*
`
`*
`
`NOTICE
`JPO and INPIT are not responsible for any damages caused by the use of this translation.
`1. This document has been translated by computer. So the translation may not reflect the original precisely.
`****
`shows a word which cannot be translated.
`2.
`3. in the drawings, any words are not translated.
`
`Publication Number
`
`JP2062329637A
`
`Bibliography
`(19) [Publication country] JP
`(12) [Kind of official gazette] A
`(11) [Publication number] 2002329637
`(43) [Date of publication of application] 20021115
`(54) [Title of the invention] METALLIZATION FILM CAPACITOR
`(51) [International Patent Classification 7th Edition]
`HO1G 4/18
`
`[Fi]
`HO1G 4/24
`
`301 G
`
`301A
`
`(21) [Application number] 2001130778
`(22) [Filing date] 20010427
`
`(71) [Applicant]
`[Name] HITACHI AIC INC
`
`(72) [Inventor]
`[Full name] MUROGA KAZUO
`[Full name] YOSHIHARA TAKAO
`[Full name] TAKAHASHI KAZUYA
`[Full name] KODAIRA HIDEK]
`{Theme code (reference)]
`5E082
`
`[F-term (reference) ]
`5E082 AAO1 ABO3 ABO4 BC35
`
`Abstract
`
`

`

`(57) [Overview]
`a metallization film capacitor for automating
`PROBLEM TO BE SOLVED: To provide
`manufacturing process easily, preventing insulating failure, dimension fault, outer shape
`failure, and the like, and improving characteristics.
`SOLUTION: The resin-sealed metallization film capacitor 11 where a
`capacitor element
`7 is accommodated in a resin case
`4, has a
`tongue & at a
`position that opposes an inner
`side surface 5 of the resin case
`4, withdraws the tongue 5 toward the side of the opening
`4, and at the same time connects a terminal 3 in contact with the
`inner side surface 5 to the capacitor element 1 by maintaining spring action.
`
`end of the resin case
`
`a
`
`Claim
`
`[Patent Claims]
`a metallized film capacitor in which a
`capacitor element is housed
`[Claim 1] To provide
`in a resin case and resin-sealed. The metallized film capacitor has a
`tongue piece ata
`to an inner side surface of the resin case, and the tongue piece is
`position opposed
`pulled out toward an
`opening end side of the resin case and a terminal contacting the
`a
`inner side face is connected to the capacitor element while maintaining
`spring action.
`[Claim 2] The metallized film capacitor according to claim 1, wherein an
`angle at which
`the tongue piece contacts the inner surface of the resin case is larger than 40 degrees.
`
`Description
`{Detailed description of the invention]
`
`[000 1}
`[industrial field of application] The present invention relates to a metallized film capacitor
`in which a
`resin, and more
`capacitor element is housed in a case and is sealed with a
`to a
`chip-type metallized film capacitor.
`
`particularly,
`
`{0002}
`[Prior art] In order to achieve miniaturization and high functionality of electronic devices,
`various efectronic components have been formed into chips. 2 types of metailized film
`are used :
`case-type and mold-type.
`capacitors
`[OO03}The first encased type metallized film capacitor 20 has a structure as shown in
`FIG. 4, for example. In other words, a metallized film is laminated and wound to form a
`a
`metallikon layer 21 on an end surface to form a
`capacitor element 22. Then,
`capacitor
`a terminal 23 processed with a lead frame connected to a metallikon
`element 22 having
`layer 21 is housed in a resin case
`24, and an
`insulating resin 25 is filled in the resin case
`a side wail of the resin
`24 to be resin-sealed. The terminal 23 is drawn and bent along
`
`

