To:
`
`Subject:
`
`Sent:
`
`Sent As:
`
`Attachments:
`
`Panasonic Corporation (docketingtm@hdp.com)
`
`U.S. TRADEMARK APPLICATION NO. 85389628 - SMARTFSI - 9432-200488
`
`12/8/2011 2:27:04 PM
`
`ECOM107@USPTO.GOV
`
`Attachment - 1
`Attachment - 2
`Attachment - 3
`Attachment - 4
`Attachment - 5
`Attachment - 6
`Attachment - 7
`Attachment - 8
`Attachment - 9
`Attachment - 10
`Attachment - 11
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`Attachment - 21
`Attachment - 22
`Attachment - 23
`Attachment - 24
`
`UNITED STATES PATENT AND TRADEMARK OFFICE (USPTO)
`OFFICE ACTION (OFFICIAL LETTER) ABOUT APPLICANT’S TRADEMARK APPLICATION
`
`85389628
`
`(cid:160)(cid:160)(cid:160) CORRESPONDENT ADDRESS:
`(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`
`*85389628*
`
`CLICK HERE TO RESPOND TO THIS LETTER:
`http://www.uspto.gov/trademarks/teas/response_forms.jsp
`
`(cid:160) (cid:160)(cid:160)(cid:160) APPLICATION SERIAL NO.(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`(cid:160)(cid:160)(cid:160)(cid:160) MARK: SMARTFSI(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160) (cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`(cid:160) (cid:160)
`(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160) APPLICANT:(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`(cid:160) (cid:160)(cid:160)(cid:160)(cid:160)(cid:160) CORRESPONDENT’S REFERENCE/DOCKET NO :(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`(cid:160)(cid:160)(cid:160)
`9432-200488(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160) CORRESPONDENT E-MAIL ADDRESS:(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`
`GEOFFREY D. AURINI(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`HARNESS, DICKEY & PIERCE, P.L.C.(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`TROY, MI 48098-2683(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`
`5445 CORPORATE DR STE 200
`
`(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`
`(cid:160) Panasonic Corporation
`
`docketingtm@hdp.com
`
`OFFICE ACTION
`
`(cid:160)
`

