CAPACITOR
`
`RELATED APPLICATIONS
`
`This application is a continuation of the PCT International Application
`
`No. PCT/JP2019/037201 filed on
`
`September 24, 2019, which claims the benefit
`
`of foreign priority of Japanese patent application No. 2018-241878 filed on
`the contents all of which are
`
`December 25, 2018,
`
`incorporated herein by
`
`reference.
`
`10
`
`BACKGROUND
`
`1. Technical Field
`
`The present disclosure relates to a
`
`capacitor, and is particularly suitable
`
`for use in a surface-mount capacitor.
`
`15
`
`2. Description of the Related Art
`
`An example of a surface-mount capacitor mounted on a
`surface of a
`
`printed circuit board is described in, for example, Unexamined
`
`mounting
`
`Japanese Patent Publication No. 2000-323352.
`
`In the capacitor of Unexamined Japanese Patent Publication No. 2000-
`are
`
`323352, electrode extraction portions (electrodes)
`
`disposed at both winding
`
`20
`
`ends (both end faces) of the metallized film capacitor element.
`
`<A terminal
`
`is connected to each of the electrode extraction portions. The terminal
`fitting
`fitting has a terminal portion that is formed by bending
`metal plate and is soldered to a conductor of a
`
`a
`
`battledore-shaped
`
`printed circuit board. The
`
`25
`
`metallized film capacitor element is housed in a case, and in this state, the upper
`
`surface of the terminal portion of the terminal fitting is located substantially
`opening edgeof the case.
`
`the same
`
`plane
`
`as an
`
`in
`
`1
`
`

`

`In the above capacitor, the terminal portion of the terminal fitting has a
`plate shape and an area of the terminal portion is larger than that of a lead
`so that mounting strength
`
`to the printed circuit board by soldering
`
`terminal,
`
`become high.
`
`SUMMARY
`
`The present disclosure relates to a
`
`capacitor configured
`
`to be surface-
`
`mounted on a
`
`predetermined mounting surface. The capacitor according
`
`to
`
`this aspect includes a
`
`capacitor element including
`
`an electrode at each of both
`
`10
`
`end faces and a bus bar connected to the electrode. Here, the bus bar includes
`
`a
`
`arranged in a comb-teeth
`plurality of connection terminal portions that are
`shape. And at least one of the plurality of connection terminal portions is
`on a connection portion disposed in the predetermined mounting
`
`disposed
`
`surface, and is electrically connected to the connection portion.
`
`to the present disclosure, it is possible to provide
`According
`in which thermal damage of a
`
`capacitor element is suppressed
`
`a
`
`capacitor
`
`to occur when
`
`15
`
`20
`
`surface mounting is performed. Here, surface mounting means, for example,
`or the like is performed
`method whereassolder printing
`a solder printing machine and then a electronic component is
`circuit board by
`a
`mounted on the printed circuit board by using
`heat is applied in a reflow furnace to melt the solder and fix the electronic
`
`a
`
`on a surface of a
`
`printed
`
`chip mounter, and after that,
`
`componentto the printed circuit board.
`meanings of the present disclosure are further clarified in the
`following description of an
`
`exemplary embodiment. However, the exemplary
`
`Effects or
`
`25
`
`embodiment shown below is merely
`
`an
`
`example of implementing the present
`
`disclosure, and the present disclosure is not at all limited to the examples
`
`described in the following exemplary embodiment.
`
`2
`
`

