it is possible
`to suppress the
`approximately
`cost without
`the size of the semiconductor
`
`2.
`
`[0053]
`
`production
`
`increasing
`
`on the
`
`to
`
`since the
`
`of a
`
`wiring
`
`length
`madeshort, it is also
`
`from the semiconductor
`
`chip
`to suppress connection loss with each antenna element.
`
`possible
`to
`keep the numberof external terminals connecting the
`Furthermore, it is possible
`2 and the antenna elements downto two.
`semiconductor chip
`
`2. Furthermore,
`chip
`2 to each antenna element can be
`
`to the arrangement, the areas of the second antenna
`[0054] Furthermore, according
`4 can be made small.
`32 on the re-distribution layer
`elements 31 and the wirings
`a way in which the antenna-integrated module | described aboveis
`[0055] Next,
`mounted is described. The following describes a way in which the antenna-integrated
`on a PCB
`module 1 is mounted as a BGA
`6A isa
`using
`balls.
`
`solder
`
`Fig.
`
`module
`
`package, it
`In
`
`Fig.
`
`P681442
`
`package
`by
`a
`way in which the
`6B is a
`
`view
`
`cross-sectional view
`
`[0056]
`
`antenna-integrated
`according
`illustrating
`a
`to Embodiment 1 is mounted, and
`way in which the
`Fig.
`plan
`illustrating
`6B is a
`to Embodiment | is mounted. Fig.
`plan view
`antenna-integrated module according
`obtained in a case wherethestructure of Fig.
`6A is viewed from the side on which there-
`4 is provided.
`distribution layer
`6A and 6B, the antenna-integrated module 1 is mounted on
`Asillustrated in
`Figs.
`by usingthe solder balls 8 and a conductor pattern 9.
`the PCB 7
`Inacase where the antenna-integrated module 1 is mounted as a BGA
`[0057]
`is necessary to increase the numberofsolder balls 8 in order to
`the
`improve
`reliability.
`the present embodiment, since the areas of the second antenna elements 31 and the
`wirings
`32 are
`to increase the numberofsolder balls 8 as illustrated in
`kept small, it is
`possible
`6B, thereby improvingthe reliability of mounting.
`
`

`

`[0058] Furthermore, in the case illustrated in
`6A and 6B, the conductor pattern 9 is
`Figs.
`portions of each surface of the PCB 7 except for portions
`in
`facing the first
`provided
`antenna elements 21 and the second antenna elements 31. With the arrangement, the
`as a reflection
`a radio waveradiated from the
`5 operates
`conductor
`plate reflecting
`plate
`first antenna elements 21 and the second antenna elements 31. This allows the radio wave
`to be radiated so as to pass through
`the PCB 7.
`Ina millimeter-wave band, both ends of a terminal for outputting
`[0059]
`signal
`a groundterminal in a
`element that is outside a semiconductor chip need be surrounded by
`case where a in order to suppress connection loss between elements. Accordingly,
`a
`in a millimeter-wave band to a
`ground terminals are needed in order to output
`signal
`as the numberof external terminals 24 becomes larger,
`single external element. That is,
`on the semiconductor
`2 becomes
`the number of
`terminals
`and
`
`X
`
`a
`
`to an
`
`two
`
`chip
`
`larger
`
`ground
`
`provided
`2 becomes
`
`larger.
`some ofa
`
`of antenna elements are
`
`the size of the semiconductor
`
`reliability of mounting
`mounted on the PCB 7
`
`chip
`In the present embodiment,
`[0060]
`plurality
`provided
`on the semiconductor chip
`2. This allows the number of external terminals for output from
`2 to an outside suchas the re-distribution layer
`4 to be kept small.
`the semiconductor chip
`to the present embodiment, antenna elements of an
`[0061] As described above, according
`array antenna can be disposed
`to a half
`at
`predeterminedintervals (e.g., intervals equivalent
`2. Furthermore, the
`wavelength) without increasing the size of the semiconductor chip
`a
`gain of the array antenna can be made high by making
`wiring for connection with each
`antenna element short and
`connection loss.
`thereby suppressing
`[0062] Furthermore, since the areas of the second antenna elements 31 and the
`wirings
`32 to the second antenna elements 31 on the re-distribution
`4 can be made small, the
`layer
`can be improvedin a case where the antenna-integrated module | is
`by using the solderballs 8.
`[0063] Note that it is desirable that the first antenna elements 21 and the second antenna
`elements 31 described in the present embodiment have a differential configuration.
`Ina
`as in a
`case of a
`antenna used in a millimeter-wave band,
`single-end input
`microstrip
`a method
`ground is needed. However, in the case of a semiconductor chip produced by
`such as aCMOS
`such as a
`process,it is difficult to
`ideal
`provide
`conductor can be
`
`planar
`ground
`In a case where antenna elements are
`
`a
`
`although
`
`mesh-shaped
`
`provided.
`4 like the second antenna elements 31, ideal
`the re-distribution
`provided by using
`layer
`can be provided
`in the re-distribution layer 4, but it is difficult to obtain a
`ground
`broadband antenna characteristic because the re-distribution layer
`4 is generally thin
`10
`
`P681442
`
`conductor
`
`