`

`STRICT DEADLINE TO RESPOND TO THIS LETTER
`TO AVOID ABANDONMENT OF APPLICANT’S TRADEMARK APPLICATION, THE USPTO MUST RECEIVE APPLICANT’S COMPLETE
`RESPONSE TO THIS LETTER WITHIN 6 MONTHS OF THE ISSUE/MAILING DATE BELOW.
`
`(cid:160)I
`
`SSUE/MAILING DATE: 12/8/2011
`
`The referenced application has been reviewed by the assigned trademark examining attorney.(cid:160) Applicant must respond timely and completely to
`the issue(s) below.(cid:160) 15 U.S.C. §1062(b); 37 C.F.R. §§2.62(a), 2.65(a); TMEP §§711, 718.03.
`
`(cid:160)R
`
`efusal – Mark is Merely Descriptive of Goods
`
`(cid:160)R
`
`egistration is refused because the applied-for mark merely describes features and characteristics of applicant’s goods. (cid:160) Trademark Act Section
`2(e)(1), 15 U.S.C. §1052(e)(1); see TMEP §§1209.01(b), 1209.03 et seq.
`
`(cid:160)A
`
` mark is merely descriptive if it describes an ingredient, quality, characteristic, function, feature, purpose or use of the specified goods.(cid:160) TMEP
`§1209.01(b); see In re Steelbuilding.com, 415 F.3d 1293, 1297, 75 USPQ2d 1420, 1421 (Fed. Cir. 2005); In re Gyulay, 820 F.2d 1216, 1217-18,
`
`3 USPQ2d 1009, 1010 (Fed. Cir. 1987).(cid:160)(cid:160)
`
`Applicant has proposed the mark SMARTFSI for image sensors.(cid:160) The attached articles show that FSI is an acronym for frontside illumination.(cid:160)
`FSI and BSI, or backside illumination, are the two most common technologies for image sensors.
`The term “smart” has been held merely descriptive of automated devices. (cid:160) See In re Cryomedical Scis. Inc., 32 USPQ2d 1377, 1378 (TTAB
`1994) (holding SMARTPROBE merely descriptive of disposable cryosurgical probes); see also In re Tower Tech, Inc., 64 USPQ2d 1314,
`1317-18 (TTAB 2002) (holding SMARTTOWER merely descriptive of commercial and industrial cooling towers and accessories therefor, sold
`as a unit).(cid:160) In Tower Tech, the Board held that the general use of the term “smart” in relation to myriad to computer-operated or otherwise
`
`automated items causes purchasers to readily perceive that “smart” means “of, relating to, or being a highly automated device.” (cid:160) Id. (cid:160)(cid:160)(cid:160)
`
`Third-party registrations featuring the same or similar goods as applicant’s goods are probative evidence on the issue of descriptiveness where
`the relevant word or term is disclaimed, registered under Trademark Act Section 2(f) based on a showing of acquired distinctiveness, or
`registered on the Supplemental Register.(cid:160) See Sweats Fashions, Inc. v. Pannill Knitting Co., 833 F.2d 1560, 1564-65, 4 USPQ2d 1793, 1797
`(Fed. Cir. 1987); In re Box Solutions Corp., 79 USPQ2d 1953, 1955 (TTAB 2006); In re Finisar Corp., 78 USPQ2d 1618, 1621 (TTAB 2006).(cid:160)
`Six such registrations for sensors wherein the term SMART is disclaimed are attached as proof of the term’s descriptiveness.
`
`(cid:160)A
`
` 2011 article with numerous descriptive references to “smart sensors” is also attached as evidence.
`
`(cid:160)T
`
`aken together, the proposed mark immediately conveys (1) that applicant’s sensors are highly automated, and (2) that applicant’s sensors
`employ frontside illumination (FSI) technology.
`(cid:160) (cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`Although applicant’s mark has been refused registration, applicant may respond to the refusal(s) by submitting evidence and arguments in
`support of registration.
`
`(cid:160)A
`
`pplicant must respond to the requirement(s) set forth below.
`
`(cid:160)C
`
`ertificate of Foreign Registration Required to Perfect Section 44 Basis for Registration
`
`(cid:160)T
`
`he application specifies both an intent to use basis under Trademark Act Section 1(b) and a claim of priority under Section 44(d) based on a
`foreign application.(cid:160) See 15 U.S.C. §§1051(b), 1126(d); 37 C.F.R. §2.34(a)(2), (a)(4).(cid:160) However, no copy of a foreign registration has been
`provided even though the application indicates applicant’s intent to rely on Section 44(e) as an additional basis for registration. (cid:160) See 15 U.S.C.
`§1126(e).
`
`(cid:160)A
`
`n application with a Section 44(e) basis must include a true copy, photocopy, certification, or certified copy of a foreign registration from an
`applicant’s country of origin. (cid:160) 15 U.S.C. §1126(e); 37 C.F.R. §2.34(a)(3)(ii); TMEP §§1004, 1004.01, 1016.(cid:160) In addition, an applicant’s country
`of origin must be a party to a convention or treaty relating to trademarks to which the United States is also a party, or must extend reciprocal
`registration rights to nationals of the United States by law.(cid:160) 15 U.S.C. §1126(b); TMEP §§1002.01, 1004.
`
`(cid:160)T
`
`herefore, applicant must provide a copy of the foreign registration from applicant’s country of origin when it becomes available. (cid:160) TMEP
`§1003.04(a).(cid:160) A copy of a foreign registration must consist of a document issued to an applicant by, or certified by, the intellectual property
`office in applicant’s country of origin. (cid:160) TMEP §1004.01.(cid:160) If applicant’s country of origin does not issue registrations or Madrid Protocol
`certificates of extension of protection, applicant may submit a copy of the Madrid Protocol international registration that shows that protection of
`the international registration has been extended to applicant’s country of origin. (cid:160) TMEP §1016.(cid:160) In addition, applicant must also provide an
`English translation if the foreign registration is not written in English.(cid:160) 37 C.F.R. §2.34(a)(3)(ii); TMEP §1004.01(a)-(b).(cid:160) The translation should
`be signed by the translator.(cid:160) TMEP §1004.01(b).
`
`(cid:160)
`