`

`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIG. 1A is a
`
`perspective view illustrating
`
`a film capacitor according
`
`to
`
`an
`
`exemplary embodiment;
`FIG. 1B is a cross-sectional view illustrating the film capacitor cut at a
`
`center in a front-rear direction according
`FIG. 2 is a
`
`perspective view illustrating
`
`to the exemplary embodiment;
`capacitor element to which a
`
`a
`
`pair of bus bars is connected according
`
`to the exemplary embodiment;
`
`FIG. 3A is a bottom view illustrating
`
`a case
`
`according
`
`to the exemplary
`
`10
`
`embodiment;
`
`FIG. 3B is a cross-sectional view taken along line A-A' of FIG. 3A;
`FIG. 4A is a
`
`perspective view showing howthe film capacitor is surface-
`mounting surface of a
`
`printed circuit board according
`
`to the
`
`mounted on a
`
`exemplary embodiment;
`
`15
`
`FIG. 4B is a
`
`diagram showinga part of terminal connection portions and
`
`lands connected by solder according
`
`perspective view illustrating
`
`to the exemplary embodiment:
`a bus bar according
`
`to
`
`FIG. 5A is a
`
`Modification 1;
`
`FIG. 5B is a
`
`perspective view illustrating
`
`a bus bar according
`
`to
`
`20
`
`Modification 1;
`
`FIG. 6A is a
`
`perspective view illustrating
`
`a bus bar according
`
`to
`
`Modification 2; and
`
`FIG. 6B is a cross-sectional view illustrating
`mounting surface of a
`
`printed circuit board according
`
`a film capacitor mounted
`
`to Modification 2.
`
`on a
`
`25
`
`DETAILED DESCRIPTION OF EMBODIMENT
`
`As in the case of the terminal fitting of the capacitor of Unexamined
`
`3
`
`

`

`Japanese Patent Publication No. 2000-323352, when the terminal portion has a
`
`plate shape
`
`and the area of the mounting surface on the printed circuit board is
`
`increased, the volume of the terminal portion is increased accordingly.
`
`A surface-mount capacitor
`printed circuit board by
`In this case, solder paste (cream solder) is applied to a
`
`can be mounted on a
`
`reflow soldering.
`
`conductor, which is, for example,
`
`a
`
`land, of the printed circuit board to which a
`
`terminal portion is connected, and the capacitor is placed
`
`board such that the terminal portion is placed
`
`on the printed circuit
`on the solder paste. After that,
`
`the printed circuit board on which the capacitor is placed is heated upto
`
`a
`
`high
`
`10
`
`temperature in a reflow furnace. As a
`
`result, when the solder paste is melted
`
`and then the printed circuit board is cooled, the terminal portion and the land
`are fixed by solder.
`As the volume of the terminal portion increases as in the above-
`
`mentioned capacitor,
`
`the heat capacity increases accordingly,
`
`so that the
`
`15
`
`terminal portion does not
`
`easily reach a
`
`high temperature when heated in the
`
`reflow furnace, and the solder paste does not
`
`easily melt. As aresult, the time
`
`required for soldering increases.
`
`In order to shorten the time required for
`
`soldering, it is necessary to raise the temperature inside the reflow furnace.
`
`In
`
`20
`
`to a
`
`high temperature,
`
`so that
`
`to a
`
`capacitor element.
`
`any of these cases, the capacitor is easily exposed
`there is a concern about thermal damage
`In view of such a
`
`problem, the present disclosure provides
`which thermal damage of a
`
`capacitor element is suppressed
`
`a
`
`capacitor in
`
`to occur when
`
`surface mounting is performed.
`
`Film capacitor 1, which is an
`
`exemplary embodiment of a
`
`capacitor of
`
`25
`
`the present disclosure, will be described below with reference to the drawings.
`
`For the sake of convenience, directions including front and rear, left and right,
`
`and up and down are added to the drawings
`
`as
`
`appropriate. The directions
`
`4
`
`

