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`PATENT
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`IN THE UNITED STATES PATENT AND TRADEMARKOFFICE
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`In re Application of
`Akihito Konishiet al.
`Application No.: 17/050,429
`Filed: October 23, 2020
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`Customer Number: 53080
`Confirmation Number: 1855
`Group Art Unit: 2835
`Examiner: Robert Joseph Hoffberg
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`For: ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC
`DEVICE
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`AMENDMENT
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`Mail Stop RCE
`Commissioner for Patents
`P.O. Box 1450
`Alexandria, VA 22313-1450
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`Sir:
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`In response to the Office Action dated April 7, 2022, wherein a three-month shortened
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`statutory period for response wasset to expire on July 7, 2022, and a petition for one month
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`extension of time is being filed concurrently herewith, Applicant respectfully requests
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`reconsideration of the above-identified application in view of the following amendments and
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`remarks.
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`A request for continued examination is being filed concurrently herewith.
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`DM_US189443710-1.083710.3191
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`Application No.: 17/050,429
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`AMENDMENT TO THE CLAIMS
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`The following claim listing replaces all prior listings and versions of the claims:
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`LISTING OF CLAIMS
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`1. (Currently Amended) An electronic device comprising:
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`a mount board:
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`a heat generating componentprovided on the mount board;
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`a pressing component provided above the heat generating component;
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`a film provided between the heat generating componentand the pressing component; and
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`a liquid heat conductive material provided between the heat generating component and
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`the film and between the pressing componentand the film, wherein:
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`the film contains graphite-based carbonandis-compressedrecetvedfromtheby_pressure
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`the heat generating componentis provided between the mount board and the pressing
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`component,
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`the heat generating componentand the film are sealed with the mount board and the
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`pressing component by connecting the mount board and the pressing component, and
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`the film is compressed by connecting the mount board and the pressing component and
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`heat generating component.
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`2. (Currently Amended) The electronic device according to claim 1, wherein:
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`one or morefirst voids are formedat a first surface of the film facing the heat generating
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`component, and one or more second voids are formed at a second surface of the film facing the
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`pressing component,
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`the one or more first voids and the one or more second voidsare filled with the liquid
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`heat conductive material,
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`DM_US189443710-1.083710.3191
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`Application No.: 17/050,429
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`whena first porosity is a ratio of a total area of the one or morefirst voids projected onto
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`first surface to an entire area of the first surface, [[a]] the first porosity eHthe-one-or-meorefisst
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`yeids is less than or equal to 5%, and
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`when a second porosity is a ratio of a total area of the one or more second voids projected
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`onto second surface to an entire area of the second surface,
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`[[a]] the second porosity efthe-ene-cr
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`more-secondyeidsis less than or equal to 5%.
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`3. (Currently Amended) The electronic device according to claim 1, wherein a
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`compressibility of the film is more than or equal to 30% at a pressure of 100 kPa.
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`4, (Currently Amended) The electronic device according to claim 1, wherein the liquid
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`heat conductive material has a kinematic viscosity at 25°C ranging from 2 cSt to 15 cSt
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`inclusive.
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`5. (Currently Amended) A method for manufacturing an electronic device, the method
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`comprising:
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`preparing a mount board, on which a heat generating component is mounted, and a
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`pressing component;
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`arranging a film having graphite-based carbon on [[a]] the heat generating component,
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`wherein
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`pressing-component—and the film is coated with a liquid heat conductive material;
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`airanging a pressing componentonthe film;
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`connecting the mount board and the pressing component;
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`sealing the heat generating componentandthe film with the mount board and the
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`pressing component; [[and]]
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`compressing the film by the pressing component suehthatthe-one-or_morefist-yoids-and
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`forming one or morefirst voids at a first surface of the film facing the heat generating
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`component, and forming one or more second voids at a second surface of the film facing the
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`pressing component; and
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`Application No.: 17/050,429
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`by emitting an ultrasonic wave from a side of the pressing component and detecting a
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`reflected wave ofthe ultrasonic wave, examining a first porosity and a second porosity, when the
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`first porosity is a ratio of a total area of the one or morefirst voids projected onto first surface to
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`an entire area of the first surface, and the second porosity is a ratio of a total area of the one or
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`more second voids projected onto second surface to an entire area of the second surface whether
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`6. (Currently Amended) The method for manufacturing the electronic device according to
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`claim 5, wherein
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`whenthefirst porosity is greateran-area-oftheone-ornotlessthan ormorefirst voids is
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`equal to 5%efenarea-ofthefrstsurface, or the second porosity is greaterandanarea-oftheone
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`ermoresecondvoidsisnetlessefan-area-secondsurface, thethan or equal to 5% ofthe
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`electronic device is determined as a defective product.