`

`(cid:160)I
`
`f the foreign registration has not yet issued, or applicant requires additional time to procure a copy of the foreign registration (and English
`translation, as appropriate), applicant should so inform the trademark examining attorney and request that the U.S. application be suspended until
`a copy of the foreign registration is available.(cid:160) TMEP §§716.02(b), 1003.04(b).
`
`If applicant cannot satisfy the requirements of a Section 44(e) basis, applicant may request that the mark be approved for publication based
`solely on the Section 1(b) basis.(cid:160) See 15 U.S.C. §§1051(b), 1126(e); 37 C.F.R. §2.35(b)(1); TMEP §§806.02(f), 806.04(b), 1003.04(b).(cid:160) Although
`the mark may be approved for publication on the Section 1(b) basis, it will not register until an acceptable allegation of use has been filed.(cid:160) See
`15 U.S.C. §1051(c)-(d); 37 C.F.R. §§2.76, 2.88; TMEP §1103.(cid:160) Please note that, if the U.S. application satisfied the requirements of Section
`44(d) as of the U.S. application filing date, applicant may retain the priority filing date under Section 44(d) without perfecting the Section 44(e)
`
`basis, provided there is a continuing valid basis for registration.(cid:160) See 37 C.F.R. §2.35(b)(1), (4); TMEP §§806.02(f), 806.04(b).(cid:160)(cid:160)
`
`No Conflicting Marks Noted
`
`The trademark examining attorney has searched the Office’s database of registered and pending marks and has found no conflicting marks that
`would bar registration under Trademark Act Section 2(d).(cid:160) TMEP §704.02; see 15 U.S.C. §1052(d).
`
`(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`
`/Michael Engel/
`Trademark Examining Attorney
`Law Office 107
`(571) 272-9338
`Michael.Engel@uspto.gov
`
`(cid:160)T
`
`O RESPOND TO THIS LETTER: (cid:160) Go to http://www.uspto.gov/trademarks/teas/response_forms.jsp. (cid:160) Please wait 48-72 hours from the
`issue/mailing date before using TEAS, to allow for necessary system updates of the application.(cid:160) For technical assistance with online forms, e-
`mail TEAS@uspto.gov.(cid:160) For(cid:160)questions about the Office action itself, please contact the assigned trademark examining attorney.(cid:160)(cid:160) E-mail
`communications will not be accepted as responses to Office actions; therefore, do not respond to this Office action by e-mail.
`
`(cid:160)A
`
`ll informal e-mail communications relevant to this application will be placed in the official application record.
`
`(cid:160)W
`
`HO MUST SIGN THE RESPONSE:(cid:160) It must be personally signed by(cid:160)an individual applicant or(cid:160)someone with legal authority to bind an
`applicant (i.e., a corporate officer, a general partner, all joint applicants).(cid:160)(cid:160)If an applicant is represented by an attorney, the attorney must sign the
`
`response.(cid:160)(cid:160)
`PERIODICALLY CHECK THE STATUS OF THE APPLICATION: (cid:160) To ensure that applicant does not miss crucial deadlines or official
`notices, check the status of the application every three to four months using Trademark Applications and Registrations Retrieval (TARR) at
`http://tarr.uspto.gov/. (cid:160) Please keep a copy of the complete TARR screen. (cid:160) If TARR shows no change for more than six months, call
`1-800-786-9199. (cid:160) For more information on checking status, see http://www.uspto.gov/trademarks/process/status/.
`
`(cid:160)T
`
`O UPDATE CORRESPONDENCE/E-MAIL ADDRESS:(cid:160) Use the TEAS form at http://www.uspto.gov/teas/eTEASpageE.htm.
`
`(cid:160)
`(cid:160)
`(cid:160)(cid:160)(cid:160)(cid:160)(cid:160)
`