`

`shown in the drawings
`
`are not absolute directions but relative directions in
`
`relation to an orientation of film capacitor 1. Further, for convenience of
`explanation, in some
`
`names such as
`
`"top surface portion" and
`
`configurations,
`
`"front side surface portion" may be given according
`
`to the directions shown in
`
`the drawings.
`In the present exemplary embodiment, film capacitor 1 corresponds to a
`to a
`
`"capacitor" described in the claims. In addition, land 23 corresponds
`
`"connection portion" described in the claims. Further, end face electrode 110
`
`10
`
`corresponds to an "electrode" described in the claims. Further, protrusion 212
`to a "first protrusion" described in the claims, and protruding piece
`214 corresponds to a "second protrusion" described in the claims. Further, filling
`
`corresponds
`
`resin 400 corresponds
`
`to an "exterior resin” described in the claims.
`
`However,
`
`the
`
`above
`
`description
`
`is
`
`only
`
`intended to
`
`define
`
`correspondences between components in the claims and components in the
`
`15
`
`exemplary embodiment. The correspondences described above do not limit the
`
`scope of the disclosure in the claims to the configuration described in the
`
`exemplary embodiment.
`Film capacitor 1 of the present exemplary embodiment can be surface-
`mounted on a
`printed circuit board, and can be used,
`mounting surface such as a
`as one of electrical components of a vehicle such as an automobile.
`
`for example,
`
`20
`
`FIG. 1A is a
`
`perspective view illustrating film capacitor 1, and FIG. 1B
`a cross-sectional view of film capacitor 1 cut at a center in a front-
`
`illustrating
`
`rear direction. FIG. 2 is a
`
`perspective view illustrating capacitor element 100
`
`to which a
`
`25
`
`illustrating
`
`FIG. 3A.
`
`pair of bus bars 200 is connected.
`300, and FIG. 3B is a sectional view taken along line A-A' of
`
`FIG. 3A is a bottom view
`
`case
`
`Film capacitor 1 includes capacitor element 100, the pair of bus bars 200,
`
`5
`
`

`

`case
`
`and
`
`300,
`
`filling resin 400. Capacitor element 100 to which the pairof bus
`bars 200 is connected is housed in case 300. Case 300 is filled with filling resin
`400, and capacitor element 100 and a partof the pair of bus bars 200 are covered
`
`with filling resin 400.
`a detailed configuration of film capacitor 1 will be described.
`
`Hereinafter,
`
`Capacitor element 100 is formed by stacking of two metallized films in
`on a dielectric film, winding
`laminating
`of the stacked metallized films, and pressing of the wound or laminated
`
`each of which aluminum is deposited
`
`or
`
`metallized films into a flat shape. End face electrodes 110 are formed on left
`a metal such aszinc.
`
`and right end faces of capacitor element 100 by spraying
`
`10
`
`Each bus bar 200 is formed by appropriately cutting
`
`out and bending
`
`a
`
`conductive material, for example,
`
`a copper plate, and has a
`
`configuration
`
`in
`
`which electrode terminal portion 210, relay terminal portion 220, and eight
`external connection terminal portions 230 are
`
`integrated.
`
`15
`
`Electrode terminal portion 210 overlaps with end face electrode 110 of
`
`capacitor element 100. Electrode terminal portion 210 is long
`up-down
`at an upper end. An upper portion of electrode
`
`direction and has an arc
`
`shape
`
`in a
`
`terminal portion 210 has opening 211
`
`having
`
`a circle shape concentric with the
`
`arc
`
`at the upper end. Further, protrusion
`212 is provided
`shape
`end of electrode terminal portion 210. Protrusion 212 has a
`U-shape thatis bent
`to protrude in a direction away from the end face (end face electrode 110) of
`
`at the upper
`
`capacitor element 100. Further,
`
`a lower portion of electrode terminal portion
`
`20
`
`25
`
`a
`
`a
`
`rectangular shape. And protruding piece 214
`210 has opening 213
`having
`rectangular shape is provided at an upper edge of opening 213.
`having
`Protruding piece 214 extends downward and away
`from the end face of capacitor
`element 100. Protruding piece 214 has a
`property of leaf spring capable
`deform in a direction approaching the end face of capacitor element 100.
`
`to
`
`6
`
`