`

`case 24.
`
`{O004}in this metallized film capacitor 20, in order to make the position of the capacitor
`element 22 in the resin case 24 and the position of the capacitor element 22 in the resin
`case 24 accurately
`constant when the capacitor element 23 after the connection of the
`terminal 23 is housed in the resin case, the terminal and the resin case 24 are fixed with
`a
`jig. In this state, the resin case 24is filled with an
`
`insulating resin 25 and is resin-sealed.
`
`fO005]
`
`to be solved by the invention] However, the operation of incorporating the
`{Problem
`capacitor element 22 and the resin case 24 into the jig before resin sealing is usually
`performed manuaily and is difficult to automate. As a
`result, the position of the capacitor
`element 22 in the resin case 24 tends to vary easily. Therefore,
`even when the resin
`sealing process is performed, it is liable to be exposed from the resin filled with the
`capacitor element, and thus, there is a
`disadvantage in that it tends to be defective in
`insulation, dimensional defect, and appearance.
`to facilitate automation of a
`[OOO06}To improve the above drawbacks,
`manufacturing
`process, to prevent insulation failure, dimensional defect and appearance defect.
`
`a metallized film capacitor which can be stopped and improved in
`To provide
`characteristics.
`
`[0007]
`[Means for solving the problem] In order to solve the above problem, the present
`to claim 1 relates to a metallized film capacitor in which a
`invention according
`capacitor
`element is housed in a resin case and sealed with a resin. A tongue pieceis provided at
`a
`to an inner side face of the resin case, and the tongue piece is pulled
`position opposed
`out toward the opening end side of the resin case and a terminal contacting the inner
`a
`side face is connected to the capacitor element while maintaining
`spring action.
`a
`{OOO8}in other words, according to the present invention,
`tongue piece is provided ata
`position of the terminal opposed to an inner side surface of the resin case.
`Further, since
`out toward the open end side of the resin case and is in contact
`the tongue piece is pulled
`with the inner side surface of the resin case in a state in which the spring action is
`on the inner side surface of the resin case, and
`maintained, the tongue piece is caught
`a
`large resistance force is exerted on the inner side face of the resin case.
`Accordingly,
`even when the capacitor element after connecting the terminal is held in the resin case,
`the capacitor element can be held at a
`predetermined position in the resin case without
`exposing the capacitor element from the resin case. Even if the resin caseis filled with
`insulation failure, dimensional defect and appearance defect can be
`the resin case,
`
`

`

`prevented.
`fOO0g}Especially the present invention of Claim 2 provides the metailized film capacitor
`with which the angle ({ hereinafter referred to as "/" / an
`angle of inclination ]) to which
`a
`contacts the inner side surface of a resin case was
`
`enlarged
`tongue-shaped piece
`rather than 40 degree. According to the present invention, by making the inclination angle
`to
`of the tongue piece larger than 40 degrees, the resistance against the farce tending
`so that it can be
`project the capacitor element out of the resin case can be increased,
`easily heid at a
`predetermined position in the resin case.
`[Embodiment of invention]
`an embodiment of the invention is described based on
`Drawings. In
`{001 O}Hereinafter,
`FIG. 4 (a) and FIG. 2 (B), reference numeral 1 denotes a
`capacitor element which is
`a metallized film and winding the laminated film so as to be
`formed by laminating
`flattened. The metallized film is a
`polypropylene film or a
`polyethylene terephthalate film.
`a meta! such as Al or Zn to a thickness of 150
`A metal thin film is formed by depositing
`to400 A ona
`polymerfilm such as a
`polyphenylene sulfide film or a
`polyparaphenyiene
`a
`margin portion at one end in the longitudinal direction.
`phthalamide film while leaving
`Then, 2 sheets of the metailized film are stacked with their margins reversed, and a film
`a
`for sealing is wound around the outermost circumference and heat-sealed.]. Further,
`as an
`metallikon layer 2 made of a metal such as an Sn alloy
`or solder is provided
`on an end surface of the wound element to form a
`electrode for drawing
`element 1.
`
`capacitor
`
`elongated Feor the like plated
`a terminal 3 made of a metal plate such as an
`{007 1}Then,
`with solder on the surface is connected to the metallikon layer 2.
`
`a side surface of the resin case
`itis carrying out. The terminal 3 is drawn and bent along
`4. The terminal 3 is provided with a
`tongue piece 6 at a
`position facing the inner side
`face 5 of the resin case 4. The tongue 6 is drawn toward the opening end 7 side of the
`°
`°
`resin case
`and maintains a
`4, and has an inclination angle @ of 0
`<0 <90
`spring action
`and contacts the inner surface 5. it is to be noted that the inclination angle 9 is preferably
`larger than 40 degrees, and the resistance against the force for projecting the capacitor
`element 1 out of the resin case 4 can be increased. Further,
`a square hole 8 is provided
`in advanceof the tongue piece 6 of the terminal 3 to facilitate the operation of connecting
`or the like. An insulating resin 10 such
`the terminal 3 to the metallikon layer 2 by welding
`as an epoxy resin is filled in the resin case 4 and is sealed with resin.
`{0012}As shown in FIG. 1 (B), in the resin case
`4, 2 sides 9 in the longitudinal direction
`of the capacitor element 1 are chamfered obliquely. Therefore, when the flat capacitor
`
`