`

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`News and articles of interest from the sensor solutions industry.
`
`‘
`Image Sensor Improvements change Landscape for High-End Applications
`Ely Ashok Elindra, Electronic Products
`
`While complimentary metal-oxide semiconductor[CMOS] image sensors have made significant gains in
`applications like mobile phones, computers and low-cost cameras, the sensor's low-light sensitivity
`performance and image quality have been unattractive for high-end applications where charge-coupled
`device (COD) sensors dominate. Despite refinements in pixel structure and low noise process
`technologies, obtaining high-image quality with low-light sensitivity in CMOS sensors has not been easy.
`Thus, making it difiicult to capture the market in applications like digital still cameras (DSC) and video still
`cameras (VSC) where CCD-type image quality and sensitivity are desired.
`
`To address the needs otsome ofthese high-end applications, CMOS backers like Aptina have adopted
`shrinking geometries to cut the die size of electronic processing and control functions, thereby increasing
`pixel count and the associated light capture area.
`in addition, the company has further improved pixel
`structure and ensuing electronics to drastically improve the quantum efiiciency (QE) ofthe sensor With
`improved image quality and minimal crosstalk, latest CMOS sensors have been able to capture sharp
`images with lively color contrast — even in low-light conditions.
`Frontsicle illumination
`
`
`
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`sensors Resources
`
`.llp_Iina,
`in addition to others, has developed what is called frontside illumination or FSI technology. With
`this technique, light falls on the front side ofthe IC and passes through readout circuitry and
`interconnects before it is collected in the photo detector. As shown in Figure 1 , Aptina's FSI pixel path
`incorporates microlenses with optimized shape, optimized color filters, recessed pixel arrays, lightguides,
`and anti—reflective coatings.
`
`

`

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`r-High-End-Applications.html
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`‘-" Application Notes
`1’ Article Lihragg
`"-’ (ilnssnm
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`"-' Product Guide
`“' Product Training Modules
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`Standard FSI
`
`Aptina"‘ A-Pix
`FSI\iirlI.i'i Lighlgulde &
`UfiOp Pholia Diode
`Figdie 1. Aplina‘s FSI pixel path incorporates microlenseswilh optimized shape, optimized coloifilleis. recessed pixel
`arrays, lightguides, and anti-reflective coatirigsfor betterimage quality.
`
`FSI with Llglitgulde
`
`Called Aptina A-Pix technology, enhancements o the third generation Aptina FSI has resulted in
`substantial irnprcivernents in C-IE end crosstalk, resulting in 25 percent improvement in lciw-light sensitivity
`over second generation FSI technology. Exploiting these advances, the company has developed several
`products aimed at HD video in digital still and video cameras, PCs, and surveillance applications
`
`a portfolio ofhigh quality, rnulti-mega pixel CMOS
`In fact, using FSI technology, Aptina has readie
`sensors that are improving the capabilities efCMOS cameras for high—end mobile phones, tablets, D\/Cs,
`DSCS, and other similar consumer gadgets.
`
`According to Dave Amey, product manager for.-'1. tina's Camera Business Unit, "The performancefcost
`proposition of FSI-based CMOS sensors is becoming attractive for high-end camera applications." These
`appliratinris lt‘|l‘l|ll‘lF| thnse that regiiirn larger pixels, and where lnw light anrl nv:-rall imaging pertnrmanre
`is more important than resolution.
`
`An advance made possible by Aptina's A-Pix tec nology is the new 1:1-megapixel CMOS sensor,
`lv1T‘3FDU2, for DSC cameras with full high-definition (HD) - 1DBDpi’6D frames per second (fps) capability.
`
`Designed for DVCEDSC applications, the 5-mega ixel MTEIPDDW delivers CCD image quality at lower cost
`and power consumption, in a small form factor and with short lead time for CMOS, according to the
`manufacturer.
`it features full-HD support at Bflfps for max video performance with 20 percent additional
`imaging area for image stabilization.
`
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`12!I3B:QD11 02 02:22 PM
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`More Info
`- BS1-2 Video
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`OmniBSI-2"‘ is the next generation of Omni\.i'ision’s industry-leading backside illumination (BS1) technology that
`implements new design rules to enable a pixel roadmap into the sub-micron domain. The clear leader in
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`and more advanced process tools, resulting in tighter process control and improved defect density. By
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`About BS1 Technology
`BS1 technology involves turning the image sensor upside down and applying colorfilters and micro lenses to the
`backside of the pixel so that light is collected through the backside of the sensor. It effectively reverses the
`arrangement of layers so that metal and dielectric layers reside below the sensor array, providing the most
`direct path for light to travel into the pixel, which optimizes the fill factor to deliver best—in—c|ass |ow—|ight
`sensitivity, image quality and color reproduction.
`
`This approach differs from conventional front side illumination (FSI) architectures, where light travels to the
`photo-sensitive area through the front side of the pixel. This requires the light to first pass through transistors,
`dielectric layers and metal circuitry, which can block or deflect it into neighboring pixels, causing a reduced fill
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`Backside lllurninulion Technology
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`