`

`Protrusion 212 and protruding piece 214 have substantially
`aligned in a
`
`width of a groove of case 300 described later, and are
`
`same widths as a
`
`straight line
`
`in the up-down direction.
`
`Relay terminal portion 220 has substantially
`
`a same width as a width in
`
`a
`
`longitudinal direction of the end face (end face electrode 110) of capacitor
`
`element 100. Relay terminal portion 220 extends slightly downward, and then
`
`is bent to extend inward of capacitor element 100. A middle portion of relay
`
`terminal portion 220 is connected to a lower end of electrode terminal portion
`
`210.
`
`10
`
`Eight external connection terminal portions 230 are
`
`arranged,
`
`in the
`
`longitudinal direction (front-back direction) of the end face of capacitor element
`
`230 has a
`
`100, to have acomb-teeth shape. Each of external connection terminal portions
`substantially L-shape. And a cross section of external connection
`terminal portion 230 is formed to have a square shape.
`
`Each external
`
`15
`
`connection terminal portion 230 includes intermediate terminal portion 231 and
`
`and connection terminal portion 232. Intermediate terminal portion 231 extends
`in a direction away from capacitor element 100 (downward) from a lower end of
`
`relay terminal portion 220. And connection terminal portion 232 is continuous
`with intermediate terminal portion 231 and extends in a direction intersecting
`
`20
`
`(a direction orthogonal to) and away from the end face of capacitor element 100.
`
`In bus bar 200, the upper portion of electrode terminal portion 210 is
`
`connected to end face electrode 110 of capacitor element 100
`result, bus bar 200 and end face electrode 110 are
`
`by solder S. Asa
`
`electrically connected. At
`
`25
`
`this time, since the upper portion of electrode terminal portion 210 has opening
`only in an outer
`211, end face electrode 110 is joined by solder S not
`edge portion of electrode terminal portion 210 but also in a
`
`peripheral edge
`
`peripheral
`
`portion of opening 211. Thus, bond betweenelectrode terminal portion 210 and
`
`7
`
`

`

`end face electrode 110 is strengthened.
`
`Case 300 is made of resin, for example, polyphenylene sulfide (PPS).
`
`Case 300 has a
`
`top surface portion 301, front side surface portion 302,
`
`substantially rectangular parallelepiped box shape, and includes
`rear side surface portion
`
`303, left side surface portion 304, and right side surface portion 305. And a
`
`bottom surface of case
`
`shape. And in particular,
`
`300isopen. Each cornerof case 300 has a curved surface
`a radius of curvature of each curved surface shape
`
`at
`
`a connection corner between top surface portion 301 and front side surface
`
`portion 302 and at a connection corner between top surface portion 301 and rear
`side surface portion 303 is larger than that at other connection corners.
`
`10
`
`Rectangular parallelepiped-shaped leg 306 is formed at each of two
`locations on left and right in a lower surface of each of front side surface portion
`302 and rear side surface portion 303. Further, groove 308 extending
`up-down direction is formed on an inner wall surface of each of left side surface
`
`in the
`
`15
`
`portion 304 and
`
`right side surface portion 305. Groove 308 is formed at a center
`
`in the front-rear direction of the inner wall surface, and formed by
`
`two ribs 307
`
`In addition, two ribs 309 each extending
`extending in the up-down direction.
`in the left-right direction are formed on
`top surface portion 301. Two ribs 309
`are
`respectively located at front position and back position of an inner wall
`
`20
`
`surface.
`
`Whenfilm capacitor 1 is assembled, capacitor element 100 in which bus
`
`bars 200 are connected to both end face electrodes 110 is housed in case 300
`
`through opening 300a on the bottom surface of case 300 while each of capacitor
`element 100 and case 300 is turned upside down. At this time, in a state that
`
`25
`
`capacitor element 100 is housed in case
`
`300, capacitor element 100 is disposed
`
`at an orientation such that the two end faces (two end face electrodes 110) of
`
`capacitor element 100 respectively face the inner wall surface of left side surface
`
`8
`
`