`

`(several
`
`tens of um) and thus the distance between the antenna elements and the groundis
`
`Inthe present embodiment, since antenna elements havea differential
`to
`is not needed. This makes it
`ideal
`the influence of
`
`keep
`possible
`the antenna elements tolerant of an
`
`low, thereby making
`of antenna elements
`
`a differential
`
`having
`
`antennas.
`
`close.
`
`[0064]
`
`ground
`configuration,
`on the antennas
`
`the
`
`ground
`
`environmental fluctuation.
`
`7 is a
`
`Examples
`antennas and loop
`configuration include dipole
`5 is used as a
`[0065] Furthermore, in the present embodiment, since the conductor plate
`can be provided. This
`reflection plate, unidirectional antennas usingthe reflection plate
`to
`improve the antenna
`makes it possible
`gain of the antenna-integrated module.
`Embodiment 2
`[0066] Next, Embodiment 2 of the present disclosure is described. A structure of an
`to the present embodimentis similar to that
`module 1
`antenna-integrated
`according
`described with reference to
`4A and 4B, and
`thereof is omitted.
`Figs.
`description
`diagram illustrating functional blocks of a communication device
`[0067]
`Fig.
`to Embodiment2. In
`including the antenna-integrated module 1
`according
`5 are
`functional blocks that are identical to those in
`
`Fig. 7,
`given identical reference signs,
`Fig.
`7 is obtained by adding phase
`and description thereof is omitted. The configuration of Fig.
`adjusting circuits 10-1 and amplitude adjusting circuits 10-2 to the configuration of Fig.
`5.
`The functional blocks of the communication device including the antenna-integrated
`circuits 10-1 connected to
`module 1 include the
`circuits 6
`
`included in the semiconductor
`
`phase adjusting
`2 and the
`
`radio-frequency
`
`circuits 10-2.
`
`amplitude adjusting
`chip
`circuits 10-1 are circuits for
`of an
`the
`[0068] The
`phase adjusting
`adjusting
`phase
`input
`signal, and the amplitude adjusting circuits 10-2 are circuits for adjusting the amplitude of
`an
`
`input signal.
`to the present embodiment can be provided,
`[0069] The communication device according
`an
`antenna-integrated module 1 on a PCB
`for example, by mounting
`byusing solderballs
`8 as illustrated in
`6A and 6B. In this case, the phase adjusting circuits 10-1 and the
`Figs.
`amplitude adjusting circuits 10-2 are included in the PCB 7. Note that the phase adjusting
`circuits 10-1 and the
`circuits 10-2 may be included in the
`
`amplitude adjusting
`2 of the
`
`semiconductor
`
`chip
`
`In the
`
`antenna-integrated
`module 1 of Embodiment1, the first antenna elements
`[0070]
`antenna-integrated
`21 and the second antenna elements 31 are
`in a vertical
`on different planes
`disposed
`direction (thickness direction) of the antenna-integrated module 1.
`11
`
`module 1.
`
`Accordingly,
`
`a
`
`phase
`
`P681442
`
`