`

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`Print: Dec 3, 2011
`
`?fiIl~51fi15
`
`DESIGN MARK
`
`Serial Number
`16451615
`
`Status
`SECTION 3 & 15-ACCEPTED AND ACKNDWLEDGED
`
`Word Marl:
`SMART GUARD
`
`Standard Character Mark
`No
`
`Registration NI.II"I'IhBf
`2856509
`
`Date Registered
`2004fO6f22
`
`Type of Mark
`TRADEMARK
`
`Register
`PRINCIPAL
`
`Mark Drawing Code
`[I] TYPED DRAWING
`
`DBVHBT
`INC. CORPORATION DELAWARE 5500 SE 59TH STREET
`GE OIL E: GAS ESE’,
`OKLAHOMA CITY OKLAHOMA 73135
`
`Goodslservices
`Class Status —— ACTIVE.
`
`IC 009.
`
`US
`
`021 O23 O26 O36 038.
`
`G & 3:
`
`Electronic dcwnhcle sensors fcr detecting parameters dcwnhcle in a
`well. First Use: 2003fO3fO5. First Use In Commerce: 2UO3fU3fO5.
`
`Disclaimer Statement
`NO CLAIM IS MADE TO THE EXCLUSIVE RIGHT TO USE "SMART" APART FROM THE
`MARK As SHOWN.
`
`Filing Date
`2002HO9H23
`
`Examining Attorney
`THOMPSON, HEATHER
`
`Attorney of Record
`Michael Macz
`
`

`

`

`

`Print: Dec 3, 2011
`
`?fiIl~51fi1fi
`
`DESIGN MARK
`
`Serial Number
`16451616
`
`Status
`REGISTERED
`
`Word Marl:
`SMART GUARD III
`
`Standard Character Mark
`No
`
`Registration NI.II"I'IhBf
`ZSTTOE4
`
`Date Registered
`2005fO?f26
`
`Type of Mark
`TRADEMARK
`
`Register
`PRINCIPAL
`
`Mark Drawing Code
`[1] TYPED DRAWING
`
`DBVHBT
`INC. CORPORATION DELAWARE 5500 SE 59TH STREET
`GE OIL E: GAS ESE’,
`OKLAHOMA CITY OKLAHOMA 73135
`
`Goodslservices
`Class Status —— ACTIVE.
`
`IC 009.
`
`US
`
`021 O23 O26 O36 038.
`
`G & 3:
`
`Electronic dcwnhcle sensors fcr detecting parameters dcwnhcle in a
`well. First Use: 2003fO3fO5. First Use In Commerce: 2UO3fU3fO5.
`
`Disclaimer Statement
`NO CLAIM IS MADE TO THE EXCLUSIVE RIGHT TO USE "SMART" APART FROM THE
`MARK AS SHOWN.
`
`Filing Date
`2002HO9H23
`
`Examining Attorney
`GOODMAN, WENDY
`
`Attorney of Record
`Michael Macz
`
`