`

`portion 304 and the innerwall surface of right side surface portion 305 of case
`
`300.
`
`Capacitor element 100 is inserted into case 300 such that protrusion 212
`and protruding piece 214 of bus bar 200 fit into groove 308 of case 300. At this
`time, since a
`tip of protruding piece 214 projects outward from the inner wall
`surface of case 300 (broken line in FIG. 1B), protruding piece 214 deforms
`inward to be put into grooves 308 as
`capacitor element 100 is inserted into case
`
`300. When capacitor element 100 is completely housed in case
`
`300,
`
`a
`
`peripheral surface of capacitor element 100 comes into contact with ribs 309 of
`top surface portion 301 of case 300. As a
`
`result, gaps for filling resin 400 to
`
`10
`
`enter are secured between top surface portion 301 of case 300 and capacitor
`
`element 100. Further, since protrusion 212 and protruding piece 214 arefit
`into groove 308, itis held a state that bus bar 200 is not tilted with respect to
`
`case 300.
`
`15
`
`Filling resin 400 is filled inside case 300 in which capacitor element 100
`ishoused. Filling resin 400 is a
`thermosetting resin such as an epoxy resin and
`is injected into case 300 while being molten. At this time, protruding pieces
`214 of left and right bus bars 200 are
`
`respectively pressed against the inner wall
`
`surfaces of left side surface portion 304 and right side surface portion 305 due
`
`20
`
`to the leaf spring property of protruding pieces 214. Hence, capacitor element
`100 is difficult to move in a direction toward an
`opening of case
`
`300, and thus
`
`resin 400 is injected.
`lifting of capacitor element 100 is suppressed whenfilling
`After that, filling resin 400 in case 300 is cured by heating the inside of
`case 300. Capacitor element 100 is covered with case 300 and
`
`filling resin 400,
`
`25
`
`and protected from moisture and impact.
`
`In this way, film capacitor 1 is completed
`
`as shown in FIG. 1A. As
`
`shownin FIG. 1B, in eight external connection terminal portions 230 of each of
`
`9
`
`

`

`the pairof bus bars 200, intermediate terminal portions 231 are almost entirely
`
`buried inside filling resin 400, and tips of intermediate terminal portions 231
`
`resin 400 are
`
`respectively connected to connection terminal
`exposed from filling
`portions 232. Each connection terminal portion 232 extends in a direction
`parallel to opening 300a of case 300
`
`(left-right direction). In the direction
`
`parallel to opening 300a, about half of each connection terminal portion 232 at
`a
`end side protrudes (sticks out) to an outside of case 300.
`FIG. 4A is a
`
`perspective view showing how film capacitor 1 is surface-
`
`tip
`
`mounted on
`
`mounting surface 21 of printed circuit board 2.
`
`FIG. 4B isa
`
`10
`
`diagram showing
`
`a
`
`part of connection terminal portions 232 and lands 23
`
`connected by solderS.
`
`As shown in FIG. 4A,
`
`a
`
`pair of conductive patterns 22
`
`corresponding
`
`to
`
`the pair of bus bars 200 of film capacitor
`
`1 is disposed
`
`on
`
`mounting surface 21
`of printed circuit board 2. Eight lands 23 arranged in a comb-teeth shape
`
`are
`
`15
`
`provided to each of conductive patterns 22.
`When film capacitor 1 is mounted on
`
`mounting surface 21, first, solder
`
`paste (cream solder) is applied to eight lands 23. Next, film capacitor 1 is
`
`20
`
`25
`
`on
`
`Tips of connection terminal portions 232
`
`mounting surface 21.
`placed
`on the solder paste applied
`protruding from case 300 are
`placed
`height of each leg 306 of case 300 is set to a
`height that is a sum of thickness of
`
`to lands 23. A
`
`each connection terminal portion 232 and thickness of each land 23, and four
`306 of case 300 come into contact with mounting surface 21 to support film
`
`legs
`
`capacitor 1 with four legs 306.
`
`a
`
`upto
`
`Next, printed circuit board 2 on which film capacitor 1 is placed is heated
`high temperature in a reflow furnace. At this time, since terminal
`mounting surface 21 in each bus bar 200 are
`portions connected to
`composed of
`eight (a plurality of) connection terminal portions 232 arranged in a comb-teeth
`
`10
`
`