`

`difference between the first antenna elements 21 and the second antenna elements 31 is
`
`determined on the basis of a radio wave radiation direction and a difference in the vertical
`
`direction between the
`
`on which the antenna elements are
`
`disposed.
`planes
`module 1 of Embodiment 1, since the
`[0071] Furthermore, in the
`antenna-integrated
`of the first antenna elements 21 is different from that of the second antenna
`
`configuration
`elements 31, the
`output signal
`input signal
`amplitude
`elements 21 is different from that of the second antenna elements31.
`
`of an
`
`or an
`
`of the first antenna
`
`adjustment
`
`Inthe present embodiment, the phase adjusting circuits 10-1 and the amplitude
`[0072]
`adjusting circuits 10-2 are connectedto the radio-frequency circuits 6. With the
`or
`arrangement, the amplitude and phase of a
`output to the four radio-
`signal that is input
`frequency circuits 6 are
`[0073] Phase
`described.
`
`8A
`
`diagrams illustrating
`
`difference
`
`adjusted.
`in the communication device of the present embodimentis
`an
`8C are
`of a
`
`Figs.
`phase
`example
`through
`8A is a
`between antenna
`module 1.
`systemsof the
`antenna-integrated
`Fig.
`diagram
`phase difference between antenna systems in a direction vertical to
`planes
`illustrating
`which the antennas are
`8B is a
`provided (a direction in which the antennas
`face). Fig.
`phase difference between antenna systems in a direction inclined
`diagram illustrating
`with respect to the direction in which the antennas face in a case where the antenna
`a
`elements are
`8C is a
`on an identical plane. Fig.
`provided
`diagram illustrating
`phase
`difference between antenna systems in the inclined direction in a case where the antenna
`elements are
`on different
`planes.
`8C, the interval d is an interval between the antenna
`[0074]
`Figs.
`through
`elements, and the distancet is a difference in the vertical direction between the
`planes
`which the antenna elements are
`Note that a case where an antenna element 81
`
`a
`
`a
`
`provided
`
`In
`
`8A
`
`on
`
`on
`
`provided
`Note also that an antenna element 83 and the antenna element 82
`
`provided
`
`disposed.
`and an antenna element 82 are combined is a case where the antenna elements are
`on an identical plane.
`to the first antenna element 21 and the second antenna element31,
`correspond
`respectively, and a case where the antenna element 83 and the antenna element 82 are
`combinedis a case where the antenna elements are
`on different planes.
`In the
`it is assumed that the communication device ofthe
`[0075]
`following description,
`present embodimentis a transmission device that radiates a radio wave from each antenna
`element. In a case where the communication device of the present embodimentis a
`reception device that receives a radio wave from each antenna
`element, the term "antenna
`
`12
`
`P681442
`
`

`

`radiation direction" in the following description is replaced with the term "antenna
`reception direction".
`[0076] Asindicated
`Fig. 8A,
`by
`difference between the antenna elements is zero in a case where an antenna
`the
`
`the antenna element 81 and the antenna element 82 in
`
`phase
`radiation direction is the direction in which the antenna elements face and where the
`
`antenna elements are
`
`in an identical
`
`as indicated
`
`the
`
`disposed
`
`a
`
`plane. Meanwhile,
`disposed
`by
`antenna element 83 and the antenna element 82 in
`Fig. 8A, the phase of the antenna
`element 83 and the phase of the antenna element 82 differ by the distancet in the direction
`in which the antenna elements face in a case where the antenna elements are
`in
`disposed
`different planes. That is, in a case where antenna elements are
`in different planes,
`in consideration of the distancet.
`the phase adjusting circuits 10-1
`adjust the phases
`the antenna element 81 and the antenna element 82 in
`[0077] Asindicated
`Fig. 8B,
`by
`difference between antenna elements is d x sin® in a case where an antenna radiation
`
`phase
`direction is inclined with respect to the direction in which the antenn