`

`

`

`Print: Dec 3, 2011
`
`770984-B4
`
`DESIGN MARK
`
`Serial Number
`17098484
`
`Status
`REGISTERED
`
`Word Mark
`SMART SENSORS PLUG & PLAY
`
`Standard Character Mark
`No
`
`Registration NI.II"I'IhBf
`3591831
`
`Date Registered
`2009fO3fl?
`
`Type of Mark
`TRADEMARK
`
`Register
`PRINCIPAL
`
`Mark Drawing Code
`[3] DESIGN PLUS WORDS, LETTERS ANDJOR NUMBERS
`
`CMNHBT
`Transducer Techniques, Inc. CORPORATION CALIFORNIA 42480 Rio Nedo
`Temeeula CALIFORNIA 92590
`
`Goodslservices
`Class Statue —— ACTIVE.
`
`IC 009.
`
`US
`
`021 O23 O26 O36 038.
`
`G & S:
`
`Sensors for measuring load force and torque. First Use: ZOOBHOBHUI.
`First Use In Commerce: ZOOBHOBFUI.
`
`Disclaimer Statement
`NO CLAIM IS MADE TO THE EXCLUSIVE RIGHT TO USE "SMART SENSORS PLUG &
`PLA " APART FROM THE I'-LARK AS SHOWN.
`
`Description of Mark
`The mark consists of the words "smart sensors" in lower-case lettering
`next to an arrow pointing down, with the words "PLUG & PLAY"
`in
`upper—caee lettering located below the words "Smart eeneore".
`
`Colors Claimed
`Color is not claimed as a feature of the mark.
`
`Filing Date
`
`

`

`77098484
`
`Pfint:DecB,2D11
`
`2OU'.I‘.a"U2.a"C|2
`
`Examining Attorney
`GARTNER,
`JOHN
`
`Attorney of Record
`Otto D. Lee
`
`

`

`

`

`Print: Dec 3, 2011
`
`?B5tI-I-G52
`
`DESIGN MARK
`
`Serial Number
`18504652
`
`Status
`REGISTERED
`
`Word Marl:
`SMART FINN
`
`Standard Character Mark
`Yes
`
`Registration NI.II"I'IhBf
`3045506
`
`Date Registered
`2006f0lfl?
`
`Type of Mark
`TRADEMARK
`
`Register
`PRINCIPAL
`
`Mark Drawing Code
`[4]
`STANDARD CHARACTER MARK
`
`U'WI1Bf
`Test Coach Corporation CORPORATION ILLINOIS Suite 300 2400 W. Hassell
`Road Hoffman Estates ILLINOIS 60195
`
`Goodsise-wines
`Class Status —— ACTIVE.
`
`IC 009.
`
`US
`
`021 023 026 036 038.
`
`G & s:
`
`Sensors and related software for determining and oonfirming the oolor
`and brightness of an LED. First Use: 2003f06f0l. First Use In
`Commerce: 2003/06/01.
`
`Prior Flegistrationtsl
`2642112
`
`Disclaimer Statement
`NO CLAIM IS MADE TO THE EXCLUSIVE RIGHT TO USE "SMART" APART FROM THE
`MARI-C AS SHOWN.
`
`Filing Date
`2004HlOH22
`
`Examining Attorney
`YOUNG, SKYE
`
`