`

`shape,
`
`an entire surface area of eight connection terminal portions 232 become
`large compared to a case of a
`single terminal portion having the same volume.
`
`Hence, when heated in the reflow furnace, entire eight connection terminal
`
`portions 232
`
`easily absorb heat, and eight connection terminal portions 232
`quickly reach a
`
`high temperature. And the temperature of the solder paste
`
`reaches a
`
`melting high temperature, and the solder paste melts.
`
`After that, when printed circuit board 2 is cooled, each connection
`
`terminal portion 232 and each land 23 are fixed with solder S. As shown in
`
`FIG. 4B, solder S spreads not
`
`only between lower surface 232a of connection
`terminal portion 232 and a surface of land 23 but also on side surfaces 232b at
`
`10
`
`both sides of connection terminal portion 232, and side surfaces 232b and lands
`
`23 are also joined with solderS.
`
`At this time,
`
`as described above, the entire surface area of bus bar 200
`
`15
`
`20
`
`25
`
`of eight connection terminal portions 232 is larger than that of bus bar 200
`a
`single terminal portion (the entire surface area is increased by the area
`an area
`
`having
`
`of fourteen side surfaces 232b). Hence,
`
`jointed by solder S increases.
`
`As a
`
`result, connection between eight connection terminal portions 232 and
`
`eight lands 23 is strengthened.
`Whenfilm capacitor 1 is heated and cooled to be surface-mounted on
`printed circuit board 2, bus bars 200 and
`filling resin 400 around bus bars 200
`thermally expand and thermally shrink. Since bus bars 200 and
`filling resin
`400 have different coefficients of linear expansion, there is a concern that
`peeling may occur at interfaces of bus bars 200 and
`filling resin 400.
`portion of each bus bar 200 close to a
`present exemplary embodiment, since a
`
`In the
`
`resin 400 is composed of eight intermediate terminal portions
`surface of filling
`in a comb-teeth shape,
`a contact area with filling resin 400
`231 arranged
`becomes large. As aresult, adhesion between bus bar 200 and
`
`filling resin 400
`
`11
`
`

`

`can be enhanced in a
`
`portion close to the surface of filling resin 400,
`
`so that
`
`peeling
`
`at interface portions due to thermal expansion and thermal shrinkage
`
`can be suppressed.
`
`<Effects of exemplary embodiment>
`
`As described above,
`
`the present exemplary embodiment exerts the
`
`followingeffects.
`
`Bus bar 200 includes the plurality of connection terminal portions 232
`
`arranged in a comb-teeth shape. And the tips of the plurality of connection
`on
`terminal portions 232 are
`on lands 23 provided
`
`mounting surface 21
`
`placed
`
`of printed circuit board 2 and connected to lands 23 by soldering. According
`this configuration, when film capacitor 1 is heated to be surface-mounted on
`
`to
`
`mounting surface 21 of printed circuit board 2, the plurality of connection
`entirely quickly heated to a
`
`terminal portions 232 are
`
`high temperature, and
`
`the solder paste quickly melts. As a
`result, capacitor element 100 is less likely
`to a
`high temperature atmospherefor a
`to occur.
`
`to be exposed
`
`long time,
`
`so that thermal
`
`damage is less likely
`
`Further, since the connection between the
`
`plurality of connection terminal portions 232 and corresponding lands 23 is
`even if film capacitor 1 is used for a vehicle such as an automobile that
`peel off or break.
`
`easily receives vibration, connected portions
`
`are hard to
`
`strong,
`
`10
`
`15
`
`20
`
`Further, bus bar 200 includes the plurality of intermediate terminal
`portions 231 which are
`in a comb-teeth shape inside filling
`arranged
`The endsof the plurality of intermediate terminal portions 231 are
`exposed from
`filling resin 400, and are connected to respective connection terminal portions
`
`resin 400.
`
`25
`
`232.
`
`According
`
`to this configuration, when film capacitor 1 is heated and cooled
`
`to be surface-mounted on printed circuit board 2, peeling between bus bar 200
`
`and
`
`filling resin 400 is unlikely
`
`to occur in a
`
`portion close to the surface of
`
`filling
`
`12
`
`