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`7. (Currently Amended) The electronic device according to claim [[1]] 2, wherein:
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`side surfaces of the film are covered with the liquid heat conductive material,_and
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`the side surfaces are disposed between the first surface and the second surface.
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`8. (Previously Presented) The electronic device according to claim 1, wherein the liquid
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`heat conductive material contains perfluoropolyether.
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`9-14. (Cancelled)
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`15. (New) Theelectronic device according to claim 1, wherein the pressing componentis
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`fixed to the mount board by an adhesive.
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`Application No.: 17/050,429
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`Introduction
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`REMARKS
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`Claims 1-8 and 15 are pending, of which claims 1 and 5 are independent.
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`Claims 1-7 have been amendedto correct informalities in the claim language and to more
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`clearly define the present subject matter. Claims 9-14 have been canceled without prejudice.
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`Claim 15 has been added. No new matter has been added.
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`Objection
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`Claims 3, 4, 6 and 12 were objected to. Applicant submits that the amendments made to
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`the claims overcome the objection.
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`Patentability under 35 U.S.C. § 112
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`Claims 2, 7 and 10-14 were rejected under 35 U.S.C. § 112(b) as being indefinite.
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`Applicant submits that the amendments madeto the claims overcomethe rejection.
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`Patentability under 35 U.S.C. § 102/103
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`Claim 1 was rejected under 35 U.S.C. § 102(a)(1)/(a)(2) as being anticipated by Bunyan
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`(WO 2017/172703). Claims 2, 5 and 6 were rejected under 35 U.S.C. § 103 as being
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`unpatentable over Bunyanin view of Fukui (US 2016/0336253). Claim 3 was rejected under 35
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`U.S.C. § 103 as being unpatentable over Bunyan in view of Tachibana (JP 2014-133669). Claim
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`4 was rejected under 35 U.S.C. § 103 as being unpatentable over Bunyan in view of Greinke (US
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`6,746,768). Claims 7 and 10 were rejected under 35 U.S.C. § 103 as being unpatentable over
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`Bunyan in view of Fisher (US 7,700,162). Claim 8 was rejected under 35 U.S.C. § 103 as being
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`DM_US189443710-1.083710.3191
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`Application No.: 17/050,429
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`unpatentable over Bunyanin view of Sayir (US 2007/0053168). Claim 9 wasrejected under 35
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`U.S.C. § 103 as being unpatentable over Bunyan in view of Hirose (US 2009/0301697). Claim
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`11 was rejected under 35 U.S.C. § 103 as being unpatentable over Bunyan in view of Fisher and
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`Tachibana. Claim 12 was rejected under 35 U.S.C. § 103 as being unpatentable over Bunyan in
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`view of Fisher and Greinke. Claim 13 wasrejected under 35 U.S.C. § 103 as being unpatentable
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`over Bunyan in view of Fisher and Sayir. Claim 14 wasrejected under 35 U.S.C. § 103 as being
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`unpatentable over Bunyanin view ofFisher and Hirose.
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`Without conceding any correctness of the rejections, Applicant traverses the rejections
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`for at least the following reasons.
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`At a minimum,noneof the cited references disclose “the heat generating componentand
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`the film are sealed with the mountboard and the pressing component by connecting the mount
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`board and the pressing component,” as recited by claim 1 and “sealing the heat generating
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`componentand the film with the mountboard and the pressing component;” as recited by claim
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`5.
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`Assuch, claims 1 and 5 and all claims dependent thereon are patentable overthe cited
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`references.
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`Application No.: 17/050,429
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`CONCLUSION
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`Having fully respondedto all matters raised in the Office Action, Applicant submits that
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`all claims are in condition for allowance, an indication for whichis respectfully solicited. If
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`there are any outstanding issues that might be resolved by an interview or an Examiner’s
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`amendment, the Examineris requested to call Applicant’s attorney at the telephone number
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`shownbelow.
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`To the extent necessary, a petition for an extension of time under 37 C.F.R. § 1.136 is
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`hereby made. Please charge any shortage in fees due in connection with the filing of this paper,
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`including extension of time fees, to Deposit Account 500417 and please credit any excess fees to
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`such deposit account.
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`Respectfully submitted,
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`McDERMOTT WILL & EMERY LLP
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`/Takashi Saito/
`Takashi Saito
`Registration No. 69,536
`
`Please recognize our Customer No. 53080
`as our correspondenceaddress.
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`500 North Capitol Street, N.W.
`Washington, DC 20001-1531
`Phone: 202.756.8000 MEF:TS:
`Facsimile: 202.756.8087
`Date: August 4, 2022
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`DM_US189443710-1.083710.3191
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