`

`projection
`or
`
`element 7 is housed, it is more similar to the shape of the capacitor element 7 than a
`case which is net chamfered, and the amount of the insulating resin to be filled can be
`a minute
`can be reduced. Further, by providing
`reduced, and the size and weight
`on the inner surface 5 in contact with the tongue piece 6 of the resin case
`4,
`a groove into which the tip end of the tongue piece
`6 is fitted, the tip of
`by providing
`the tongue piece 6 can be easily caught by the inner side face 5. Therefore, the
`resistance against the force for projecting the capacitor element 1 to the outside of the
`resin case 4 can be increased. The resin case 4 is filled with an
`insulating resin 10 such
`as an epoxy resin and is sealed with a resin.
`a method of manufacturing the above-described metallized film capacitor 11
`{001 3}Next,
`will be described. First, 2 metallized films are stacked one on another and madeflat.
`on an end surface of the element after
`Next, an Sn alloy
`or the like is thermaily sprayed
`to form a metailikon layer 2, thereby forming
`capacitor element 1. After forming
`winding
`the metallikon fayer 2, the capacitor element 1 is heat-treated at a
`temperature of about
`°
`C. for about 1 to about 2 hours to heat shrink the metallized film. After the
`100 to 150
`
`a
`
`heat treatment, the barrier of the metallikon layer 2 is removed. After this deburring
`a
`to the capacitor element 7 to self-heal. After this voltage
`voltage is applied
`operation,
`treatment, the capacitance is checked.
`a lead frame
`a lead frame. That is,
`{0014}Further, the terminal 3 is formed by processing
`12 having 2 or more sets of terminals 3 facing each other is formed as shown in FIG. 2
`(A) by punching out an iron plate
`or the like which has been plated with solder on its
`as shown in FIG. 2 (b),
`a
`surface. In this punching step,
`portion of the capacitor element
`1 which is used as the terminal 3 is cut upward and raised to form a
`tongue piece 6, and
`a square hole 8 is formed in a
`as shown
`position ahead of the tongue piece 6. Thereafter,
`in FIG. 2 c, at least a
`portion of the terminal 3 including the tongue 6 and the portion
`connected to the capacitor element 1 is bent downward at a
`right angle.
`a metaillikon layer 2 is provided at the bent portion of the
`[OO15}As shownin FIG. 3 (A),
`lead frame 12.
`
`or the like.
`
`The capacitor element 1 is connected by soldering, welding,
`is housed in the resin case 4
`as shown in FIG. 3 b, the capacitor element 1
`[0016}Next,
`together with a
`part of the lead frame 12.
`a lead frame 12 is grasped
`a
`capacitor element 1 is housed in a resin case
`4,
`{007 7jAfter
`a
`jig, and a
`is conveyed to a
`predetermined position of a resin
`capacitor element 7
`by
`casting device together with a resin case 4. Then,
`as shown in FIG. 3 c, an
`insulating
`resin 10 such as an epoxyresin is filled into the resin case 4 almost up to the height of
`
`