`

`Print: Dec 3, 2011
`
`?B5{I-I-G52
`
`Attumey of Record
`Kevin D. Erickson
`
`

`

`SMART FINN
`
`

`

`Print: Dec 3, 2011
`
`?88?58-I-7
`
`DESIGN MARK
`
`Serial Number
`T887584?
`
`Status
`REGISTERED
`
`Word Mark
`DVS SMARTMARKER
`
`Standard Character Mark
`Yes
`
`Registration NI.II"I'IhBf
`3621036
`
`Date Registered
`2009f05fl2
`
`Type of Mark
`TRADEMARK
`
`Register
`PRINCIPAL
`
`Mark Drawing Code
`[4]
`STANDARD CHARACTER MARK
`
`DBVHBT
`ENC HOLDINGS CORP . CORPORATION DELAWARE 3800 GATEWAY BLVD . , STE 308
`MORRI SVILLE NORTH CAROLINA 2 7 5 6 U
`
`Goodslservices
`Class Status —— ACTIVE.
`
`IC 010.
`
`US
`
`026 039 044.
`
`G & 3: Medical
`
`sensors for oolleoting data in the areas of radiation dose and tumor
`radiation and providing fiducial data, namely,
`implantable wireless
`sensors,
`incorporating chronically implantable radiation dosimeters
`used to monitor conformance of radiation dose distribution delivered
`
`to oncology patients to a planned radiation treatment plan for
`oncology radiation therapies. First Use: 2008fllfO5. First Use In
`Commerce: 2008fllf05.
`
`Prior Registratioms]
`ZTEQTTE
`
`Disclaimer Statement
`No CLAIM IS MADE To THE EXCLUSIVE RIGHT To USE "SMART MARKER" APART
`ERoM THE MARK AS SHowN.
`
`Filing Date
`
`

`

`Print: Dec 3, 2011
`
`?88?58-I-7
`
`2006.a"U5.a"C|3
`
`Examining Attorney
`HAN , DAWN
`
`fl'I'tOfl'IE}i' Of RBt‘.'l'.'II"d
`Julie H. Richardson
`
`

`

`DVS SMARTMARKER
`
`

`

`Print: Dec 3, 2011
`
`?9tltl921Il-
`
`DESIGN MARK
`
`Serial Number
`19009214
`
`Status
`REGISTERED
`
`Word Marl:
`SMART COMPANION
`
`Standard Character Mark
`Yes
`
`Registration NI.II"I'IhBf
`3l20909
`
`Date Registered
`2006fO?f25
`
`Type of Mark
`TRADEMARK
`
`Register
`PRINCIPAL
`
`Mark Drawing Code
`[4]
`STANDARD CHARACTER MARK
`
`U'WI1Bf
`Koninklijke Philips Electronics N.V. LIMITED LIABILITY COMPANY
`NETHERLANDS Groenewoudseweg l NL—562l BA Eindhoven NETHERLANDS
`
`Goodslservices
`Class Status —— ACTIVE.
`
`IC 009.
`
`US
`
`O21 O23 O26 O36 038.
`
`G & S:
`
`transmission, reproduction
`Apparatus and instruments for recording,
`and processing of sound andfor images andfor data, namely,
`computerized user interface system comprising computers, cameras,
`microphones and other human speech sensors and human motion sensors,
`and computer software for the processing of information from such
`sensing devices, for providing messaging services, for communicating
`information, for playing and displaying digital media, for providing
`personal assistance and for providing home surveillance..
`
`Priority Date
`2004fO4f29
`
`Disclaimer Statement
`No CLAIM IS MADE To THE EXCLUSIVE RIGHT To USE "SMART" APART ERoM THE
`MARK AS SHOWN.
`
`

`

`Print: Dec 3, 2011
`
`?9tltl921-l-
`
`Filing Date
`2004fO9fl6
`
`Examining Attorney
`MISTER, KETINA
`
`Attorney of Record
`Michael E. Marion, Edward W. Goodman, Jack E. Haken
`
`