`

`resin 400. Asa result, it is less likely that moisture invadesinsidefilling resin
`
`400 from a
`
`declined.
`
`peeled portion, and it is less likely that moisture resistance is
`
`Further, the plurality of connection terminal portions 232 extendsin the
`opening 300a of case 300 so as to protrudeto the outside of
`
`direction parallel to
`
`case 300 in the direction. And the plurality of connection terminal portions 232
`are
`
`respectively connected to lands 23 of mounting surface 21 in the protruding
`
`portions. According
`
`to this configuration, when film capacitor 1 is heated to be
`
`surface-mounted on
`
`10
`
`shielded by
`
`mounting surface 21, heat given to the connected portions
`(protruding portions) of connection terminal portions 232 with lands 23 is not
`are
`case 300. Therefore, the connected portions
`
`effectively heated
`
`and tend to reach a
`
`high temperature quickly.
`case 300 has groove 308 extending in an insertion direction
`Further,
`(up-
`down direction) in which capacitor element 100 is inserted into case 300. And
`
`15
`
`groove 308 is formed on the inner wall surface of each of left side surface portion
`
`304 and right side surface portion 305, which faces an end face of capacitor
`
`element 100. Bus bar 200 includes protrusion 212 and protruding piece 214
`
`that are
`
`linearly arranged in the insertion direction and fit into groove 308.
`
`it can be held that bus bar 200 is not tilted with
`
`According to this configuration,
`respect to case 300. As a
`result, it can be held that eight connection terminal
`portions 232 arranged in the front-rear direction are
`surface of case
`so that when film capacitor 1 is placed
`21, eight connection terminal portions 232 are
`
`20
`
`300,
`
`parallel to the bottom
`
`on
`
`mounting surface
`
`securely placed
`
`on
`
`eight lands 23.
`
`Although the exemplary embodimentof the present disclosure has been
`
`25
`
`described above,
`
`the present disclosure is not
`
`limited to the exemplary
`
`embodiment described above and application examples of the present disclosure
`
`can include various modifications in addition to the above exemplary
`
`13
`
`

`

`embodiment.
`
`<Modification 1>
`
`FIGS. 5A and 5B are
`
`perspective views illustrating bus bar 200
`
`according
`
`to Modification 1.
`
`In this modification, external connection terminal portions 230 of bus
`
`bar 200 includes connecting portion 233 that connects connection terminal
`portions 232 to each other in a direction in which eight connection terminal
`portions 232 are
`
`Connecting portion 233 may be formed at
`arranged.
`intermediate portions of connection terminal portions 232 as shown in FIG. 5A,
`
`or may be formed at tip portions of connection terminal portions 232 as shown
`
`in FIG. 5B. A width of connecting portion 233 is made smaller than a width of
`
`each connection terminal portion 232.
`According to this modification, since the plurality of (eight)
`terminal portions 232 is reinforced in an
`
`arrangement direction of connection
`
`connection
`
`10
`
`15
`
`terminal portions 232, connection terminal portions 232 are less likely
`deformed even if something hits against connection terminal portions 232.
`
`to be
`
`Further, since the width of connecting portion 233 is smaller than the
`
`width of each connection terminal portion 232, the heat capacity is unlikely
`
`to
`
`20
`
`increase, and whenfilm capacitor 1 is heated when being surface-mounted, heat
`
`absorption of the plurality of connection terminal portions 232 is unlikely
`
`to be
`
`prevented.
`
`<Modification 2>
`
`25
`
`FIG. GA is a
`
`perspective view illustrating bus bar 200
`according
`Modification 2, and FIG. 6B is a cross-sectional view of film capacitor
`
`to
`
`1 mounted
`
`on
`
`mounting surface 21 of printed circuit board 2
`
`according
`
`to Modification 2.
`
`14
`
`