`

`the capacitor element 1 by the casting apparatus. After filling the insulating resin 10,
`treatment
`is performed, and the insulating resin 10 and the gas in the
`defoaming
`capacitor element 1 are
`dischargedto the outside of the resin case 4. After the defoaming
`treatment, the filled insulating resin 10 is thermally cured.
`{001 8}After the heat curing treatment, the lead frame 12 is cut to separate the capacitors
`
`individually.
`fo019}After the lead frame 12 is cut, as shown in FIG. 1, the insulating resin 10 is filled
`again into the edge of the opening end 7 of the resin case 4 and is
`cured. By
`thermally
`this 2 filling process of the insulating resin 10, holes generated in the insulating resin 10
`filled in the 1 time during the defoaming processarefilled.
`{[0020}Thereafter, the terminal 3 drawn out of the resin case 4 is bent along
`surface of the resin case 4 to form a metallized film capacitor 11.
`
`an outer
`
`{002 1]
`a tensile force when a
`capacitor element before resin
`[Examples] in the following,
`sealing is drawn out of a resin case is measured for an embodiment of the present
`invention. A sample used for the measurement is a rated 560V,0.68uF, and is a
`an
`metallized film capacitor before being sealed by
`insulating resin only by storing the
`in a resin case.
`a terminal
`capacitor element
`in the measuring method,
`Further,
`connected to a
`capacitor elementis fixed bya jig with a lead-out side of a terminal facing
`a contact of
`upward, and when a resin case is held by another jig and pulled downward,
`a
`tongue piece with respect to an inner side surface of a resin case is released, and a
`tensile force when a
`out of a resin case is measured. Further,
`capacitor element is pulled
`the conditions of each embodiment are as follows °.
`
`fOO22}(Example 1)
`Capacitor element : A metallized polyethylene terephthalate film having
`a thickness of
`4.4 m is wound, flattened, and a metallikon layer made of an Sn alloy is formed on an
`a
`end surface, and a
`longer diameter is 11.2, and a shorter diameter is
`length is 10.0,
`7.2.
`The terminal is made of an iron plate plated with solder at a wall thickness of 0.2,
`length
`a width of 1.3, a
`of 11.2, and a width of 4.5, and has a
`height of cut and
`length of 1.2,
`=
`a
`an average value of 0.98 (o
`0.01), and an inclination
`raised (including
`thickness),
`angle of about 40.5 degrees.
`Resin case : a structure as shownin FIG. 4 and a thickness of 0. 7.
`
`a
`
`length of 9.6, and a
`A length of 13.0,
`Sample number: 19.
`
`a
`
`height of 7 are
`
`provided.
`
`

`

`fOO23}in Example 2, the same conditions are used except that the average value of the
`=
`cut-over
`height of the tongue of the terminal is set to 0.73 (o
`0.01) and the inclination
`angle of the terminal is set to approximately 26.4 degrees (o
`{0024}The tensile strengths of Examples 1 and 2 are 954 g (o
`182 g) and 285 g (o
`in other words,
`392 g) respectively.
`in the range in which the pull-out direction faces
`toward the open end side of the resin case, the height of the tongue piece is high, and
`the larger the inclination angle is, the more difficult the capacitor element is drawn out of
`the resin case and the larger the resistance force and the *.
`
`=
`
`1).
`=
`
`=
`
`{0025}
`[Effect of the Invention] As described above, according to the present invention of claim
`a metallized film capacitor in which a
`1, there is provided
`capacitor elementis housed in
`a resin case and sealed with a resin. A tonque piece is provided at a
`position opposed
`to an inner side surface of the resin case, and a terminal which is brought
`out toward an
`opening end side of the resin case and is brought into contact with the inner side face
`a
`to
`spring action is connected to the capacitor element. it is possible
`while maintaining
`a
`position the capacitor element without using
`jig for positioning the capacitor element in
`automate the positioning.
`the resin case, and to easily
`
`Thus, it is possible to obtain a metallized film capacitor which can be easily manufactured,
`can
`a dimensional defect and an appearance defect due to
`an insulation failure,
`prevent
`the exposure of a
`capacitor element from a resin case, and can be improved in
`characteristics.
`
`[O026Hn addition, according to the invention of claim 2, since the inclination angie of the
`a
`tongue piece is set to be larger than 40 degrees,
`capacitor element is hardly exposed
`*
`from the outside of the resin case
`can be
`during the manufacturing process, and the
`predetermined position in the resin case, and an automation can be easily
`easily held at a
`performed and an insulation defect can be prevented, and the characteristics can be
`
`improved.
`
`iBrief Description of the Drawings]
`is a front sectional view and a side sectional view of an embodiment of the
`1
`
`[Fig. 1]FIG.
`present invention ;.
`4 is a
`
`a process of forming
`drawing showing
`[Fig. 2]FiG.
`manufacturing of the embodiment of the present invention ;.
`4 shows a process diagram of manufacturing according
`[Fig. 3]FIG.
`of the present invention ;.
`
`a lead frame used in
`
`to an embodiment
`
`

`

`1 shows a front cross-sectional view of a conventional metallized film
`
`iFig. 4JFIG.
`capacitor;.
`{Explanation of letters or
`numerals]
`1. capacitor element, 3. terminal, 4. resin case, 5. inner surface, 6. tongue piece, 7. open
`end, 11. metallized film capacitor.
`Reference number
`P2570
`
`

`

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