`

`

`

`htti3:i"fw'w\N2 alcalel-lucent.comfenrichfenfvfiil i"srnart-sensors-enable-enterprise-oppoiiuniiiesr’
`12.4138.-'2El11 E|215:53 PM
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`Home > Issue Mobility Eoeryiihere AllthaTlma
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`Smart Sensors Enable Enterprise Opportunities
`By: xeuier Martin o Date: April 11, mm o capegory: Features
`
`Highlights
`0 Smart sensors are used For measurement in almost every
`industry
`- Networks are crucial enablers for sensor applications
`a CSPs are ideally positioned to help enterprises benefit from
`smart sensors
`
`fl sizieopie Like
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`Q Printview
`
`Sensing new opportunities
`As the use ofsmart sensors accelerates, so does the business opportunity for both
`communications service providers (C3135) and enterprises. Today, almost every industry
`uses sensors to measure temperature, humidity, pressure and other values. Getting those
`measurements to the right destination in an instant is crucial.
`
`Depending on the industry, smart sensors typically help increase Operational etficiency
`and save money. But they can also have a direct impact on human life and the
`environment.
`
`a Health care: Even small changes in temperature or humidity can affect patient health.
`Instant actions to keep temperature and humidity constant in hospitals can mean the
`difference between life and death.
`
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`httn::"fv\rw1N2 alcaiel-lucent.comfenrichfenfvfiil ismart-sensors-enable-enterprise-opportuniiiesr’
`12.4138.-'2El11 E|215:53 PM
`
`a Green buildings: Sensor applications can analyze measurements from light and
`temperature sensors in buildings to determine whether lights should be
`automatically shut offand temperatures adjusted. These actions can be based on time
`of clay or other factors, such as hotel room checkouts.
`a Supply chain: Smart sensors in cargo holds and shipping containers measure
`temperature and humidity to prevent spoilage ofperishables. Spoilage is very costly.
`It can also affect quality oflife for those awaiting food.
`a Oil and gas: Pressure sensors along remote pipelines ensure instant leak detection.
`These smart sensors reduce the need for costly pipeline visits, protect assets, and
`help prevent environmental disasters.
`
`Dubbed by some as the “sensorconomy,” the growing market for sensor applications is a
`subset of the broader market for machine to machine applications. Every day,
`enterprises connect more and more smart sensors to networks to provide applications
`with information. While smart sensors are used for dedicated applications, they are not
`typically part of the business ecosystem. Now that is changing.
`
`a CSPs and enterprises are recognizing opportunities to make smart sensors part of
`their core business strategies. For example:
`a CSFS can use their networks and professional services practices to extend their
`relationships with enterprise customers and improve their position in the smart
`sensor value chain.
`
`Enterprises can get more value from smart sensors and sensor applications by
`incorporating network intelligence and creating tighter links with business processes.
`
`CSPs can build their enterprise business
`CSPs are in a unique position to provide enterprises with the capabilities they need at
`multiple levels ofthe smart sensor value chain including connectivity, services,
`applications, and business processes. They can take a progressively greater role in
`enabling sensor applications to increase their value and expand their enterprise business.
`Stage 1: Delivering connectivity
`As a first step, CSPs can provide enterprises with the wired and wireless connectivity that
`smart sensors require. This is a natural extension ofthe connectivity services CSFs
`already provide to enterprises. Their experience and expertise gives CSPS ready-made
`credibility in the smart sensor market.
`
`CSPs likely already provide their enterprise customers with SIM cards as part oftheir
`wireless services. SIM cards are considered intelligent obiects because they retrieve
`information on location, device status and other factors. This means (35135 are effectively
`already delivering machine to machine applications — a superset of sensor applications.
`Stage 2: Adding services and applications
`To move beyond the role of connectivity provider. CSFS can exploit the IF intelligence in
`
`

`

`httn::"fv\rw1N2 alcaiel-Iucent.ccmfenrichfenh/5i1ismart-sensors-enable-enterprise-oppcrtuniiiesr’
`12.4138.-'2El11 E|215:53 PM
`
`lO move beyond me role or connectivity provider, Lars can exploit tne L1-’ intelligence in
`their High Leverage Network” [Hl_.N) to add services and enable applications that help
`enterprises take advantage of smart sensors:
`. Services could include providing private or 113 virtual private networlzs (UPNS).
`o Applications could include unified communications that help enterprises increase
`employee productivity and