`

`In this modification, the tips of eight connection terminal portions 232
`
`of bus bar 200 are bent upward. As shown in FIG. 6B, when film capacitor 1 is
`
`completed, the tips of eight connection terminal portions 232 of left bus bar 200
`are in contact with the outer wall surface of left side surface portion 304 of case
`
`300, and eight connection terminal portions 232 of right bus bar 200 are in
`
`contact with the outer wall surface of right side surface portion 305 of case 300.
`
`As shown in FIG. 6B, in printed circuit board 2, eight lands 23 extend
`into inside case 300 and are connected to inner portions of the tips of eight
`
`connection terminal portions 232 by solder S.
`
`10
`
`<Other modifications>
`
`In the above exemplary embodiment, bus bar 200 is configured such that
`external connection terminal portions 230 include a
`
`plurality of intermediate
`terminal portions 231 arranged in a comb-teeth shape. Meanwhile, bus bar
`
`15
`
`200 may be configured such that external connection terminal portions 230 do
`
`not include the plurality of intermediate terminal portions 231 and relay
`
`terminal portion 220 is extended downward to be connected to the plurality of
`
`connection terminal portions 232.
`
`20
`
`Further, in the above exemplary embodiment, lands 23 of mounting
`surface 21 are
`configured such that a
`portions 232 of bus bar 200 are
`
`part (tip portions) of connection terminal
`
`placed. Meanwhile, lands 23 may be configured
`such that the entire portions of connection terminal portions 232 are
`
`placed.
`
`Moreover, in the above exemplary embodiment, single capacitor element
`
`100 is used for film capacitor 1. Meanwhile,
`
`a
`
`plurality of capacitor elements
`
`25
`
`100 may
`
`be
`
`used for film capacitor 1.
`
`Although capacitor element 100 of the above exemplary embodimentis
`
`made of metallized films in which aluminum is deposited
`
`on a dielectric film,
`
`15
`
`

`

`capacitor element 100 may be made of metallized films in which another metal
`
`such as zinc or
`
`magnesium is deposited. Alternatively, capacitor element 100
`
`may be made of metallized films in which a
`
`plurality of metals among such
`
`metals is deposited
`
`or be made of metallized films in which an
`
`alloy of such
`
`metals is deposited. Moreover, in the above exemplary embodiment, capacitor
`
`element 100 is formed through stacking of two metallized films in each of which
`on the dielectric film, and winding
`
`or
`
`laminating of the
`
`aluminum is deposited
`
`stacked metallized films. Alternatively, capacitor element 100 may be formed
`
`through stacking of an
`
`insulating film and a metallized film that includes a
`on both sides of the dielectric film, and
`
`10
`
`dielectric film and aluminum deposited
`
`winding
`
`or
`
`laminating of the stacked insulating film and the metallized film.
`
`Further,
`
`in film capacitor 1,
`in the above exemplary embodiment,
`capacitor element 100 is covered with filling resin 400, which is an exteriorresin,
`and case 300. Meanwhile, film capacitor
`1 may have a caseless configuration
`
`15
`
`in which capacitor element 100 is covered only with the exterior resin.
`
`Further,
`
`in the above exemplary embodiment, soldering is used to
`
`connect connection terminal portions 232 of bus bar 200 to lands 23 of mounting
`
`surface 21. Meanwhile, brazing other than soldering may be used.
`Further, in the above exemplary embodiment, film capacitor 1 is used as
`
`20
`
`an
`
`example of the capacitor of the present disclosure. Meanwhile, the present
`
`disclosure may
`
`be applied to capacitors other than film capacitor 1.
`In addition, various modifications can be appropriately made to the
`
`exemplary embodiment of the present disclosure within the scope of the
`
`technical idea disclosed in the claims.
`
`25
`
`It should be noted that,
`
`a term
`
`exemplary embodiment,
`indicating
`"downward", indicates a relative direction that only depends
`
`a
`
`in the description of the above-described
`direction, such as
`
`"upward"
`
`or
`
`on a relative
`
`16
`
`

`

`positional relationship of constituent members, and does not
`
`indicate an
`
`absolute direction, such as a vertical direction or a horizontal direction.
`
`The present disclosure is useful for capacitors for use in various types of
`
`electronic devices, electrical devices, industrial equipment, electric components
`
`for vehicles, and the lke.
`
`17
`
`